CN1886029A - 柔性电路基板的制造方法 - Google Patents

柔性电路基板的制造方法 Download PDF

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Publication number
CN1886029A
CN1886029A CNA2006100938968A CN200610093896A CN1886029A CN 1886029 A CN1886029 A CN 1886029A CN A2006100938968 A CNA2006100938968 A CN A2006100938968A CN 200610093896 A CN200610093896 A CN 200610093896A CN 1886029 A CN1886029 A CN 1886029A
Authority
CN
China
Prior art keywords
copper foil
mode
spool
fpcb
outside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006100938968A
Other languages
English (en)
Chinese (zh)
Inventor
李愉镛
朴基浚
梁润弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DK Uil Co Ltd
Original Assignee
DK Uil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DK Uil Co Ltd filed Critical DK Uil Co Ltd
Publication of CN1886029A publication Critical patent/CN1886029A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CNA2006100938968A 2005-06-22 2006-06-22 柔性电路基板的制造方法 Pending CN1886029A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR54171/05 2005-06-22
KR1020050054171A KR100666282B1 (ko) 2005-06-22 2005-06-22 멀티 레이어 연성회로기판 제조방법

Publications (1)

Publication Number Publication Date
CN1886029A true CN1886029A (zh) 2006-12-27

Family

ID=37583941

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006100938968A Pending CN1886029A (zh) 2005-06-22 2006-06-22 柔性电路基板的制造方法

Country Status (4)

Country Link
JP (1) JP4218768B2 (ko)
KR (1) KR100666282B1 (ko)
CN (1) CN1886029A (ko)
TW (1) TWI307614B (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102301280A (zh) * 2008-12-23 2011-12-28 3M创新有限公司 卷到卷数字光刻法
CN102630130A (zh) * 2011-02-03 2012-08-08 罗伯特·博世有限公司 电气连接及用于建立电气连接的方法
CN103978516A (zh) * 2014-05-05 2014-08-13 厦门弘信电子科技股份有限公司 卷状柔性线路板的通孔冲孔工艺
CN105870319A (zh) * 2016-04-26 2016-08-17 贝骨新材料科技（上海）有限公司 一种长条状压电薄膜传感器卷对卷制造方法
CN113518504A (zh) * 2020-04-10 2021-10-19 金相奉 高速冲制机联动型精密卷对卷材料柔性电路板制造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080295327A1 (en) * 2007-06-01 2008-12-04 3M Innovative Properties Company Flexible circuit
KR101009415B1 (ko) 2008-11-18 2011-01-19 삼성모바일디스플레이주식회사 플라스틱 기판을 구비한 전자장치 제조방법, 이에 의해 제조된 전자장치 및 상기 제조방법에 사용되는 장치
KR101051857B1 (ko) * 2010-05-27 2011-07-25 우영관 Ｆｐｃ 제품에 부재 플레이트를 부착하는 방법
KR101180355B1 (ko) * 2012-02-21 2012-09-07 주식회사 비에이치 양면형 다층 구조의 연성인쇄회로기판 제조방법 및 이를 이용하여 제조된 양면형 다층 구조의 연성인쇄회로기판
JP6679082B1 (ja) * 2019-04-16 2020-04-15 山下マテリアル株式会社 フレキシブル配線板
KR20210156005A (ko) * 2020-06-17 2021-12-24 주식회사 엘지에너지솔루션 연성인쇄회로기판의 제조 방법
KR20220028752A (ko) * 2020-08-31 2022-03-08 주식회사 두산 연성 인쇄회로기판의 제조방법 및 이에 의해 제조된 연성 인쇄회로기판
CN113438802B (zh) * 2021-07-27 2022-05-20 友达光电（苏州）有限公司 软性电路板与应用其的显示装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102301280A (zh) * 2008-12-23 2011-12-28 3M创新有限公司 卷到卷数字光刻法
CN102301280B (zh) * 2008-12-23 2014-11-26 3M创新有限公司 卷到卷数字光刻法
CN102630130A (zh) * 2011-02-03 2012-08-08 罗伯特·博世有限公司 电气连接及用于建立电气连接的方法
CN102630130B (zh) * 2011-02-03 2016-11-23 罗伯特·博世有限公司 电气连接及用于建立电气连接的方法
CN103978516A (zh) * 2014-05-05 2014-08-13 厦门弘信电子科技股份有限公司 卷状柔性线路板的通孔冲孔工艺
CN105870319A (zh) * 2016-04-26 2016-08-17 贝骨新材料科技（上海）有限公司 一种长条状压电薄膜传感器卷对卷制造方法
CN113518504A (zh) * 2020-04-10 2021-10-19 金相奉 高速冲制机联动型精密卷对卷材料柔性电路板制造方法

Also Published As

Publication number Publication date
KR20060134475A (ko) 2006-12-28
JP2007005805A (ja) 2007-01-11
TWI307614B (en) 2009-03-11
TW200704317A (en) 2007-01-16
KR100666282B1 (ko) 2007-01-09
JP4218768B2 (ja) 2009-02-04

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
AD01 Patent right deemed abandoned

Effective date of abandoning: 20061227

C20 Patent right or utility model deemed to be abandoned or is abandoned