TWI310325B - - Google Patents
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- Publication number
- TWI310325B TWI310325B TW095132456A TW95132456A TWI310325B TW I310325 B TWI310325 B TW I310325B TW 095132456 A TW095132456 A TW 095132456A TW 95132456 A TW95132456 A TW 95132456A TW I310325 B TWI310325 B TW I310325B
- Authority
- TW
- Taiwan
- Prior art keywords
- coating
- pigment
- coating device
- coating liquid
- conductive
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005325903A JP2007134487A (ja) | 2005-11-10 | 2005-11-10 | 塗布装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200718475A TW200718475A (en) | 2007-05-16 |
TWI310325B true TWI310325B (ja) | 2009-06-01 |
Family
ID=38082770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095132456A TW200718475A (en) | 2005-11-10 | 2006-09-01 | Coating applicator |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2007134487A (ja) |
KR (1) | KR100835161B1 (ja) |
CN (1) | CN1963670B (ja) |
TW (1) | TW200718475A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103487993A (zh) * | 2013-10-17 | 2014-01-01 | 深圳市华星光电技术有限公司 | 一种配向液喷嘴 |
CN109212907A (zh) * | 2018-11-05 | 2019-01-15 | 江苏博砚电子科技有限公司 | 一种制造黑色矩阵涂膜的方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06348023A (ja) * | 1993-06-03 | 1994-12-22 | Nippon Kayaku Co Ltd | 顔料を含むカラーフィルター用レジストの塗布方法 |
JP3363666B2 (ja) * | 1995-05-25 | 2003-01-08 | 大日本スクリーン製造株式会社 | 基板処理装置 |
KR100521701B1 (ko) * | 1996-11-27 | 2006-01-12 | 동경 엘렉트론 주식회사 | 도포막형성장치및도포막형성방법 |
JPH10328614A (ja) * | 1997-05-30 | 1998-12-15 | Mitsubishi Chem Corp | 着色レジストの塗布方法 |
JP2000291848A (ja) * | 1999-04-02 | 2000-10-20 | Toho Kasei Kk | 球状半導体用樹脂製チューブ |
JP2001066784A (ja) * | 1999-08-24 | 2001-03-16 | Toppan Printing Co Ltd | 感光性着色樹脂組成物用の吐出装置 |
JP2002177858A (ja) * | 2000-12-13 | 2002-06-25 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
TW569288B (en) * | 2001-06-19 | 2004-01-01 | Tokyo Electron Ltd | Substrate processing apparatus, liquid processing apparatus and liquid processing method |
JP3936556B2 (ja) * | 2001-06-22 | 2007-06-27 | 東京エレクトロン株式会社 | 可燃性流体用帯電防止フッ素樹脂チューブ |
JPWO2003081298A1 (ja) * | 2002-03-27 | 2005-07-28 | サカタインクス株式会社 | カラーフィルター用顔料分散レジスト組成物 |
JP2005236040A (ja) * | 2004-02-19 | 2005-09-02 | Sekisui Chem Co Ltd | 導電性微粒子の配置方法 |
-
2005
- 2005-11-10 JP JP2005325903A patent/JP2007134487A/ja active Pending
-
2006
- 2006-09-01 TW TW095132456A patent/TW200718475A/zh not_active IP Right Cessation
- 2006-11-10 KR KR1020060110841A patent/KR100835161B1/ko not_active IP Right Cessation
- 2006-11-10 CN CN2006101435256A patent/CN1963670B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1963670A (zh) | 2007-05-16 |
KR100835161B1 (ko) | 2008-06-04 |
TW200718475A (en) | 2007-05-16 |
CN1963670B (zh) | 2010-08-18 |
KR20070050385A (ko) | 2007-05-15 |
JP2007134487A (ja) | 2007-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |