TW200723357A - Solvent recovery system - Google Patents

Solvent recovery system

Info

Publication number
TW200723357A
TW200723357A TW095139220A TW95139220A TW200723357A TW 200723357 A TW200723357 A TW 200723357A TW 095139220 A TW095139220 A TW 095139220A TW 95139220 A TW95139220 A TW 95139220A TW 200723357 A TW200723357 A TW 200723357A
Authority
TW
Taiwan
Prior art keywords
solvent
pipe
liquid feeding
feeding pump
reduced pressure
Prior art date
Application number
TW095139220A
Other languages
Chinese (zh)
Other versions
TWI328830B (en
Inventor
Yoshiaki Masu
Shinji Takase
Atsuo Kajima
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200723357A publication Critical patent/TW200723357A/en
Application granted granted Critical
Publication of TWI328830B publication Critical patent/TWI328830B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

To provide a system capable of efficiently recovering a solvent from a coated coating liquid and recycling it. A substrate throwing part 1, a coating apparatus 2 and a reduced pressure drying apparatus 3 are arranged in the order from an upstream side by a conveying line, and a gas discharge pipe 31 is led out from the reduced pressure drying apparatus 3. A vacuum pump 32 is provided on the pipe 31, a liquefaction trap 4 is arranged in a downstream side of the vacuum pump 32, and a solvent recovery pipe 5 is led out from the liquefaction trap 4. A liquid feeding pump 6 is provided on the pipe 5, a dehydration apparatus 7 and a filter 8 are arranged in a downstream side of the liquid feeding pump 6, and the solvent liquefied in the liquefaction trap 4 is fed to a buffer tank 9 by the liquid feeding pump 6. Further, the solvent accumulated in the buffer tank 9 is used for washing of a priming roller 22.
TW095139220A 2005-11-30 2006-10-24 Solvent recovery system TW200723357A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005346376A JP4901200B2 (en) 2005-11-30 2005-11-30 Solvent recovery system

Publications (2)

Publication Number Publication Date
TW200723357A true TW200723357A (en) 2007-06-16
TWI328830B TWI328830B (en) 2010-08-11

Family

ID=38124854

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139220A TW200723357A (en) 2005-11-30 2006-10-24 Solvent recovery system

Country Status (4)

Country Link
JP (1) JP4901200B2 (en)
KR (1) KR100826772B1 (en)
CN (1) CN1974459B (en)
TW (1) TW200723357A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4982306B2 (en) * 2007-09-05 2012-07-25 大日本スクリーン製造株式会社 Coating apparatus and coating method
CN102181070B (en) * 2011-03-25 2012-10-10 泰安赛露纤维素醚科技有限公司 Circulating evaporation process for cellulose ether producing solvent
JP5293790B2 (en) * 2011-09-22 2013-09-18 東京エレクトロン株式会社 Liquid processing apparatus, liquid processing method, and storage medium
JP5871646B2 (en) * 2012-02-13 2016-03-01 東レエンジニアリング株式会社 Vacuum drying apparatus and vacuum drying method
CN103406233B (en) * 2013-08-26 2015-11-25 深圳市华星光电技术有限公司 A kind of panel glue spreading apparatus
CN108692526B (en) * 2018-05-22 2019-09-24 深圳市华星光电半导体显示技术有限公司 Vacuum drying and solvent recovery unit
CN110843354A (en) * 2019-10-21 2020-02-28 深圳市华星光电技术有限公司 Vacuum drying device
CN116392830B (en) * 2023-04-11 2024-01-05 常州市范群干燥设备有限公司 Drying equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3408895B2 (en) * 1995-06-16 2003-05-19 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP2002038272A (en) * 2000-07-25 2002-02-06 Hitachi Kokusai Electric Inc Substrate treatment apparatus
EP1293589A3 (en) * 2001-09-17 2004-10-13 Nissan Motor Company, Limited Apparatus for pretreatment prior to painting
KR20030062143A (en) * 2002-01-16 2003-07-23 삼성전자주식회사 Method and apparatus for treating a processed article
JP3859211B2 (en) * 2002-05-28 2006-12-20 東京エレクトロン株式会社 Collection device, collection method, and decompression processing device
JP3877719B2 (en) * 2002-11-07 2007-02-07 東京応化工業株式会社 Pre-discharge device for slit coater

Also Published As

Publication number Publication date
JP4901200B2 (en) 2012-03-21
CN1974459A (en) 2007-06-06
JP2007152146A (en) 2007-06-21
TWI328830B (en) 2010-08-11
KR20070056939A (en) 2007-06-04
KR100826772B1 (en) 2008-04-30
CN1974459B (en) 2011-01-19

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