TWI307614B - Method for manufacturing flexible printed circuit board - Google Patents

Method for manufacturing flexible printed circuit board Download PDF

Info

Publication number
TWI307614B
TWI307614B TW095122380A TW95122380A TWI307614B TW I307614 B TWI307614 B TW I307614B TW 095122380 A TW095122380 A TW 095122380A TW 95122380 A TW95122380 A TW 95122380A TW I307614 B TWI307614 B TW I307614B
Authority
TW
Taiwan
Prior art keywords
film
fpcb
peripheral
circuit board
copper
Prior art date
Application number
TW095122380A
Other languages
English (en)
Chinese (zh)
Other versions
TW200704317A (en
Inventor
Yu-Yong Lee
Ki-Joon Park
Yoon-Hong Yang
Original Assignee
Dk Uil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dk Uil Co Ltd filed Critical Dk Uil Co Ltd
Publication of TW200704317A publication Critical patent/TW200704317A/zh
Application granted granted Critical
Publication of TWI307614B publication Critical patent/TWI307614B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW095122380A 2005-06-22 2006-06-22 Method for manufacturing flexible printed circuit board TWI307614B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050054171A KR100666282B1 (ko) 2005-06-22 2005-06-22 멀티 레이어 연성회로기판 제조방법

Publications (2)

Publication Number Publication Date
TW200704317A TW200704317A (en) 2007-01-16
TWI307614B true TWI307614B (en) 2009-03-11

Family

ID=37583941

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095122380A TWI307614B (en) 2005-06-22 2006-06-22 Method for manufacturing flexible printed circuit board

Country Status (4)

Country Link
JP (1) JP4218768B2 (ko)
KR (1) KR100666282B1 (ko)
CN (1) CN1886029A (ko)
TW (1) TWI307614B (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080295327A1 (en) * 2007-06-01 2008-12-04 3M Innovative Properties Company Flexible circuit
KR101009415B1 (ko) 2008-11-18 2011-01-19 삼성모바일디스플레이주식회사 플라스틱 기판을 구비한 전자장치 제조방법, 이에 의해 제조된 전자장치 및 상기 제조방법에 사용되는 장치
CN102301280B (zh) * 2008-12-23 2014-11-26 3M创新有限公司 卷到卷数字光刻法
KR101051857B1 (ko) * 2010-05-27 2011-07-25 우영관 Ｆｐｃ 제품에 부재 플레이트를 부착하는 방법
DE102011003570A1 (de) * 2011-02-03 2012-08-09 Robert Bosch Gmbh Elektrische Verbindung sowie Verfahren zur Herstellung einer elektrischen Verbindung
KR101180355B1 (ko) * 2012-02-21 2012-09-07 주식회사 비에이치 양면형 다층 구조의 연성인쇄회로기판 제조방법 및 이를 이용하여 제조된 양면형 다층 구조의 연성인쇄회로기판
CN103978516A (zh) * 2014-05-05 2014-08-13 厦门弘信电子科技股份有限公司 卷状柔性线路板的通孔冲孔工艺
CN105870319B (zh) * 2016-04-26 2019-03-05 贝骨新材料科技（上海）有限公司 一种长条状压电薄膜传感器卷对卷制造方法
JP6679082B1 (ja) * 2019-04-16 2020-04-15 山下マテリアル株式会社 フレキシブル配線板
KR102137278B1 (ko) * 2020-04-10 2020-07-23 김상봉 고속타발기 연동형 정밀 롤투롤 소재 연성회로기판 제조 방법
KR20210156005A (ko) * 2020-06-17 2021-12-24 주식회사 엘지에너지솔루션 연성인쇄회로기판의 제조 방법
KR20220028752A (ko) * 2020-08-31 2022-03-08 주식회사 두산 연성 인쇄회로기판의 제조방법 및 이에 의해 제조된 연성 인쇄회로기판
CN113438802B (zh) * 2021-07-27 2022-05-20 友达光电（苏州）有限公司 软性电路板与应用其的显示装置

Also Published As

Publication number Publication date
KR20060134475A (ko) 2006-12-28
JP2007005805A (ja) 2007-01-11
CN1886029A (zh) 2006-12-27
TW200704317A (en) 2007-01-16
KR100666282B1 (ko) 2007-01-09
JP4218768B2 (ja) 2009-02-04

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