TWI307931B - Substrate processing apparatus - Google Patents
Substrate processing apparatus Download PDFInfo
- Publication number
- TWI307931B TWI307931B TW095109950A TW95109950A TWI307931B TW I307931 B TWI307931 B TW I307931B TW 095109950 A TW095109950 A TW 095109950A TW 95109950 A TW95109950 A TW 95109950A TW I307931 B TWI307931 B TW I307931B
- Authority
- TW
- Taiwan
- Prior art keywords
- support pin
- support
- pin
- substrate
- processing apparatus
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005128175 | 2005-04-26 | ||
JP2006013493A JP4628964B2 (ja) | 2005-04-26 | 2006-01-23 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200723431A TW200723431A (en) | 2007-06-16 |
TWI307931B true TWI307931B (en) | 2009-03-21 |
Family
ID=37553912
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095109950A TWI307931B (en) | 2005-04-26 | 2006-03-22 | Substrate processing apparatus |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4628964B2 (ja) |
KR (1) | KR100722108B1 (ja) |
TW (1) | TWI307931B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101335639B1 (ko) * | 2006-11-06 | 2013-12-03 | 삼성디스플레이 주식회사 | 레이저 결정화 장치 및 이를 이용한 실리콘 결정화 방법 |
JP5090079B2 (ja) * | 2007-06-27 | 2012-12-05 | 大日本スクリーン製造株式会社 | 減圧乾燥装置 |
JP5044332B2 (ja) * | 2007-09-04 | 2012-10-10 | 大日本スクリーン製造株式会社 | 処理装置 |
US7907289B2 (en) | 2007-09-13 | 2011-03-15 | Horiba, Ltd. | Substrate measuring stage |
JP5047859B2 (ja) * | 2008-03-31 | 2012-10-10 | 住友重機械工業株式会社 | リフトピンユニット及びそれを具備したxyステージ装置 |
JP5406475B2 (ja) * | 2008-07-28 | 2014-02-05 | 大日本スクリーン製造株式会社 | 熱処理装置 |
KR101135355B1 (ko) * | 2008-12-12 | 2012-04-16 | 엘아이지에이디피 주식회사 | 기판 리프트장치 |
JP5257699B2 (ja) * | 2009-07-14 | 2013-08-07 | ウシオ電機株式会社 | 露光装置 |
CN101794719B (zh) * | 2010-03-23 | 2011-06-15 | 中国电子科技集团公司第二研究所 | 晶圆片的自动升降吸附机构 |
KR101697216B1 (ko) * | 2012-08-13 | 2017-01-17 | 카와사키 주코교 카부시키 카이샤 | 판유리의 검사 유닛 및 제조 설비 |
KR102484356B1 (ko) * | 2018-09-07 | 2023-01-04 | 한화정밀기계 주식회사 | 기판 클램프 장치 |
JP2021012944A (ja) * | 2019-07-05 | 2021-02-04 | 東京エレクトロン株式会社 | 基板処理装置及び基板の受け渡し方法 |
CN111261573B (zh) * | 2020-01-20 | 2024-02-27 | 京东方科技集团股份有限公司 | 支撑架、真空干燥装置、干燥系统、基板干燥方法 |
KR102588603B1 (ko) * | 2020-09-23 | 2023-10-13 | 세메스 주식회사 | 리프트핀 어셈블리를 및 이를 갖는 기판 처리 장치 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3881062B2 (ja) * | 1996-08-14 | 2007-02-14 | 大日本スクリーン製造株式会社 | 基板保持機構および基板処理装置 |
JP2000237983A (ja) * | 1999-02-22 | 2000-09-05 | Hitachi Electronics Eng Co Ltd | 基板チャック装置 |
EP1174910A3 (en) * | 2000-07-20 | 2010-01-06 | Applied Materials, Inc. | Method and apparatus for dechucking a substrate |
JP3775987B2 (ja) * | 2000-12-26 | 2006-05-17 | 松下電器産業株式会社 | プラズマ処理装置 |
JP2002246450A (ja) * | 2001-02-20 | 2002-08-30 | Nikon Corp | 基板保持装置及び基板搬送方法 |
JP2002334817A (ja) * | 2001-05-08 | 2002-11-22 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板 |
JP2003133233A (ja) * | 2001-10-23 | 2003-05-09 | Hitachi Kokusai Electric Inc | 基板処理装置 |
KR20030091301A (ko) * | 2002-05-27 | 2003-12-03 | 삼성전자주식회사 | 반도체소자 제조설비의 웨이퍼 리프팅장치 |
KR100894045B1 (ko) * | 2002-11-07 | 2009-04-20 | 삼성전자주식회사 | 로드락 챔버 |
-
2006
- 2006-01-23 JP JP2006013493A patent/JP4628964B2/ja not_active Expired - Fee Related
- 2006-03-22 TW TW095109950A patent/TWI307931B/zh not_active IP Right Cessation
- 2006-04-13 KR KR1020060033526A patent/KR100722108B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW200723431A (en) | 2007-06-16 |
KR20060112210A (ko) | 2006-10-31 |
JP4628964B2 (ja) | 2011-02-09 |
JP2006332587A (ja) | 2006-12-07 |
KR100722108B1 (ko) | 2007-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |