JP2007152146A - Solvent recovery system - Google Patents

Solvent recovery system Download PDF

Info

Publication number
JP2007152146A
JP2007152146A JP2005346376A JP2005346376A JP2007152146A JP 2007152146 A JP2007152146 A JP 2007152146A JP 2005346376 A JP2005346376 A JP 2005346376A JP 2005346376 A JP2005346376 A JP 2005346376A JP 2007152146 A JP2007152146 A JP 2007152146A
Authority
JP
Japan
Prior art keywords
solvent
coating
pipe
trap
recovery system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005346376A
Other languages
Japanese (ja)
Other versions
JP4901200B2 (en
Inventor
Yoshiaki Sho
芳明 升
Shinji Takase
真治 高瀬
Atsuo Kajima
淳生 楫間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2005346376A priority Critical patent/JP4901200B2/en
Priority to TW095139220A priority patent/TW200723357A/en
Priority to KR1020060107691A priority patent/KR100826772B1/en
Priority to CN2006101459778A priority patent/CN1974459B/en
Publication of JP2007152146A publication Critical patent/JP2007152146A/en
Application granted granted Critical
Publication of JP4901200B2 publication Critical patent/JP4901200B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment

Abstract

<P>PROBLEM TO BE SOLVED: To provide a system capable of efficiently recovering a solvent from a coated coating liquid and recycling it. <P>SOLUTION: A substrate throwing part 1, a coating apparatus 2 and a reduced pressure drying apparatus 3 are arranged in the order from an upstream side by a conveying line, and a gas discharge pipe 31 is led out from the reduced pressure drying apparatus 3. A vacuum pump 32 is provided on the pipe 31, a liquefaction trap 4 is arranged in a downstream side of the vacuum pump 32, and a solvent recovery pipe 5 is led out from the liquefaction trap 4. A liquid feeding pump 6 is provided on the pipe 5, a dehydration apparatus 7 and a filter 8 are arranged in a downstream side of the liquid feeding pump 6, and the solvent liquefied in the liquefaction trap 4 is fed to a buffer tank 9 by the liquid feeding pump 6. Further, the solvent accumulated in the buffer tank 9 is used for washing of a priming roller 22. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、基板に塗布された塗布液中の溶剤を回収して再利用する溶剤回収システムに関する。   The present invention relates to a solvent recovery system that recovers and reuses a solvent in a coating solution applied to a substrate.

ガラス基板等の基板の搬送ラインに沿って塗布装置と減圧乾燥装置を隣接して配置し、塗布装置によって基板表面に塗布した塗布液中の溶剤を減圧乾燥装置で揮発させて、塗布液を搬送の際に基板から落下しない程度まで乾燥させて次工程へ搬送するようにした被膜形成方法が特許文献1に開示されている。   A coating device and a vacuum drying device are placed adjacent to each other along a substrate transport line such as a glass substrate, and the coating solution applied to the substrate surface by the coating device is volatilized by the vacuum drying device to transport the coating solution. Patent Document 1 discloses a film forming method in which the film is dried to such an extent that it does not fall off from the substrate and conveyed to the next process.

また、減圧処理チャンバと真空ポンプとの間、つまり真空ポンプの上流側に溶剤回収装置を配置した構成が特許文献2には開示されている。
特許第2756596号公報 特開2005−85814号公報
Further, Patent Document 2 discloses a configuration in which a solvent recovery device is disposed between the vacuum processing chamber and the vacuum pump, that is, upstream of the vacuum pump.
Japanese Patent No. 2756596 JP 2005-85814 A

ところで、基板サイズが小さく塗布量も少ない場合でも、真空引きの配管中に溶剤が溜まることはあったが、基板サイズがメータ角になってくると、配管中に大量の揮発溶剤が溜まる。   By the way, even when the substrate size is small and the amount of application is small, the solvent may be accumulated in the evacuated piping, but when the substrate size becomes a meter angle, a large amount of volatile solvent is accumulated in the piping.

特許文献2では、減圧処理チャンバと真空ポンプとの間にトラップを設けることが考えられているが、真空ポンプの上流側にトラップを設けると、負荷が大きくなり真空引きに時間がかかってしまう。特に、減圧処理チャンバでは溶剤の 沸点よりも雰囲気温度を高めにして処理していることがあり、この場合には真空ポンプの上流側の配管中で結露し易い。   In Patent Document 2, it is considered that a trap is provided between the vacuum processing chamber and the vacuum pump. However, if a trap is provided on the upstream side of the vacuum pump, the load becomes large and it takes time for evacuation. In particular, the vacuum processing chamber may be processed at a higher atmospheric temperature than the boiling point of the solvent, and in this case, condensation is likely to occur in the piping upstream of the vacuum pump.

上述した点に鑑み、本発明は、配管内に溶剤が溜まることなく、塗布した塗布液から効率よく溶剤を回収し再利用できるシステムを提供するものである。   In view of the above-described points, the present invention provides a system that can efficiently recover and reuse a solvent from an applied coating solution without the solvent accumulating in a pipe.

本発明に係る溶剤回収システムは、塗布装置に隣接して減圧乾燥装置が配置され、減圧乾燥装置内で揮発した基板表面の塗布液中の溶剤を回収するものであって、減圧乾燥装置内を減圧せしめる真空ポンプの下流側に液化トラップが設けられ、この液化トラップで溶剤を液状化して回収する構成とする。   In the solvent recovery system according to the present invention, a vacuum drying apparatus is disposed adjacent to the coating apparatus, and the solvent in the coating liquid on the substrate surface volatilized in the vacuum drying apparatus is recovered. A liquefaction trap is provided on the downstream side of the vacuum pump to be depressurized, and the liquefaction trap is used to liquefy and recover the solvent.

本発明に係る溶剤回収システムによれば、減圧乾燥装置内を減圧せしめる真空ポンプの下流側に液化トラップが設けられ、この液化トラップで溶剤を液状化して回収する構成としているので、揮発した基板表面の塗布液中の溶剤は液化トラップにおいて冷やされて液状化される。これにより、揮発した溶剤が例えば減圧乾燥装置と真空ポンプとの間の配管中に溜まることもない。
また、真空ポンプの下流側に液化トラップが設けられているので、真空ポンプの負荷にならず、減圧乾燥装置を減圧するまでの時間が長くなることもない。
According to the solvent recovery system of the present invention, a liquefaction trap is provided on the downstream side of the vacuum pump for reducing the pressure in the vacuum drying apparatus, and the solvent is liquefied and recovered by this liquefaction trap. The solvent in the coating solution is cooled in a liquefaction trap and liquefied. Thereby, the volatilized solvent does not accumulate in the pipe between the vacuum drying apparatus and the vacuum pump, for example.
Further, since the liquefaction trap is provided on the downstream side of the vacuum pump, it does not become a load on the vacuum pump, and the time until the vacuum drying apparatus is depressurized does not increase.

前述した溶剤回収システムにおいて、塗布装置及び減圧乾燥装置が基板の搬送ラインに沿って配置され、又塗布装置には予備塗布用のプライミングローラ及びノズル洗浄部が付設され、液状化されて回収された溶剤が、送液ポンプによりプライミングローラ又はノズル洗浄部へ送られる構成とした場合は、プライミングローラ又はノズル洗浄部で回収した溶剤を再利用することが可能になり、洗浄液(新液)の利用を低減することが可能になる。
In the solvent recovery system described above, the coating device and the vacuum drying device are disposed along the substrate transfer line, and the coating device is provided with a priming roller for pre-coating and a nozzle cleaning unit, and is liquefied and recovered. When the solvent is sent to the priming roller or nozzle cleaning section by the liquid feed pump, the solvent recovered by the priming roller or nozzle cleaning section can be reused, and the use of cleaning liquid (new liquid) can be used. It becomes possible to reduce.

本発明によれば、配管中に揮発溶剤が溜まることもなく、今まで再利用されることのなかった塗布液中の溶剤を再利用することが可能になり、環境衛生上またコスト的にも有利な溶剤回収システムを実現することができる。   According to the present invention, the volatile solvent does not accumulate in the pipe, and the solvent in the coating liquid that has not been reused can be reused. An advantageous solvent recovery system can be realized.

以下に本発明の一実施の形態を添付図面に基づいて説明する。
図1は本発明に係る溶剤回収システムの一実施の形態を示す概略図、図2は溶剤の再利用箇所である塗布装置の概略側面図である。
本実施の形態の場合、図1に示すように、溶剤回収システムはガラス基板Wの搬送ラインに沿った被膜形成装置に適用されている。即ち、搬送ラインに沿って上流側から順に、基板投入部1、塗布装置2及び減圧乾燥装置3が配置されている。
An embodiment of the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is a schematic view showing an embodiment of a solvent recovery system according to the present invention, and FIG. 2 is a schematic side view of a coating apparatus as a solvent reuse point.
In the case of the present embodiment, as shown in FIG. 1, the solvent recovery system is applied to a film forming apparatus along the conveyance line of the glass substrate W. That is, the substrate loading unit 1, the coating device 2, and the vacuum drying device 3 are arranged in this order from the upstream side along the transport line.

塗布装置2では、図2に示すように、基板Wの表面に一定幅で塗布液を塗布するスリットノズル21が配置され、後述するスリットノズル21の予備塗布用のプライミングローラ22が配置されている。この塗布装置2には、ノズル洗浄部23、ディップ槽24も配置されている。   In the coating apparatus 2, as shown in FIG. 2, a slit nozzle 21 for coating a coating liquid with a constant width is disposed on the surface of the substrate W, and a priming roller 22 for preliminary coating of the slit nozzle 21 described later is disposed. . The coating device 2 is also provided with a nozzle cleaning unit 23 and a dip tank 24.

減圧乾燥装置3からは排気用の配管31が導出され、この配管31に真空ポンプ32が配置されている。   An exhaust pipe 31 is led out from the vacuum drying apparatus 3, and a vacuum pump 32 is disposed in the pipe 31.

そして本実施の形態においては特に、この真空ポンプ32からの配管33に液化トラップ4が設けられている。
液化トラップ4は、具体的に、減圧乾燥装置3と真空ポンプ32との間の配管31ではなく、真空ポンプ32の下流側、つまり真空ポンプ32よりも排気側に設けられている。この理由としては、真空ポンプ32の負荷にならず効率よく排気が行えること。また、真空ホンプ32後に溶剤は気体から液体へ戻ることがあり配管33内に滞留してしまうこと。また、滞留しない場合でも液体が工場排気側へ流れてしまうこと等が考えられ、これらの問題を防ぐことができるためである。
In the present embodiment, the liquefaction trap 4 is provided in the pipe 33 from the vacuum pump 32.
Specifically, the liquefaction trap 4 is provided not on the piping 31 between the vacuum drying apparatus 3 and the vacuum pump 32 but on the downstream side of the vacuum pump 32, that is, on the exhaust side of the vacuum pump 32. The reason is that the vacuum pump 32 can be efficiently exhausted without being loaded. In addition, the solvent may return from the gas to the liquid after the vacuum pump 32 and stay in the pipe 33. Further, it is conceivable that the liquid flows to the factory exhaust side even when it does not stay, and these problems can be prevented.

液化トラップ4は冷却機構を備えている。この冷却機構は、図3に示すように、例えば、冷却水が供給される配管(冷却管)35が液化トラップ本体(タンク)内に外部より導かれた構成である。なお、液化トラップ本体には、液状化された溶剤量を外から目視で確認できるような機能を有している。34は工場排気へつながる排気管である。
このような構成により、液化トラップ本体内を冷却させて低い温度にすることが可能になる。これにより、配管33を通じて真空ポンプ32より液化トラップ4内へと入ってきた揮発溶剤は冷却され液状化される。
The liquefaction trap 4 has a cooling mechanism. As shown in FIG. 3, the cooling mechanism has a configuration in which, for example, a pipe (cooling pipe) 35 to which cooling water is supplied is led from the outside into the liquefaction trap body (tank). The liquefaction trap body has a function that allows the amount of liquefied solvent to be visually confirmed from the outside. Reference numeral 34 denotes an exhaust pipe connected to factory exhaust.
With such a configuration, the inside of the liquefaction trap body can be cooled to a low temperature. As a result, the volatile solvent that has entered the liquefaction trap 4 from the vacuum pump 32 through the pipe 33 is cooled and liquefied.

他の実施の形態としては、図示しないが、液化トラップ本体の外部に密着するようにして冷却水が流れるウォータージャケットが設けられ、このジャケットに冷却水を供給する配管を液化トラップ4本体内に導いて冷却管とし、この冷却管に吸熱用のフィンを設けた構成が考えられる。これにより液化トラップ本体内の冷却効果を一層高めることが可能になる。   As another embodiment, although not shown, a water jacket through which cooling water flows so as to be in close contact with the outside of the liquefaction trap body is provided, and a pipe for supplying cooling water to the jacket is led into the liquefaction trap 4 body. A configuration in which a cooling pipe is provided and a heat-absorbing fin is provided on the cooling pipe is conceivable. Thereby, the cooling effect in the liquefied trap body can be further enhanced.

なお、冷却管内の抵抗値や冷却管の長さを調整することによっても冷却効果を一層高めることが可能になる。   The cooling effect can be further enhanced by adjusting the resistance value in the cooling pipe and the length of the cooling pipe.

なお、減圧乾燥装置3と真空ポンプ32との間の配管31内は、高真空になっているため揮発溶剤は液状化しない。液状化は真空ポンプ32よりも液化トラップ4側で生じ、排気トラップ4本体内において空気の温度が低くなった際に生じる。   In addition, since the inside of the piping 31 between the reduced pressure drying apparatus 3 and the vacuum pump 32 is high vacuum, the volatile solvent is not liquefied. The liquefaction occurs on the liquefaction trap 4 side of the vacuum pump 32 and occurs when the temperature of the air is lowered in the exhaust trap 4 body.

排気トラップ4からは溶剤回収用の配管5が導出され、この配管5には送液ポンプ6が設けられ、この送液ポンプ6の下流側には脱水装置7及びフィルタ8が配置されている。そして、上述した構成の液化トラップ4において液状化された溶剤は、送液ポンプ6によってバッファタンク9へ送られ、バッファタンク9に溜められた溶剤は、図2に示したような、プライミングローラ22の洗浄やノズル洗浄部23に用いられる。   A pipe 5 for solvent recovery is led out from the exhaust trap 4, a liquid feed pump 6 is provided in the pipe 5, and a dehydrator 7 and a filter 8 are disposed downstream of the liquid feed pump 6. The solvent liquefied in the liquefaction trap 4 having the above-described configuration is sent to the buffer tank 9 by the liquid feed pump 6, and the solvent stored in the buffer tank 9 is the priming roller 22 as shown in FIG. Used for the cleaning of the nozzles and the nozzle cleaning unit 23.

即ち、プライミングローラ22は、図4の拡大図に示すように、洗浄液が貯蔵される洗浄槽24内に配置されている。洗浄槽24を覆う一方の蓋25には循環する洗浄液を噴出する循環液シャワーノズル26が設けられ、他方の蓋27には新液シャワーノズル28や乾燥ガスを噴出するノズル29が設けら、これら循環液シャワーノズル26及び新液シャワーノズル28の下方にはプライミングローラ22の表面に接触するスキージ30が設けられている。   That is, as shown in the enlarged view of FIG. 4, the priming roller 22 is disposed in the cleaning tank 24 in which the cleaning liquid is stored. One lid 25 covering the cleaning tank 24 is provided with a circulating liquid shower nozzle 26 for ejecting circulating cleaning liquid, and the other lid 27 is provided with a new liquid shower nozzle 28 and a nozzle 29 for ejecting dry gas. A squeegee 30 that contacts the surface of the priming roller 22 is provided below the circulating liquid shower nozzle 26 and the new liquid shower nozzle 28.

このプリディスペンス部23では、例えば塗布液が付着したプライミングローラ22が回転すると、循環液シャワーノズル26よりプライミングローラ22の表面に洗浄液が供給され、スキージ30によって頑固な付着物がそぎ落とされる。そして最後にプライミングローラ22の表面が新液シャワーノズル28より供給される洗浄液できれいに洗い流される。この後は、乾燥ガス噴出ノズル29からプライミングローラ22に乾燥ガスが吹き付けられ、洗浄液が吹き飛ばされてプライミングローラ22表面が乾燥される。
本実施の形態においては、バッファタンク9へと回収された溶剤が、例えば循環液シャワーノズル26から噴出される洗浄液として使用される。これによりプライミングローラ22には新たな洗浄液を用いずに済み洗浄液の削減につながる。
In the pre-dispensing unit 23, for example, when the priming roller 22 to which the coating liquid is attached rotates, the cleaning liquid is supplied to the surface of the priming roller 22 from the circulating liquid shower nozzle 26, and the squeegee 30 removes stubborn deposits. Finally, the surface of the priming roller 22 is washed away with the cleaning liquid supplied from the new liquid shower nozzle 28. Thereafter, the dry gas is blown from the dry gas jet nozzle 29 to the priming roller 22, and the cleaning liquid is blown off to dry the surface of the priming roller 22.
In the present embodiment, the solvent recovered into the buffer tank 9 is used as a cleaning liquid ejected from the circulating liquid shower nozzle 26, for example. This eliminates the need for using a new cleaning liquid for the priming roller 22 and leads to a reduction in the cleaning liquid.

また、ノズル洗浄部24は、図5の拡大図に示すように、図示しないレールに係合するプレート36上に、上ブロック37と下ブロック38とからなる洗浄用ブロック39が設けられた構成である。上ブロック37間には、拭き取り部材40が挟まれており、この拭き取り部材40に向かっては洗浄液記供給部から通じる開口41が形成されている。 Further, as shown in the enlarged view of FIG. 5, the nozzle cleaning unit 24 has a configuration in which a cleaning block 39 including an upper block 37 and a lower block 38 is provided on a plate 36 that engages with a rail (not shown). is there. A wiping member 40 is sandwiched between the upper blocks 37, and an opening 41 is formed toward the wiping member 40 from the cleaning liquid supply unit.

このノズル洗浄部24では、洗浄液供給部の開口41よりスリットノズル21の傾斜面42に洗浄液を供給しながら、図示しない駆動装置にてプレートをスリットノズル21の長手方向に沿って移動させ、拭き取り部材40によりスリットノズル21の吐出口に付着した塗布液を拭き取るようにして洗浄を行っている。
本実施の形態においては、バッファタンク9へと回収された溶剤が、洗浄液供給部の開口41より傾斜面42に供給される洗浄液として用いられる。これによりプライミングローラ22の場合と同様にノズル洗浄部23においても新たな洗浄液を用いずに済み洗浄液の削減につながる。
In this nozzle cleaning section 24, while supplying the cleaning liquid to the inclined surface 42 of the slit nozzle 21 from the opening 41 of the cleaning liquid supply section, the plate is moved along the longitudinal direction of the slit nozzle 21 by a driving device (not shown), and the wiping member Cleaning is performed by wiping the coating liquid adhering to the discharge port of the slit nozzle 21 by 40.
In the present embodiment, the solvent recovered to the buffer tank 9 is used as the cleaning liquid supplied to the inclined surface 42 from the opening 41 of the cleaning liquid supply unit. As a result, as in the case of the priming roller 22, the nozzle cleaning unit 23 does not need to use a new cleaning liquid, leading to a reduction in cleaning liquid.

脱水装置7は回収した溶剤中に含まれた水分を取り除くために用いるものである。この脱水装置7は必要に応じて設けることができる。
また、フィルタ8は回収した溶剤を濾過してごみ等を除去するために用いるものである。このフィルタ8も必要に応じて設けることができる。
The dehydrator 7 is used to remove moisture contained in the recovered solvent. The dehydrator 7 can be provided as necessary.
The filter 8 is used for filtering the collected solvent to remove dust and the like. This filter 8 can also be provided as needed.

このように、本実施の形態の溶剤回収システムによれば、配管31や配管33内で揮発溶剤が溜まることもなく、また減圧に要する時間も短縮でき、揮発溶剤を液化トラップ4で冷却して液状化させることができる。これにより、液状化された溶剤をプライミングローラ22やノズル洗浄部23に再利用することが可能になる。   As described above, according to the solvent recovery system of the present embodiment, the volatile solvent does not accumulate in the pipe 31 and the pipe 33 and the time required for decompression can be shortened. The volatile solvent is cooled by the liquefaction trap 4. It can be liquefied. Thereby, the liquefied solvent can be reused for the priming roller 22 and the nozzle cleaning unit 23.

次に、溶剤回収の具体的な実施例を説明する。
(実施例1)
塗布液:プロピレンモノメチルエーテルアセテート(PGMEA)
塗布量:100cc
減圧到達圧:66Pa
基板サイズ:1100×1250mm
上記の条件にて、20枚連続(1枚あたり100cc)塗布し、塗布後に液化トラップから捕集した溶剤を回収した。その結果、1.44kgであった。
PGMEAの比重は0.965であるので、塗布重量は100×0.965×20=1.93kgである。従って、回収率は1.44/1.93=75%
であった。
Next, specific examples of solvent recovery will be described.
Example 1
Coating solution: Propylene monomethyl ether acetate (PGMEA)
Application amount: 100cc
Reduced pressure: 66 Pa
Substrate size: 1100 × 1250mm
Under the above conditions, 20 sheets were continuously applied (100 cc per sheet), and the solvent collected from the liquefaction trap after application was recovered. As a result, it was 1.44 kg.
Since the specific gravity of PGMEA is 0.965, the coating weight is 100 × 0.965 × 20 = 1.93 kg. Therefore, the recovery rate is 1.44 / 1.93 = 75%.
Met.

(実施例2)
塗布液:3−メトキシブチルアセテート(MA:比重0.956)
プロピレンモノメチルエーテルアセテート(PGMEA:比重0.965)
プロピレンモノメチルエーテル(PGME:比重0.9234)
上記の3種の溶剤を1:1:1で混合した。
塗布量:99cc
減圧到達圧:66Pa
基板サイズ:1100×1250mm
上記の条件にて、20枚連続(1枚あたり99cc)塗布し、塗布後に液化トラップから捕集した溶剤を回収した。その結果、1.34kgであった。
溶剤の平均比重は0.948であるので、塗布重量は99×0.948×20=1.89kgである。従って、回収率は1.34/1.89=70%
であった。
(Example 2)
Coating solution: 3-methoxybutyl acetate (MA: specific gravity 0.956)
Propylene monomethyl ether acetate (PGMEA: specific gravity 0.965)
Propylene monomethyl ether (PGME: specific gravity 0.9234)
The above three solvents were mixed 1: 1: 1.
Application amount: 99cc
Reduced pressure: 66 Pa
Substrate size: 1100 × 1250mm
Under the above conditions, 20 sheets were continuously applied (99 cc per sheet), and the solvent collected from the liquefaction trap after the application was recovered. As a result, it was 1.34 kg.
Since the average specific gravity of the solvent is 0.948, the coating weight is 99 × 0.948 × 20 = 1.89 kg. Therefore, the recovery rate is 1.34 / 1.89 = 70%
Met.

(実施例3)
塗布液: ポジ型レジスト(TFR-6000PM:東京応化工業製)
塗布量:99cc
減圧到達圧:66Pa
基板サイズ:1100×1250mm
上記の条件にて、10枚連続(1枚あたり99cc)塗布し、塗布後に液化トラップから捕集した溶剤を回収した。その結果、0.56kgであった。
溶剤の平均比重は0.965、塗布液中の固形分濃度は12.5%であるので、溶剤(PGMEA)の塗布重量は99×0.956×10×(1−0.125)=0.84kgである。従って、回収率は0.56/0.84=67%であった。
(Example 3)
Coating solution: Positive resist (TFR-6000PM: manufactured by Tokyo Ohka Kogyo Co., Ltd.)
Application amount: 99cc
Reduced pressure: 66 Pa
Substrate size: 1100 × 1250mm
Under the above conditions, 10 sheets were continuously applied (99 cc per sheet), and the solvent collected from the liquefaction trap after the application was recovered. As a result, it was 0.56 kg.
Since the average specific gravity of the solvent is 0.965 and the solid content concentration in the coating solution is 12.5%, the coating weight of the solvent (PGMEA) is 99 × 0.956 × 10 × (1−0.125) = 0. .84 kg. Therefore, the recovery rate was 0.56 / 0.84 = 67%.

このように、液化トラップ4を設けたことにより、それぞれの実施例において揮発溶剤の回収率が高くなっていることが分かる。   Thus, it can be seen that by providing the liquefaction trap 4, the recovery rate of the volatile solvent is high in each example.

上述した実施の形態では、回収した溶剤をプライミングローラ22やノズル洗浄部に再利用する場合を説明したが、これ以外にもレジストの粘度調整に使用したり、塗布液として使用することにも利用できる。
この際、必要があれば回収した溶剤に新液を加えることも可能である。この場合は、回収システム中に新液供給装置(手段)を加えることにより可能である。
In the above-described embodiment, the case where the recovered solvent is reused for the priming roller 22 and the nozzle cleaning unit has been described. However, in addition to this, the recovered solvent is used for adjusting the viscosity of the resist or used as a coating liquid. it can.
At this time, if necessary, a new solution can be added to the recovered solvent. In this case, it is possible by adding a new liquid supply device (means) in the recovery system.

なお、本発明は、基板サイズが大型化してきた際により効果的である。すなわち、基板サイズが大型化するに伴い減圧乾燥装置で揮発する溶剤量も多くなり、溶剤の回収率が向上するためである。   The present invention is more effective when the substrate size is increased. That is, as the substrate size increases, the amount of solvent that volatilizes in the reduced pressure drying apparatus increases, and the solvent recovery rate improves.

また、本発明は上述の実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲でその他様々な構成が取り得る。   Further, the present invention is not limited to the above-described embodiment, and various other configurations can be taken without departing from the gist of the present invention.

本発明に係る溶剤回収システムの一実施の形態を示す概略図。1 is a schematic diagram showing an embodiment of a solvent recovery system according to the present invention. 溶剤の再利用箇所である塗布装置の一実施の形態を示す概略側面図。The schematic side view which shows one Embodiment of the coating device which is a reuse location of a solvent. 液化トラップの一実施の形態を示す概略構成図。The schematic block diagram which shows one Embodiment of a liquefaction trap. プライミングローラの概略構成図(拡大図)。The schematic block diagram (enlarged view) of a priming roller. 洗浄部の概略構成図(拡大図)。Schematic block diagram (enlarged view) of the cleaning unit.

符号の説明Explanation of symbols

1…基板投入部、2…塗布装置、3…減圧乾燥装置、4…液化トラップ、5…溶剤回収用の配管、6…送液ポンプ、7…脱水装置、8…フィルタ、9…バッファタンク、21…スリットノズル、22…プライミングローラ、23…ノズル洗浄部、24…ディップ槽、25,27…蓋、26…循環液シャワーノズル、28…新液シャワーノズル、29…乾燥ガスを噴出するノズル、30…スキージ、31…排気用の配管、32…真空ポンプ、33…真空ポンプと液化トラップをつなぐ配管、34…液化トラップからの排気管、35…冷却管、36…プレート、37…上ブロック、38…下ブロック、39…洗浄用ブロック、40…拭き取り部材、41…開口、42…スリットノズルの傾斜面
DESCRIPTION OF SYMBOLS 1 ... Substrate injection | throwing-in part, 2 ... Coating apparatus, 3 ... Vacuum drying apparatus, 4 ... Liquefaction trap, 5 ... Piping for solvent collection | recovery, 6 ... Liquid feed pump, 7 ... Dehydration apparatus, 8 ... Filter, 9 ... Buffer tank, DESCRIPTION OF SYMBOLS 21 ... Slit nozzle, 22 ... Priming roller, 23 ... Nozzle washing part, 24 ... Dip tank, 25, 27 ... Cover, 26 ... Circulating fluid shower nozzle, 28 ... New liquid shower nozzle, 29 ... Nozzle which ejects dry gas, 30 ... Squeegee, 31 ... Exhaust pipe, 32 ... Vacuum pump, 33 ... Pipe connecting the vacuum pump and liquefaction trap, 34 ... Exhaust pipe from liquefaction trap, 35 ... Cooling pipe, 36 ... Plate, 37 ... Upper block, 38 ... lower block, 39 ... cleaning block, 40 ... wiping member, 41 ... opening, 42 ... inclined surface of slit nozzle

Claims (3)

塗布装置に近傍して減圧乾燥装置が配置され、前記減圧乾燥装置内で揮発した基板表面の塗布液中の溶剤を回収する溶剤回収システムであって、
前記減圧乾燥装置内を減圧させる真空ポンプの下流側に液化トラップが設けられ、該液化トラップで前記溶剤を液状化して回収することを特徴とする溶剤回収システム。
A solvent recovery system in which a vacuum drying apparatus is arranged in the vicinity of the coating apparatus, and recovers the solvent in the coating liquid on the substrate surface volatilized in the vacuum drying apparatus,
A solvent recovery system, wherein a liquefaction trap is provided on the downstream side of a vacuum pump for reducing the pressure in the vacuum drying apparatus, and the solvent is liquefied and recovered by the liquefaction trap.
請求項1に記載の溶剤回収システムにおいて、前記液化トラップで液状化された溶剤が送液ポンプにて再利用箇所に送られる構成とされていることを特徴とする溶剤回収システム。 2. The solvent recovery system according to claim 1, wherein the solvent liquefied by the liquefaction trap is sent to a reuse location by a liquid feed pump. 請求項1に記載の溶剤回収システムにおいて、前記塗布装置には予備塗布用のプライミングローラ及びノズル洗浄部が付設され、前記液状化されて回収された溶剤が、送液ポンプにより前記プライミングローラ又はノズル洗浄部へ送られることを特徴とする溶剤回収システム。


2. The solvent recovery system according to claim 1, wherein the coating device is provided with a priming roller for pre-coating and a nozzle cleaning unit, and the liquefied and recovered solvent is supplied to the priming roller or nozzle by a liquid feed pump. A solvent recovery system that is sent to a cleaning section.


JP2005346376A 2005-11-30 2005-11-30 Solvent recovery system Active JP4901200B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005346376A JP4901200B2 (en) 2005-11-30 2005-11-30 Solvent recovery system
TW095139220A TW200723357A (en) 2005-11-30 2006-10-24 Solvent recovery system
KR1020060107691A KR100826772B1 (en) 2005-11-30 2006-11-02 Solvent collection system
CN2006101459778A CN1974459B (en) 2005-11-30 2006-11-28 Solution recovery system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005346376A JP4901200B2 (en) 2005-11-30 2005-11-30 Solvent recovery system

Publications (2)

Publication Number Publication Date
JP2007152146A true JP2007152146A (en) 2007-06-21
JP4901200B2 JP4901200B2 (en) 2012-03-21

Family

ID=38124854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005346376A Active JP4901200B2 (en) 2005-11-30 2005-11-30 Solvent recovery system

Country Status (4)

Country Link
JP (1) JP4901200B2 (en)
KR (1) KR100826772B1 (en)
CN (1) CN1974459B (en)
TW (1) TW200723357A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009061380A (en) * 2007-09-05 2009-03-26 Dainippon Screen Mfg Co Ltd Coating device and coating method
CN102181070A (en) * 2011-03-25 2011-09-14 泰安赛露纤维素醚科技有限公司 Circulating evaporation process for cellulose ether producing solvent
JP2012060137A (en) * 2011-09-22 2012-03-22 Tokyo Electron Ltd Liquid processing device, liquid processing method, and storage medium
CN103240215A (en) * 2012-02-13 2013-08-14 东丽工程株式会社 Decompression drying device and vacuum drying method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103406233B (en) * 2013-08-26 2015-11-25 深圳市华星光电技术有限公司 A kind of panel glue spreading apparatus
CN108692526B (en) * 2018-05-22 2019-09-24 深圳市华星光电半导体显示技术有限公司 Vacuum drying and solvent recovery unit
CN110843354A (en) * 2019-10-21 2020-02-28 深圳市华星光电技术有限公司 Vacuum drying device
CN116392830B (en) * 2023-04-11 2024-01-05 常州市范群干燥设备有限公司 Drying equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH091035A (en) * 1995-06-16 1997-01-07 Dainippon Screen Mfg Co Ltd Base sheet processing apparatus
JP2002038272A (en) * 2000-07-25 2002-02-06 Hitachi Kokusai Electric Inc Substrate treatment apparatus
JP2003340347A (en) * 2002-05-28 2003-12-02 Tokyo Electron Ltd Trapping device, trapping method and vacuum treating device
JP2004167476A (en) * 2002-11-07 2004-06-17 Tokyo Ohka Kogyo Co Ltd Spare discharge device of slit coater

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1293589A3 (en) * 2001-09-17 2004-10-13 Nissan Motor Company, Limited Apparatus for pretreatment prior to painting
KR20030062143A (en) * 2002-01-16 2003-07-23 삼성전자주식회사 Method and apparatus for treating a processed article

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH091035A (en) * 1995-06-16 1997-01-07 Dainippon Screen Mfg Co Ltd Base sheet processing apparatus
JP2002038272A (en) * 2000-07-25 2002-02-06 Hitachi Kokusai Electric Inc Substrate treatment apparatus
JP2003340347A (en) * 2002-05-28 2003-12-02 Tokyo Electron Ltd Trapping device, trapping method and vacuum treating device
JP2004167476A (en) * 2002-11-07 2004-06-17 Tokyo Ohka Kogyo Co Ltd Spare discharge device of slit coater

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009061380A (en) * 2007-09-05 2009-03-26 Dainippon Screen Mfg Co Ltd Coating device and coating method
CN102181070A (en) * 2011-03-25 2011-09-14 泰安赛露纤维素醚科技有限公司 Circulating evaporation process for cellulose ether producing solvent
JP2012060137A (en) * 2011-09-22 2012-03-22 Tokyo Electron Ltd Liquid processing device, liquid processing method, and storage medium
CN103240215A (en) * 2012-02-13 2013-08-14 东丽工程株式会社 Decompression drying device and vacuum drying method
CN103240215B (en) * 2012-02-13 2016-05-11 东丽工程株式会社 Decompression dry device and drying under reduced pressure method

Also Published As

Publication number Publication date
KR100826772B1 (en) 2008-04-30
JP4901200B2 (en) 2012-03-21
KR20070056939A (en) 2007-06-04
TWI328830B (en) 2010-08-11
TW200723357A (en) 2007-06-16
CN1974459B (en) 2011-01-19
CN1974459A (en) 2007-06-06

Similar Documents

Publication Publication Date Title
JP4901200B2 (en) Solvent recovery system
JP4878900B2 (en) Substrate processing equipment
JP5340329B2 (en) Coating apparatus and inkjet recording apparatus
JP2006278606A (en) Apparatus and method for processing substrate
US20080092925A1 (en) Removing photoresist from substrates by means of treatment liquid, and processing treatement liquid with ozone
JP4817802B2 (en) Transport processing device
JP2008277681A (en) Substrate processing apparatus
JP2013146727A (en) Coating apparatus
JP2004049949A (en) Drier
TWI275141B (en) Substrate processor
JP5423555B2 (en) Washing and drying method and washing and drying apparatus
JP2006019525A (en) Substrate processing device
TWI343842B (en)
JP2009136732A (en) Cleaning equipment, method of recovering cleaning liquid, and semiconductor manufacturing device
JP2007317802A (en) Apparatus and method of dry-processing substrate
KR20090108857A (en) Apparatus for cleaning substrate and cleaning system having thereof
JP2008280580A (en) Method for reclaiming treatment liquid and method for recovering metal contained in the treatment liquid
KR101387983B1 (en) Cleaning device of digital printing machine
JP4324517B2 (en) Substrate processing equipment
JPH07308642A (en) Apparatus for drying surface of substrate
JP2007109841A (en) Method of cleaning reflow-soldering device, and reflow-soldering device
JP2021049651A5 (en)
JP2005064312A (en) Substrate processing method and substrate processor
CN114179523B (en) Ink jet printing apparatus
JP4291581B2 (en) Steam processing equipment

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080812

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110106

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110111

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20111227

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20111227

R150 Certificate of patent or registration of utility model

Ref document number: 4901200

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150113

Year of fee payment: 3

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250