TWI314759B - Rf grounding of cathode in process chamber - Google Patents

Rf grounding of cathode in process chamber Download PDF

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Publication number
TWI314759B
TWI314759B TW094125453A TW94125453A TWI314759B TW I314759 B TWI314759 B TW I314759B TW 094125453 A TW094125453 A TW 094125453A TW 94125453 A TW94125453 A TW 94125453A TW I314759 B TWI314759 B TW I314759B
Authority
TW
Taiwan
Prior art keywords
substrate support
chamber wall
process chamber
substrate
bendable
Prior art date
Application number
TW094125453A
Other languages
English (en)
Chinese (zh)
Other versions
TW200611333A (en
Inventor
John M White
Robin L Tiner
Beom Soo Park
Wendell T Blonigan
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200611333A publication Critical patent/TW200611333A/zh
Application granted granted Critical
Publication of TWI314759B publication Critical patent/TWI314759B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
TW094125453A 2004-09-21 2005-07-27 Rf grounding of cathode in process chamber TWI314759B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/946,403 US7534301B2 (en) 2004-09-21 2004-09-21 RF grounding of cathode in process chamber

Publications (2)

Publication Number Publication Date
TW200611333A TW200611333A (en) 2006-04-01
TWI314759B true TWI314759B (en) 2009-09-11

Family

ID=36072681

Family Applications (2)

Application Number Title Priority Date Filing Date
TW094125453A TWI314759B (en) 2004-09-21 2005-07-27 Rf grounding of cathode in process chamber
TW098113783A TWI392017B (zh) 2004-09-21 2005-07-27 製程處理室中陰極之ｒｆ接地

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW098113783A TWI392017B (zh) 2004-09-21 2005-07-27 製程處理室中陰極之ｒｆ接地

Country Status (5)

Country Link
US (2) US7534301B2 (enExample)
JP (2) JP5033319B2 (enExample)
KR (2) KR101441892B1 (enExample)
CN (2) CN102324367B (enExample)
TW (2) TWI314759B (enExample)

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Also Published As

Publication number Publication date
JP2006104575A (ja) 2006-04-20
KR101441892B1 (ko) 2014-09-19
KR20060051437A (ko) 2006-05-19
JP5033319B2 (ja) 2012-09-26
US7534301B2 (en) 2009-05-19
CN1752281A (zh) 2006-03-29
TWI392017B (zh) 2013-04-01
KR101185908B1 (ko) 2012-09-25
JP5037560B2 (ja) 2012-09-26
US20090178617A1 (en) 2009-07-16
CN1752281B (zh) 2011-08-24
JP2009280913A (ja) 2009-12-03
KR20090057202A (ko) 2009-06-04
US20060060302A1 (en) 2006-03-23
CN102324367A (zh) 2012-01-18
TW200611333A (en) 2006-04-01
CN102324367B (zh) 2016-02-03
TW201001533A (en) 2010-01-01

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