CN1886029A - Flexible circuit substrate manufacturing method - Google Patents
Flexible circuit substrate manufacturing method Download PDFInfo
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- CN1886029A CN1886029A CNA2006100938968A CN200610093896A CN1886029A CN 1886029 A CN1886029 A CN 1886029A CN A2006100938968 A CNA2006100938968 A CN A2006100938968A CN 200610093896 A CN200610093896 A CN 200610093896A CN 1886029 A CN1886029 A CN 1886029A
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- copper foil
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- spool
- fpcb
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a manufacture method which including the following steps: providing the first and second middle copper foil stacked film equipped with guide hole used for position sensor in the scroll-to-scroll mode respectively and performing pattern formation according to units, supplying and covering the first and the second middle covered layer film in the scroll-to-scroll mode, preparing respectively the first and the second middle FPCB; providing the first and second middle FPCB in the scroll-to-scroll mode, the upper and lower part of which provide the first and second exterior copper foil stacked film equipped with guide hole for position sensing in the scroll-to-scroll mode respectively, performing copper plating after performing partly adherence according to units and forming passed hole; covering respectively the first and the second exterior covered layer plate with opening area according to units, accomplishing the first and the second exterior FPCB.
Description
Technical field
The present invention relates to the manufacture method of flexible circuit board, more specifically relate to the manufacture method of following flexible circuit board, promptly, by following the tracks of with the position accurately that the sensing of bullport carries out while utilizing spool that the spool mode is carried out position sensing, and pattern can be formed the position, covering layer film and the bonding location that covers synusia, lead to the hole site or punch position etc. are aimed at fine, the transverse width of Copper Foil that will become the formation of copper foil lamination film is restricted to little width, and use directional light in when exposure, and, application has applied the glass mask of chromium pattern with guarantee fine pattern (Fine Pattern), and by reducing error rate, guarantee reliability, and realize the number of plies integrated etc. and that relatively reduce flexible circuit board.
Background technology
Usually, flexible circuit board (Flexible Printed Circuit Board) is to the copper foil lamination film (CCL of Cu film vapor deposition on PI film (PolyImide Film polyimide film); Copper CladLminate) carrying out pattern forms, and the main circuit substrate that is applied to seeking mobile phone, notebook computer, audio-visual logging machine etc. and LCD module being connected to each other, particularly in order to bring into play to greatest extent and be used as core parts as the flexibility of the hinge fraction of main circuit substrate and LCD module connecting portion to each other.
Recently, mobile phones etc. are owing to the diversified program of various game functions, navigation feature, MP3 function, wireless TV audiovisual etc. and the application of content, increase as the conveying capacity geometric progression of its data, therefore, the integrated necessity of flexible circuit board also increases relatively.
The result, a lot of producers is when making the multi-layer flexible circuit substrate, on one side its production method adopts and copper foil lamination film is one by one carried out pattern forms to make or provide the copper foil lamination film to carry out pattern with spool to the spool mode on one side and form the method for making.
Yet, utilize the manufacture method of the flexible circuit board of copper foil lamination film one by one, its problem of being pointed out is that productivity is bad, and spool is to the manufacture method of the flexible circuit board of spool mode, though on expectation automation procedure this point, can improve productivity, on reliability of products and integrated efficient this point, have very big deficiency.
Summary of the invention
The present invention proposes in order to solve described shortcoming, its purpose is to provide a kind of manufacture method of flexible circuit board, wherein, not only by following the tracks of with the position accurately that the sensing of bullport carries out by position sensing, pattern can be formed the position, covering layer film and the bonding location that covers synusia, lead to the hole site or punch position etc. are aimed at fine, can expect to utilize spool the spool mode to be carried out a large amount of productions of flexible circuit board, and dwindled the transverse width of the Copper Foil of the formation that becomes the copper foil lamination film, and use directional light in when exposure, and, the glass mask that has applied the chromium pattern by application forms fine pattern (Fine Pattern) to ensure, and by reducing error rate, guarantee reliability, and realize the number of plies of relatively reducing flexible circuit board such as integrated.
For reaching described purpose, the manufacture method of flexible circuit board of the present invention, essential characteristic on its technical method is, comprise the steps: with spool the spool mode to be provided respectively on one side to be provided with first middle copper foil lamination film and the second middle copper foil lamination film of position sensing with bullport, carrying out pattern in the mode of each unit on one side forms, and, with spool the spool mode is supplied with on one side on one side and covered the first intermediate cover layer film and the second intermediate cover layer film, and prepare the step of the first middle FPCB and the second middle FPCB respectively; On one side FPCB in the middle of the described first middle FPCB and second being overlapped the to each other with spool provides the spool mode, the bottom is supplied with the spool mode with spool respectively and is provided with first outside copper foil lamination film and the second outside copper foil lamination film of position sensing with bullport thereon on one side, and, carrying out on one side after the part adhesion forms through hole on one side the step of carrying out the copper plating in the mode of each unit; Form the Copper Foil of the described first outside copper foil lamination film and the second outside copper foil lamination film at mode pattern after with each unit, mode with each unit covers the first outer cover sheet and the second outer cover sheet with open area respectively, and finishes the step of the first outside FPCB and the second outside FPCB; The end sections ground of the pattern of the described first outside FPCB and the second outside FPCB is connected plating and finishes the step of splicing ear; Be benchmark and punch in the mode of each unit and to make the step of flexible circuit board with described position sensing bullport.
For reaching described purpose, the manufacture method of flexible circuit board of the present invention, essential characteristic on its technical method is, comprise the steps: with spool the spool mode to be provided respectively on one side to be provided with first middle copper foil lamination film and the second middle copper foil lamination film of position sensing with bullport, carrying out pattern in the mode of each unit on one side forms, and, with spool the spool mode is supplied with on one side on one side and covered the first intermediate cover layer film and the second intermediate cover layer film, and prepare the step of the first middle FPCB and the second middle FPCB respectively; On one side FPCB in the middle of the described first middle FPCB and second being overlapped the to each other with spool provides the spool mode, the bottom is supplied with the spool mode with spool respectively and is provided with first outside copper foil lamination film and the second outside copper foil lamination film of position sensing with bullport thereon on one side, and, carrying out on one side after the part adhesion forms through hole on one side the step of carrying out the copper plating in the mode of each unit; Form the Copper Foil of the described first outside copper foil lamination film and the second outside copper foil lamination film at mode pattern after with each unit, provide the first outer cover film and the second outer cover film with spool to the spool mode, and finish the step of the first outside FPCB and the second outside FPCB with open area; The end sections ground of the pattern of the described first outside FPCB and the second outside FPCB is connected plating and finishes the step of splicing ear; Be benchmark and punch in the mode of each unit and to make the step of flexible circuit board with described position sensing bullport.
According to the above, by following the tracks of with the position accurately that the sensing of bullport carries out by position sensing, and pattern is formed the position, the bonding location of covering layer film/covering synusia, lead to the hole site or punch position etc. are aimed at fine, can make and utilize a large amount of productions and even the exquisiteness of the flexible circuit board that spool carries out the spool mode to be greatly improved, particularly the transverse width of the Copper Foil of the formation by will becoming the copper foil lamination film is limited in the scope of 40～180mm and uses directional light when exposure, and, application has applied the glass mask of chromium pattern, can realize the reliable guarantee (ensureing FinePattern) of pattern exquisiteness, and by reducing error rate, guarantee reliability, and realize integrated etc., can relatively reduce the number of plies (can realize few stratification) of flexible circuit board, therefore, not only can improve the flexural property (the many more bendabilities of the number of plies are poor more) of flexible circuit board biglyyer, and obtain to realize reducing the good effect of material.
Description of drawings
Fig. 1 a and Fig. 1 b are the process charts of manufacture method of the flexible circuit board of expression first embodiment of the invention;
Fig. 2 a～Fig. 2 c is the process chart of manufacture method of the flexible circuit board of expression second embodiment of the invention;
Fig. 3 a～Fig. 3 c is the process chart of manufacture method of the flexible circuit board of expression third embodiment of the invention;
Fig. 4 a～Fig. 4 e is the process chart of pattern forming process that expression is applicable to the manufacture method of flexible circuit board of the present invention.
Description of symbols
10 copper foil lamination films; 21 cover synusia; 22 covering layer films; 30 flexible circuit boards; Copper foil lamination film in the middle of 41 first; Copper foil lamination film in the middle of 42 second; 51 first intermediate cover layer films; 52 second intermediate cover layer films; FPCB in the middle of 61 first; FPCB in the middle of 62 second; 71 first outside copper foil lamination films; 72 second outside copper foil lamination films; 81 first outer cover sheets; 82 second outer cover sheets; 83 first outer cover films; 84 second outer cover films; 91 first outside FPCB; 92 second outside FPCB; 100 flexible circuit boards; The C Copper Foil; The CT splicing ear; H position sensing bullport; The M mask; The P pattern; The PR dry film; The V through hole.
Embodiment
Below, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, can understand purpose of the present invention, feature and advantage etc. better by these embodiment.
Fig. 1 a and Fig. 1 b are the process charts of manufacture method of the flexible circuit board of expression first embodiment of the invention.
Shown in Fig. 1 a and Fig. 1 b, the manufacture method of flexible circuit board of the present invention provides the Copper Foil C stack membrane (CCL of Copper Foil (Cu film) C evaporation on PI film (Poly Imide Film polyimide film) or polyester film (Polyester Film) spool mode (Reel to Reel) with spool; CopperClad Laminate) 10 (S11) are provided with position sensing with bullport H (S12) at the edge part of the length direction of this Copper Foil C stack membrane 10.
Position sensing is one of employed core means of manufacture method of flexible circuit board of the present invention with bullport H, for example, behind emission laser, the number that calculating sees through and the in-position of calculating the Copper Foil C stack membrane 10 relative direction of the supply form the position of position, the bonding location that covers synusia 21/ covering layer film 22, through hole V or punch position etc. thereby can grasp pattern described later exactly.
And, can provide position sensing bullport H regularly at any part of the length direction edge part of Copper Foil C stack membrane 10, shown in Fig. 1 a and Fig. 1 b, certainly be arranged to sprocket hole (SprocketHole), also can when making Copper Foil C stack membrane 10, design in advance as required.
And, if provide Copper Foil C stack membrane 10 that position sensing bullport H is set with spool on one side to spool mode (Reel to Reel) on one side, then on one side this position sensing is carried out sensing with bullport H and grasp accurately the position and in the mode of each unit Copper Foil C is carried out pattern formation (S13) on one side, at this moment, can provide Copper Foil C width, be that the width of vertical direction of the relative direction of the supply of Copper Foil C stack membrane 10 is 40～180mm.
In the present technique field, usually utilize Copper Foil C stack membrane 10, perhaps use the copper foil lamination sheet (for reaching operation, the copper foil lamination sheet has the boundary that can't pursue especially little width), the width of the most of Copper Foil C that provides is more than 250～300mm, its size of width of such Copper Foil C is big relatively more, just must make the zone of the flow chart of carrying out the pattern forming process, promptly, necessary applying photoresists are used the zone of dry film PR, the exposure area, the present situation zone, perhaps etching area etc. is compelled to do very greatly, thereby there is the problem have to stand raw material utilization not yet in effect, particularly utilize pattern to form the unwanted space in zone, and produce sizable error rate in order to realize exquisite etching work procedure, therefore not as when the integrated side effect of the relative pattern P of considering to point out, with the width of Copper Foil C disclosed by the invention in theory or actual upper bound be made as 40～180mm applicatory, thereby can through repeatedly experimental mistake with obtain important achievement after the research for many years.
Fig. 4 a～Fig. 4 e is the process chart of pattern forming process that expression is applicable to the manufacture method of flexible circuit board of the present invention
The implication that forms Copper Foil C with the mode pattern of each unit is meant, because Copper Foil C stack membrane 10 is not provided one by one, but the spool mode is supplied with continuously with spool, so only carrying out pattern according to the specification of each unit size of goodsization (actual can) forms, shown in Fig. 4 a～Fig. 4 e, finish by following operation, (Fig. 4 a) with dry film PR for the applying photoresists on Copper Foil C, while being positioned on the dry film PR, mask M exposes, and the development of the dry film after will exposing (Fig. 4 b), then etching Copper Foil C (Fig. 4 d) peels off residual dry film PR (Fig. 4 e) then, finishes pattern like this and forms.
At this moment, because carrying out the benchmark of pattern formation is to form by the sensing of position sensing with bullport H, this not only can finish the pattern forming process of not makeing mistakes, and can realize more exquisite and pattern formation accurately, so can improve the reliability and the exquisiteness of goods widely.
On the other hand, employed mask M during exposure, utilization has applied the glass mask of chromium pattern, with use the film mask to compare can to finish very exquisite pattern forming process, employedly during exposure only use the directional light better than scattered light straightline propagation, thereby can ensure exquisiteness (ensureing the FinePattern fine pattern) and reduce error rate, and the width limitations that will be used to realize integrated etc. Copper Foil C is at 40～180mm, and can provide glass mask that has applied the chromium pattern etc., and not only can relatively reduce flexible circuit board 100 described later, it is the number of plies (can realize few stratification) of multi-layer flexible circuit substrate 100, and make its flexural property (the many more bendabilities of the number of plies are poor more) more good, and obtained to reduce the useful effect of material.
Then, for the pattern P of being made by the pattern forming process is implemented insulation and is prevented scraping, and provide the covering synusia (Cover LayerSheet) that sets in advance open area (OA) 21 (S14) in the mode of each unit, and in order to realize and main circuit substrate and LCD module connection terminals CT, after the end sections ground to pattern P connects plating (S15), by being that benchmark punches (S16) in the mode of each unit with bullport H, and finish flexible circuit board 30 with position sensing.
Fig. 2 a～Fig. 2 c is the process chart of manufacture method of the flexible circuit board of the expression second embodiment of the present invention.
Shown in Fig. 2 a～Fig. 2 c, the manufacture method of the flexible circuit board of the second embodiment of the present invention, the data of considering mobile phone etc. transmit the many situations of quantitative change, the additional first outside FPCB91 and the second outside FPCB92 can be clipped in the middle FPCB62 in the middle of the first middle FPCB61 and second, can certainly on FPCB62 in the middle of the FPCB61 and second in the middle of first, append the 3rd middle FPCB and the 4th middle FPCB etc. as required, because when its number of plies becomes for a long time, can make the bending part on the mobile phone for example, the flexibility that is hinge fraction reduces greatly, thereby bear load, so when the object that conduct will be considered, concerning the integrated necessity of the exquisiteness of pattern forming process, be used as prior main points reducing number of plies this point.
Specifically, the manufacture method of the flexible circuit board of the second embodiment of the present invention, on one side respectively with spool to the spool mode provide be provided with position sensing with bullport H first in the middle of in the middle of the Copper Foil C stack membrane 41 and second Copper Foil C stack membrane 42 carry out pattern formation in the mode of each unit on one side, and, with spool the spool mode is supplied with on one side and covered the first intermediate cover layer film 51 and the second intermediate cover layer film 52 on one side, and prepare in the middle of first FPCB62 (S31) in the middle of the FPCB61 and second respectively, on one side FPCB62 in the middle of this first middle FPCB61 and second is overlapped the to each other with spool the spool mode is supplied with, the bottom provides the spool mode with spool respectively and is provided with first outside Copper Foil C the stack membrane 71 and second outside Copper Foil C stack membrane 72 of position sensing with bullport H thereon on one side, and, it is bonding and form through hole V to carry out part in the mode of each unit, after this, (the copper plating can only partly be carried out through hole V in that copper is plated, perhaps also can be with through hole V, Copper Foil C integral body to first outside Copper Foil C the stack membrane 71 and second outside Copper Foil C stack membrane 72 is carried out, and after electroless plating, then carry out electrolysis usually and plate, the actual purpose of this copper plating is the electrical connection that is used for through hole V inside) carry out the electrolytic copper free plating after, carry out cathode copper plating (S32).
The manufacture method of the flexible circuit board of the second embodiment of the present invention, it also can carry out position tracking accurately by position sensing with the sensing of bullport H, particularly while make in the middle of first FPCB62 in the middle of the FPCB61 and second stacked with each unit the mode part bonding first outside FPCB91 and during the second outside FPCB92, this method is undertaken by the sensing of position sensing with bullport H, for through hole V is electrically connected each other, and select laser or NC drill bit or CNC drill bit that through hole V is connected, and by electrolytic copper free plating and cathode copper plating (the Cu plating is in order to make and consistent selection of Copper Foil C as the main material of Copper Foil C stack membrane, according to circumstances can certainly be other material) and finish, certainly only partly through hole V is carried out the copper plating, perhaps also can carry out the integral body of the Copper Foil C of first outside Copper Foil C the stack membrane 71 and second outside Copper Foil C stack membrane 72 that comprises through hole V.
Then, for the part that the outside Copper Foil C stack membrane of FPCB62 in the middle of FPCB61 in the middle of first and second and the first outside Copper Foil C stack membrane 71 and second 72 is bonding, position sensing being carried out sensing with bullport H on one side utilizes sticker (for example on splicing ear CT described later position on one side, bonding limit, limit self is solidified and the adhesive sheet of hardening, is being covered the bonding printing ink of layer or covering the bonding film of layer etc.) carry out bonding, and the position beyond splicing ear CT isolates them mutually and even separates, thereby can ensure its flexibility reliably.
Then, form the Copper Foil C of first outside Copper Foil C the stack membrane 71 and second outside Copper Foil C stack membrane 72 at mode pattern after with each unit, mode with each unit covers the first outer cover sheet 81 and the second outer cover sheet 82 with open area (OA) respectively, thereby finish the first outside FPCB91 and the second outside FPCB92 (S33), connect plating on end sections ground to the pattern P of this first outside FPCB91 and the second outside FPCB92, and finish (S34) behind the splicing ear CT, by being benchmark with position sensing with bullport H and punching, and can finish the flexible circuit board 100 (S35) of multilayer in the mode of each unit.
Promptly, on one side position sensing is carried out sensing and follows the tracks of position accurately in the mode of each unit with bullport H, pattern forms the Copper Foil C of first outside Copper Foil C the stack membrane 71 and second outside Copper Foil C stack membrane 72 on one side, and, cover the first outer cover sheet 81 and the second outer cover sheet 82 one by one with open area (OA), when finishing the first outside FPCB91 and the second outside FPCB92, expect that it has insulating properties, and, end sections ground in order to prevent outside scraping to the pattern P of the first outside FPCB91 and the second outside FPCB92 connects plating, thereby can finish and main circuit substrate and the continuous splicing ear CT of LCD module.
At this moment, connect plating and can utilize Au, Sn, Ag or SnPb to carry out, this can be the close-connected a kind of enhancing plating that is used for main circuit substrate and LCD module etc.
Fig. 3 a～Fig. 3 c is the process chart of manufacture method of the flexible circuit board of expression third embodiment of the invention.
Shown in Fig. 3 a～Fig. 3 c, the manufacture method of the flexible circuit board of the third embodiment of the present invention, on one side respectively with spool to the spool mode supply with on one side mode pattern with each unit form be provided with position sensing with bullport H first in the middle of Copper Foil C stack membrane 42 in the middle of the Copper Foil C stack membrane 41 and second, and, with spool the spool mode is supplied with on one side and covered the first intermediate cover layer film 51 and the second intermediate cover layer film 52 on one side, and prepare in the middle of first FPCB62 (S41) in the middle of the FPCB61 and second respectively, on one side FPCB62 in the middle of this first middle FPCB61 and second is overlapped the to each other with spool the spool mode is supplied with, the bottom is supplied with the spool mode with spool respectively and is provided with first outside Copper Foil C the stack membrane 71 and second outside Copper Foil C stack membrane 72 of position sensing with bullport H thereon on one side, and part is bonding and carry out copper plating (S42) after forming through hole V carrying out in the mode of each unit.
Then, after the mode pattern with each unit forms the Copper Foil C of first outside Copper Foil C the stack membrane 71 and second outside Copper Foil C stack membrane 72, provide the first outer cover film 83 that is provided with open area (OA) and the second outer cover film 84 with spool to the spool mode and finish the first outside FPCB91 and the second outside FPCB92 (S43), end sections ground to the pattern P of this first outside FPCB91 and the second outside FPCB92 connects plating and forms splicing ear CT (S34), by being benchmark with position sensing with bullport H and punching, thereby can finally finish the flexible circuit board 100 (S45) that constitutes by multilayer in the mode of each unit.
As mentioned above, by purpose of the present invention, structure and action effect are as can be seen, core technology of the present invention is as follows, promptly, by following the tracks of with the position accurately that the sensing of bullport carries out while utilizing spool that the spool mode is carried out position sensing, pattern can be formed the position, covering layer film and the bonding location that covers synusia, lead to the hole site or punch position etc. are aimed at fine and are improved productivity and reliability widely, and the transverse width of Copper Foil that will become the formation of copper foil lamination film is limited in the scope of 40～180mm, and use directional light in when exposure, and, the glass mask that application has applied the chromium pattern forms fine pattern (Fine Pattern) to ensure, and by reducing error rate, guarantee reliability, and realize integrated etc., relatively reduce the number of plies of flexible circuit board, and other operation that can change and structure (for example can be regarded as multiple situation, though illustrated is to apply a row pattern on Copper Foil, but also can be to carry out two row, the situation of pattern forming process in the time of three row), in addition, " on one side～" in the term of the present invention, "～and " etc. only can be regarded as the order of a series of sequential, the present invention includes the situation that all can change like this, to the explanation of technical scheme also as benchmark.
Claims (10)
1, a kind of manufacture method of flexible circuit board is characterized in that, comprises the steps:
With spool the spool mode is provided respectively on one side and be provided with first middle copper foil lamination film and the second middle copper foil lamination film of position sensing with bullport, carrying out pattern in the mode of each unit on one side forms, and, with spool the spool mode is supplied with on one side on one side and covered the first intermediate cover layer film and the second intermediate cover layer film, and prepare the step of the first middle FPCB and the second middle FPCB respectively;
On one side FPCB in the middle of the described first middle FPCB and second being overlapped the to each other with spool provides the spool mode, the bottom is supplied with the spool mode with spool respectively and is provided with first outside copper foil lamination film and the second outside copper foil lamination film of position sensing with bullport thereon on one side, and, carrying out on one side after the part adhesion forms through hole on one side the step of carrying out the copper plating in the mode of each unit;
Form the Copper Foil of the described first outside copper foil lamination film and the second outside copper foil lamination film at mode pattern after with each unit, mode with each unit covers the first outer cover sheet and the second outer cover sheet that has open area (OA) separately respectively, and finishes the step of the first outside FPCB and the second outside FPCB;
The end sections ground of the pattern of the described first outside FPCB and the second outside FPCB is connected plating and finishes the step of splicing ear;
Be benchmark and punch in the mode of each unit and to make the step of flexible circuit board with described position sensing bullport.
2, a kind of manufacture method of flexible circuit board is characterized in that, comprises the steps:
With spool the spool mode is provided respectively on one side and be provided with first middle copper foil lamination film and the second middle copper foil lamination film of position sensing with bullport, carrying out pattern in the mode of each unit on one side forms, and, with spool the spool mode is supplied with on one side on one side and covered the first intermediate cover layer film and the second intermediate cover layer film, and prepare the step of the first middle FPCB and the second middle FPCB respectively;
On one side FPCB in the middle of the described first middle FPCB and second being overlapped the to each other with spool provides the spool mode, the bottom is supplied with the spool mode with spool respectively and is provided with first outside copper foil lamination film and the second outside copper foil lamination film of position sensing with bullport thereon on one side, and, carrying out on one side after the part adhesion forms through hole on one side the step of carrying out the copper plating in the mode of each unit;
Form the Copper Foil of the described first outside copper foil lamination film and the second outside copper foil lamination film at mode pattern after with each unit, provide the have the open area first outer cover film and the second outer cover film of (OA) with spool to the spool mode, and finish the step of the first outside FPCB and the second outside FPCB;
The end sections ground of the pattern of the described first outside FPCB and the second outside FPCB is connected plating and finishes the step of splicing ear;
Be benchmark and punch in the mode of each unit and to make the step of flexible circuit board with described position sensing bullport.
3, the manufacture method of flexible circuit board according to claim 1 and 2 is characterized in that, described position sensing comprises sprocket hole (Sprocket hole) with bullport.
4, the manufacture method of flexible circuit board according to claim 1 and 2 is characterized in that, carries out described connection plating with Au, Sn, Ag or SnPb.
5, the manufacture method of flexible circuit board according to claim 1 and 2 is characterized in that, described pattern forms and comprises the steps:
Step (a), it is applying photoresists dry film on described Copper Foil;
Step (b) is exposed while it is positioned on the described dry film mask;
Step (c), its dry film to described exposure develops;
Step (e), the described Copper Foil of its etching;
Step (f), it peels off described residual dry film.
6, the manufacture method of flexible circuit board according to claim 5 is characterized in that, described mask is the glass mask that is provided with the chromium pattern.
7, the manufacture method of flexible circuit board according to claim 5 is characterized in that, utilizes directional light while mask is positioned at carry out step of exposing (b) on the described dry film.
8, the manufacture method of flexible circuit board according to claim 5 is characterized in that, described pattern form by described position sensing with the sensing of bullport the mode with each unit carry out.
9, the manufacture method of flexible circuit board according to claim 1 and 2 is characterized in that, described connection plating and punching by described position sensing with the sensing of bullport the mode with each unit carry out.
10, the manufacture method of flexible circuit board according to claim 1 and 2 is characterized in that, the width of described Copper Foil is 40～180mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR54171/05 | 2005-06-22 | ||
| KR1020050054171A KR100666282B1 (en) | 2005-06-22 | 2005-06-22 | Method for manufacturing multi layer flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1886029A true CN1886029A (en) | 2006-12-27 |
Family
ID=37583941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100938968A Pending CN1886029A (en) | 2005-06-22 | 2006-06-22 | Flexible circuit substrate manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4218768B2 (en) |
| KR (1) | KR100666282B1 (en) |
| CN (1) | CN1886029A (en) |
| TW (1) | TWI307614B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102301280A (en) * | 2008-12-23 | 2011-12-28 | 3M创新有限公司 | Roll-to-roll digital photolithography |
| CN102630130A (en) * | 2011-02-03 | 2012-08-08 | 罗伯特·博世有限公司 | Electric connection and method for building electric connection |
| CN103978516A (en) * | 2014-05-05 | 2014-08-13 | 厦门弘信电子科技股份有限公司 | Through hole punching technology for rolled flexible circuit board |
| CN105870319A (en) * | 2016-04-26 | 2016-08-17 | 贝骨新材料科技（上海）有限公司 | Roll-to-roll manufacturing method of long-strip piezoelectric film sensor |
| CN113518504A (en) * | 2020-04-10 | 2021-10-19 | 金相奉 | Manufacturing method of high-speed punching machine linkage type precise roll-to-roll material flexible circuit board |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080295327A1 (en) * | 2007-06-01 | 2008-12-04 | 3M Innovative Properties Company | Flexible circuit |
| KR101009415B1 (en) | 2008-11-18 | 2011-01-19 | 삼성모바일디스플레이주식회사 | Method for manufacturing electronic apparatus comprising plastic substrate, electronic apparatus manufactured by that method, and apparatus to be used in that method |
| KR101051857B1 (en) * | 2010-05-27 | 2011-07-25 | 우영관 | Method of adhering additional plate to fpc product |
| KR101180355B1 (en) * | 2012-02-21 | 2012-09-07 | 주식회사 비에이치 | Manufacturing method of dual side multi layer typed flexible printed circuit board and dual side multi layer typed flexible printed circuit board manufactured by the method thereof |
| JP6679082B1 (en) * | 2019-04-16 | 2020-04-15 | 山下マテリアル株式会社 | Flexible wiring board |
| KR20210156005A (en) * | 2020-06-17 | 2021-12-24 | 주식회사 엘지에너지솔루션 | Method for manufacturing flexible printed circuit board |
| KR20220028752A (en) * | 2020-08-31 | 2022-03-08 | 주식회사 두산 | Method for manufacturing flexible printed circuit board, and flexible printed circuit board manufactured by the same |
| CN113438802B (en) * | 2021-07-27 | 2022-05-20 | 友达光电（苏州）有限公司 | Flexible circuit board and display device using same |
-
2005
- 2005-06-22 KR KR1020050054171A patent/KR100666282B1/en not_active IP Right Cessation
-
2006
- 2006-06-21 JP JP2006171777A patent/JP4218768B2/en not_active Expired - Fee Related
- 2006-06-22 CN CNA2006100938968A patent/CN1886029A/en active Pending
- 2006-06-22 TW TW095122380A patent/TWI307614B/en active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102301280A (en) * | 2008-12-23 | 2011-12-28 | 3M创新有限公司 | Roll-to-roll digital photolithography |
| CN102301280B (en) * | 2008-12-23 | 2014-11-26 | 3M创新有限公司 | Roll-to-roll digital photolithography |
| CN102630130A (en) * | 2011-02-03 | 2012-08-08 | 罗伯特·博世有限公司 | Electric connection and method for building electric connection |
| CN102630130B (en) * | 2011-02-03 | 2016-11-23 | 罗伯特·博世有限公司 | Electrical connection and the method being used for setting up electrical connection |
| CN103978516A (en) * | 2014-05-05 | 2014-08-13 | 厦门弘信电子科技股份有限公司 | Through hole punching technology for rolled flexible circuit board |
| CN105870319A (en) * | 2016-04-26 | 2016-08-17 | 贝骨新材料科技（上海）有限公司 | Roll-to-roll manufacturing method of long-strip piezoelectric film sensor |
| CN113518504A (en) * | 2020-04-10 | 2021-10-19 | 金相奉 | Manufacturing method of high-speed punching machine linkage type precise roll-to-roll material flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060134475A (en) | 2006-12-28 |
| JP2007005805A (en) | 2007-01-11 |
| TWI307614B (en) | 2009-03-11 |
| TW200704317A (en) | 2007-01-16 |
| KR100666282B1 (en) | 2007-01-09 |
| JP4218768B2 (en) | 2009-02-04 |
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| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20061227 |
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| C20 | Patent right or utility model deemed to be abandoned or is abandoned |