TWI307931B - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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Publication number
TWI307931B
TWI307931B TW095109950A TW95109950A TWI307931B TW I307931 B TWI307931 B TW I307931B TW 095109950 A TW095109950 A TW 095109950A TW 95109950 A TW95109950 A TW 95109950A TW I307931 B TWI307931 B TW I307931B
Authority
TW
Taiwan
Prior art keywords
support pin
support
pin
substrate
processing apparatus
Prior art date
Application number
TW095109950A
Other languages
English (en)
Chinese (zh)
Other versions
TW200723431A (en
Inventor
Takashi Kakimura
Hiroshi Yamamoto
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200723431A publication Critical patent/TW200723431A/zh
Application granted granted Critical
Publication of TWI307931B publication Critical patent/TWI307931B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW095109950A 2005-04-26 2006-03-22 Substrate processing apparatus TWI307931B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005128175 2005-04-26
JP2006013493A JP4628964B2 (ja) 2005-04-26 2006-01-23 基板処理装置

Publications (2)

Publication Number Publication Date
TW200723431A TW200723431A (en) 2007-06-16
TWI307931B true TWI307931B (en) 2009-03-21

Family

ID=37553912

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095109950A TWI307931B (en) 2005-04-26 2006-03-22 Substrate processing apparatus

Country Status (3)

Country Link
JP (1) JP4628964B2 (ja)
KR (1) KR100722108B1 (ja)
TW (1) TWI307931B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101335639B1 (ko) * 2006-11-06 2013-12-03 삼성디스플레이 주식회사 레이저 결정화 장치 및 이를 이용한 실리콘 결정화 방법
JP5090079B2 (ja) * 2007-06-27 2012-12-05 大日本スクリーン製造株式会社 減圧乾燥装置
JP5044332B2 (ja) * 2007-09-04 2012-10-10 大日本スクリーン製造株式会社 処理装置
US7907289B2 (en) 2007-09-13 2011-03-15 Horiba, Ltd. Substrate measuring stage
JP5047859B2 (ja) * 2008-03-31 2012-10-10 住友重機械工業株式会社 リフトピンユニット及びそれを具備したｘｙステージ装置
JP5406475B2 (ja) * 2008-07-28 2014-02-05 大日本スクリーン製造株式会社 熱処理装置
KR101135355B1 (ko) * 2008-12-12 2012-04-16 엘아이지에이디피 주식회사 기판 리프트장치
JP5257699B2 (ja) * 2009-07-14 2013-08-07 ウシオ電機株式会社 露光装置
CN101794719B (zh) * 2010-03-23 2011-06-15 中国电子科技集团公司第二研究所 晶圆片的自动升降吸附机构
KR101697216B1 (ko) * 2012-08-13 2017-01-17 카와사키 주코교 카부시키 카이샤 판유리의 검사 유닛 및 제조 설비
KR102484356B1 (ko) * 2018-09-07 2023-01-04 한화정밀기계 주식회사 기판 클램프 장치
JP2021012944A (ja) * 2019-07-05 2021-02-04 東京エレクトロン株式会社 基板処理装置及び基板の受け渡し方法
CN111261573B (zh) * 2020-01-20 2024-02-27 京东方科技集团股份有限公司 支撑架、真空干燥装置、干燥系统、基板干燥方法
KR102588603B1 (ko) * 2020-09-23 2023-10-13 세메스 주식회사 리프트핀 어셈블리를 및 이를 갖는 기판 처리 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3881062B2 (ja) * 1996-08-14 2007-02-14 大日本スクリーン製造株式会社 基板保持機構および基板処理装置
JP2000237983A (ja) * 1999-02-22 2000-09-05 Hitachi Electronics Eng Co Ltd 基板チャック装置
EP1174910A3 (en) * 2000-07-20 2010-01-06 Applied Materials, Inc. Method and apparatus for dechucking a substrate
JP3775987B2 (ja) * 2000-12-26 2006-05-17 松下電器産業株式会社 プラズマ処理装置
JP2002246450A (ja) * 2001-02-20 2002-08-30 Nikon Corp 基板保持装置及び基板搬送方法
JP2002334817A (ja) * 2001-05-08 2002-11-22 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
JP2003133233A (ja) * 2001-10-23 2003-05-09 Hitachi Kokusai Electric Inc 基板処理装置
KR20030091301A (ko) * 2002-05-27 2003-12-03 삼성전자주식회사 반도체소자 제조설비의 웨이퍼 리프팅장치
KR100894045B1 (ko) * 2002-11-07 2009-04-20 삼성전자주식회사 로드락 챔버

Also Published As

Publication number Publication date
TW200723431A (en) 2007-06-16
KR20060112210A (ko) 2006-10-31
JP4628964B2 (ja) 2011-02-09
JP2006332587A (ja) 2006-12-07
KR100722108B1 (ko) 2007-05-25

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MM4A Annulment or lapse of patent due to non-payment of fees