TWI307614B - Method for manufacturing flexible printed circuit board - Google Patents

Method for manufacturing flexible printed circuit board Download PDF

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Publication number
TWI307614B
TWI307614B TW095122380A TW95122380A TWI307614B TW I307614 B TWI307614 B TW I307614B TW 095122380 A TW095122380 A TW 095122380A TW 95122380 A TW95122380 A TW 95122380A TW I307614 B TWI307614 B TW I307614B
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TW
Taiwan
Prior art keywords
film
fpcb
peripheral
circuit board
copper
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Application number
TW095122380A
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Chinese (zh)
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TW200704317A (en
Inventor
Yu-Yong Lee
Ki-Joon Park
Yoon-Hong Yang
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Dk Uil Co Ltd
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Publication of TW200704317A publication Critical patent/TW200704317A/en
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Publication of TWI307614B publication Critical patent/TWI307614B/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0026Etching of the substrate by chemical or physical means by laser ablation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

1307614 * 九、發明說明: 【發明所屬之技術領域】 细的H月係關於一種軟性印刷電路板之製造方法,更詳 卷於以下所述之軟性印刷電路板之製造方法:利用 置,夢^可^立置感測用導向孔之感測追蹤正確位 著位使圖案化位置、覆蓋膜以及覆蓋片之黏 之銅ί之或沖切位置等吻合,將構成銅箱疊層膜 充分利用二ΐ寬度限制為小寬度,曝光時使用平行光,並 _ (Fine patf鉻ί屬圖案之玻璃光罩,可保障精細圖案 積m)’減少錯誤率,確保可靠性,並可實現 以】從而相對減少軟性印刷電路板之層數。 ^常/ 軟性印刷電路板(FlexiblePrintedCircuit 聚3 核心元件5用’使PI臈(P〇lyImideFilm, (CCJ . f Λ膜)上瘵鍍有Cu薄膜之銅箔疊層膜 筆7刑」Tre^cladLaminate)圖案化,用於攜帶終端機: f包胳、攝像機等之主電路板與LCD(Li^idc ^splay,液晶顯示器)模組相互間的連接,尤i τν«mpj ϊ;' ^ 量呈幾何級數增加,因此:體 电路板之必要性相對增加。 丨邓j 之制、:iff者於製造複數層軟性印刷電路板時,所採用 = 了p式係使一片片銅落疊層膜圖案化後進行製作,或 化而進行製作的方法。 冶且層膜亚使之圖案 然而’利用一片片銅箔疊層膜進行製作的軟性印刷電 7 i 1307614 Λ 路板之製造方法存在生產力不佳之問題,卷帶式軟性 電路板之製造方法可使工序實現自動化,而可提高生產 力,但無法滿足產品可罪性、積體化效率之要求。。 [發明所欲解決之問題] 本發明係用以解決上述缺點而提出者,其目的在於 供一種軟性印刷電路板之製造方法,其通過位置感測用 向孔之感測追蹤正確位置,藉此可巧妙地使圖案化位置、 覆盍膜以及覆蓋片之黏著位置、通孔位置或沖切位置 合,不僅可望通過卷帶方式大量生產軟性印刷電路板, 可縮小構成銅箔疊層膜之銅箔之横向寬度,曝光時使甩亚 行光,並充分利用賦有鉻金屬圖案之玻璃光罩,可^卩章精 細圖案(Fine Pattern),減少錯誤率,確保可靠▲ 可實現積體化等,從而相對減少軟性印刷電路板之芦 【發明内容】1307614 * Nine, the invention description: [Technical field of the invention] The thin H-month is a method for manufacturing a flexible printed circuit board, and is more detailed in the manufacturing method of the flexible printed circuit board described below: using the setting, dream ^ The sensing and tracking of the sensing guide hole can be used to accurately match the position of the pattern, the cover film and the adhesive sheet of the cover sheet, or the punching position, etc., and the copper box laminated film can be fully utilized. ΐ Width is limited to a small width, parallel light is used for exposure, and _ (Fine patf chrome-patterned glass reticle to ensure fine pattern product m) 'reduces error rate, ensures reliability, and can be achieved Reduce the number of layers of flexible printed circuit boards. ^Normal / Flexible Printed Circuit Board (FlexiblePrintedCircuit Poly 3 Core Element 5 is used to make PI臈(P〇lyImideFilm, (CCJ. f Λ film)) copper foil laminated film pen 7 with Cu film coated on it"Tre^cladLaminate ) Patterning, used for carrying terminals: f package, camera and other main circuit boards and LCD (Li^idc ^splay, liquid crystal display) modules are connected to each other, especially i τν «mpj ϊ; ' ^ quantity The geometrical series is increased, so the necessity of the bulk circuit board is relatively increased. 丨Deng j system: iff is used in the manufacture of a plurality of layers of flexible printed circuit boards, using the p-type system to make a piece of copper-thick laminated film After the patterning, the method of production or production is carried out. The pattern of the film is submerged. However, the flexible printed circuit produced by using a single piece of copper foil laminated film 7 i 1307614 The manufacturing method of the board is not productive. The problem is that the manufacturing method of the tape-and-reel flexible circuit board can automate the process, but can improve the productivity, but cannot meet the requirements of the product's sinfulness and integrated efficiency. [The problem to be solved by the invention] The present invention is Used to solve the above shortcomings The object of the present invention is to provide a method for manufacturing a flexible printed circuit board which tracks the correct position by sensing the position sensing hole, thereby subtly making the patterned position, the covering film and the cover sheet The adhesive position, the through hole position or the punching position are combined, and it is expected that the flexible printed circuit board can be mass-produced by the tape winding method, and the lateral width of the copper foil constituting the copper foil laminated film can be reduced, and the light is made when exposed. Make full use of the glass mask with the chrome metal pattern, and the Fine Pattern can be used to reduce the error rate and ensure the reliability. ▲ The integrated film can be realized, thus reducing the soft printed circuit board.

、為實現上述目的,本發明之軟性印刷電路板之製造方 ,的技術方法上之基本特徵在於包含:分別以卷帶式提供 设有位置感1用導向孔之第!中間銅箔之疊層膜以及第2 中間銅,之疊層膜,並根據單位類別對該等膜進行圖案 化,同時以卷帶式供給第丨中間覆蓋膜以及第2中間覆^ 膜進行被覆,分別準備第i中間FPCB以及 1 之步驟;以卷帶式提供上述第i中間FpcB以及第2中^ FPCB錢其严’並分別以卷帶式提供於其上下部以 感!^向孔±之第1外圍銅箔之疊層膜以及第2外圍 ΐηπ“艮據單位類別使其-部分黏著並形成 ^孔,之後貝施鍍銅之步驟;根據單位 及第2外圍銅箱之疊層膜的=圖 案?後’,據早位類別分別被覆具有開放區域⑶Α)之 1外圍覆盍片以及第2外圍覆蓋片,完成 以及第2外圍謂之步驟;於上述第i外圍Fpc卜Β圍乂及= 8 1307614 < J * 2外圍FPCB之圖案端部進行一部分連接器電鍍,完成連 接器=子之步驟;以及以上述位置感測用導向孔為基準, 根據單位類別進行沖切,製作軟性印刷電路板之步驟。 ,又為貝現上述目的’本發明之另一軟性印刷電路板 ^製造方法的技術方法上之基本特徵在於包含··分別以卷 喷式提供設有位置感測用導向孔之第1中間銅箔之疊層 ?以及第2中間銅箔之疊層膜,並根據單位類別對該 化,㈤時以卷帶式供給$ 1中間覆蓋膜以及第2 中間後盍膜進行被覆,分別準備第i中間 • 驟;以卷帶式提供上述第1中間 $ 2中^ _亚使其重疊,並分別以卷帶式供給於 Γ第?測用導向孔之第1外圍銅搭之疊層膜以 狀疊層膜,同時根據單位類別使其-部分 上二二通孔,之後貫施鑛銅之步驟;根據單位類別使 卜圍銅箱之疊層膜以及第2In order to achieve the above object, the technical method of the manufacture of the flexible printed circuit board of the present invention is characterized in that it comprises: a guide hole for providing a positional feeling 1 in a tape-and-reel type; The laminated film of the intermediate copper foil and the laminated film of the second intermediate copper are patterned according to the unit type, and are simultaneously wound and fed to the second intermediate film and the second intermediate film. Preparing the steps of the i-th intermediate FPCB and 1 respectively; providing the above-mentioned i-th intermediate FpcB and the second middle-f FPCB in the tape-and-reel type and respectively providing the upper and lower portions of the tape to the upper and lower portions thereof to sense the hole ± The laminated film of the first peripheral copper foil and the second peripheral ΐππ "partially adhered to form a hole, and then a copper plating step; a laminated film according to the unit and the second peripheral copper case = pattern? After ', according to the early category, respectively, the outer cover sheet with the open area (3) Α) and the second peripheral cover sheet, the completion and the second peripheral step; in the above-mentioned ith peripheral Fpc divination And = 1 1307614 < J * 2 peripheral FPCB pattern end part of the connector plating, complete the connector = sub-step; and based on the above-mentioned position sensing guide hole, according to the unit type punching, making soft The steps of the printed circuit board. The above-described object of the present invention is to provide a laminate of a first intermediate copper foil provided with a position sensing guide hole in a roll-to-spray type. And the laminated film of the second intermediate copper foil, and according to the unit type, (5), the tape is supplied with the $1 intermediate cover film and the second intermediate back film, and the i-th intermediate step is prepared; Providing the first intermediate $2 in the tape-and-reel type, and superimposing them on the laminated film of the first peripheral copper-clad which is supplied to the first measurement guide hole by a tape winding type, At the same time, according to the unit type, the part is made up of two or two through holes, and then the step of applying the copper is carried out; according to the unit type, the laminated film of the copper box and the second layer are made.

^圖案化後’以卷帶式提供具有開 T ;® FPCB ^ 1 ^ ρΪοβ IT; •子之步= ^連接器端 位類=,製作軟性準’根據單 如上所述’本發明可獲得如…^ ^ ^ ^ 測用導向孔之感測追縱正確位置,^位置感 位置、覆蓋膜/覆蓋片之黏著位署稭I了 地使圖案化 等吻合,不僅可望通過卷帶方^置去、f孔位置或沖切位置 板,亦可極大地提古卷W·方式大置生產軟性印刷電路 鋼箱之橫向寬度t二:^ 行光,同時充分利用賦有終全屬=亚於曝光時使用平 有鉻孟屬圖案之玻璃光罩,藉此可 9 1307614 保障圖案精巧性(保障FinePatter 誤率,嫁保可青,14 ^ ) I J日寸減J錯 反之層數’(、可:心t)化么 越幻,板之f曲特性(層數越多則彎i性 【實施方式】 以下,參照圖式,就本發明之較好實施形離進杆註知 通過該等實施形態,可更容易理解 特徵以及優點等。 知d之Η的、 圖la以及圖lb係表示本發明第1實施形離之耖性印 刷電路板之製造方法的流程圖。 mi·生印 本發明之軟性印刷電路板之製造方法如 ; " ti ;( Reel T〇 Reel } PI ^ ( P〇1^^e 二上瘵鍍有銅箱(Cu薄膜)C的銅箱c之疊層膜 (C田Chopper Clad Laminate) H) (S11),於該銅落 c 义膜10之長度方向邊緣部設置位置感測用導向孔h (bl2 ) 〇 位置感測用導向孔Η係本發明軟性印刷電路板之製 ,^法所使用之核心機構之一,例如於發射雷射光後,計 數透過之個數,計算相對於銅箔疊層膜1〇之供給方 向,進入位置,可正確把握後述圖案化位置、覆蓋片21/ 覆蓋膜22之黏著位置、通孔ν之位置或沖切位置等。 另外,可有規則地將位置感測用導向孔Η提供至銅箔 C之疊層膜1 〇之長度方向邊緣部的任意部位,如圖丨&以 及圖ib所示’不僅可作為傳送孔(Spr〇cketH〇le)配置, 亦可根據需要,於製作銅箔C之疊層膜1 〇時預先設計。 θ繼而,若銅箔C之疊層膜10以卷帶式(Reel To Reel ) 提供並设有位置感測用導向孔Η,則使該位置感測用導向 孔Η進行感測,把握正確位置,並根據單位類別使銅箔匸 4 1307614; « 之玻璃光罩,與薄膜光罩相比,巧円^ After patterning, the tape is provided with T;® FPCB ^ 1 ^ ρΪοβ IT; • Substep = ^ Connector end class =, making soft quasi 'according to the single as described above' ...^ ^ ^ ^ The sensing hole is sensed to track the correct position, the position of the position sensor, the cover film/covering sheet is adhered to the surface, and the patterning is matched, not only through the tape but also Go, f hole position or punching position plate, can also greatly increase the lateral width of the soft-printed circuit steel box produced by the W-mode large-scale W2 method: two lines of light, while making full use of the end of the total = sub-exposure When using a glass reticle with a chrome-like pattern, 9 1307614 can guarantee the delicateness of the pattern (guarantee the FinePatter error rate, the marriage can be green, 14 ^) IJ day inch minus J wrong and the number of layers ' (, can: The heart t) is more illusory, and the f-characteristics of the plate (the more the number of layers, the more the curve is. [Embodiment] Hereinafter, with reference to the drawings, the preferred embodiment of the present invention is disclosed. , features, advantages, etc. can be more easily understood. Figure la and Figure lb show the present invention. 1 Flow chart of a method for manufacturing an isolated printed circuit board. The method for manufacturing a flexible printed circuit board of the present invention is as follows; "ti; (Reel T〇Reel } PI ^ ( P〇1^^ e laminated film of a copper box c plated with a copper box (Cu film) C (C-field Chopper Laminate) H) (S11), and a positional feeling is provided at the edge portion of the length direction of the copper drop film 10 Measuring guide hole h (bl2) 〇 position sensing guiding hole Η is a system of the flexible printed circuit board of the present invention, one of the core mechanisms used in the method, for example, after emitting laser light, counting the number of transmission, counting With respect to the supply direction of the copper foil laminated film 1 ,, the entry position can accurately grasp the patterning position to be described later, the adhesion position of the cover sheet 21 / the cover film 22, the position of the through hole ν, the punching position, and the like. The position sensing guide hole 规则 is regularly supplied to any portion of the longitudinal direction edge portion of the laminated film 1 of the copper foil C, as shown in FIG. amp & and FIG. ib 'not only as a transfer hole (Spr〇cketH) 〇le) Configuration, or as needed, when making laminated film 1 of copper foil C First, if the laminated film 10 of the copper foil C is provided in a tape reel type (Reel To Reel) and provided with a position sensing guide hole Η, the position sensing guide hole Η is sensed. Grasp the correct position and make the copper foil 匸 4 1307614 according to the unit type; « The glass reticle is compared with the film reticle

Ϊ Ϊ i ί : 1保障精巧性(保障F —tern ),; 之寬产限制由於將用以實現積體化等目的之銅箔C 衫ί I日Ϊ將後:二:,提供賦有鉻金屬圖案之玻璃 彎曲特性(層數ίί ,故不僅其 現材料之減少更加優良,甚至可具 又件上述夕種有效作用。 ►且通過圖案化過程而製作之圖案?施行絕緣, ίί;方,Γ刮傷’f據單位類別提供具有開放區域(二之 進行一部分連接器電铲fsf5ttCT,於圖案p之端部 hI、、隹1 f r丸鍍c S15) ’之後以位置感測用導向孔 二土準,根據皁位類別進行沖切(6 ),夢此可&志如 性印刷電路板3〇。 猎匕了凡成軟 -路m21係表示本分明第2實施形態之軟性印刷 甸路板之製造方法的流程圖。 |刺 ,如圖實ίϊ之軟性印刷電路板之製造方法 多3产开λ考慮到行動電話等之數據傳輪量增 1 5 tit ^ 1 17 fBl FPCB61 2 t FPCB62 門:亦可於第1中㈤FP_以及第2中 ΪΓϋ Λ 中間觸以及第4中間膽等, 軟3二:二攜/终端機之摺疊部分即鉸鏈部分柔 2進仃精巧積體化之必要性顯得更為重要,因其可減n /、體而。,本發明第2實施形態之軟性印刷電路板之 4 Ϊ307614 j ϊΐΤΐ:銅式提供設有位置感測用導向孔《 β, ^ Α9计$曰膜41以及第2中間銅箔c之疊 ίϊ二,/Λ早位類別該等膜進行圖案化,同時以卷Ϊ Ϊ i ί : 1 guarantees the ingenuity (guarantee F — tern ),; the wide production limit is due to the copper foil C shirt that will be used for the purpose of integration, etc. I will be followed by: 2:, provided with chrome metal The glass bending characteristics of the pattern (the number of layers is ίί, so not only the reduction of the current material is more excellent, but also the effective effect of the above-mentioned eve type. ► And the pattern made by the patterning process? Perform insulation, ίί; square, Γ Scratch 'f is provided according to the unit type with an open area (two part of the connector shovel fsf5ttCT, at the end of the pattern p hI, 隹1 fr pill plating c S15) ' after the position sensing guide hole two soil Quasi-cutting according to the category of soaps (6), dreams of this can be used as a printed circuit board 3〇. The hunting of the soft-road m21 system shows the soft printing road board of the second embodiment. Flow chart of the manufacturing method. | 刺, as shown in the figure ϊ 软 软 软 软 软 软 软 软 λ λ λ λ λ λ λ λ λ λ λ λ λ λ λ λ 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑 考虑: It can also be touched in the middle of the first (five) FP_ and the second middle Λ And the 4th middle biliary, etc., soft 3 2: the folding part of the second port/terminal machine, that is, the hinge part is soft and the necessity of compact integration is more important, because it can reduce n /, body. In the soft printed circuit board according to the second embodiment of the present invention, Ϊ307614 j ϊΐΤΐ: The copper type is provided with a position sensing guide hole "β, ^ Α 9 曰 曰 film 41 and a second intermediate copper foil c stack ϊ 2, / In the early category, the films are patterned and simultaneously rolled

1 "曰”_ 以及第 fpS FPclll Λ 1 ^ FPCB61 ^ F.1 /、重豐,並分別卷帶式提供於其上下部設有 C卜2導4孔H之第1外圍銅箱c之疊層膜71以及 以ΐΐ二之疊層膜72,同時根據單位類別使其- 孔¥後,進行鑛銅[可僅對通孔ν進行 部乂刀鑛銅,或亦可同時對通孔ν、第1外圍銅箱以爲声 膜71以及第2外圍銅箔c之疊層膜721 "曰"_ and the first fpS FPclll Λ 1 ^ FPCB61 ^ F.1 /, heavy, and separately provided in the upper and lower parts of the first peripheral copper box c with C 2 leads 4 holes H The laminated film 71 and the laminated film 72 of the second layer are simultaneously made of a copper ore according to the unit type, and the ore may be subjected to copper ore (only the through hole ν may be partially smashed or copper, or the through hole ν may be simultaneously The first peripheral copper box is a laminated film 72 of the acoustic film 71 and the second peripheral copper foil c

鑛銅’通常於無電解鑛銅後進行電解鑛銅,以U 2之:連接通孔V内部],首先進行無電解鍍 銅之後進仃電解鍍銅(S32)。 亦可in'實施形態之軟性印刷電路板之製造方法 卜越幻3 f感測用導向孔Η之感測追蹤正確位置而進 第1中間體61以及第2中間FPCB62 ;別叮黏著一部分第1外圍FP_以及第2外 通過位置感測用導向孔H之感測進行, S 電性連接,可藉由雷射、NC鑽孔器或 ΐ C伴:f 可與銅猪〇之疊層膜之主材料即銅 對一邻、j、s 根據情形,亦可為其他材質]完成,可僅 冰二通孔V進行鍍銅,或亦可對包括通孔V之第丄 二,C之疊層膜71以及第2外圍銅箔C之疊層膜72 的銅箔C整體進行錢銅。 且層膜72 第1 如Ϊ著第1中間FPCB61以及第2中間FpCB62、 、5名C之疊層膜71以及第2外圍銅箔c之疊層 13 1307614 * . 膜72的部分使位置感測用導向孔η谁耔片 連接器端子α部分通過黏著劑(例如;ς著jn述 端子α以外之部分相互隔=乃1= H占著,連接器 其柔軟性。 如此可碎實保障 之後,根據單位類別對第2外圍麵 以及第2外圍銅箱C之疊層膜72的銅荡 根據單位類別分別被覆具有開放區域(⑷之丁圖木化後’ 蓋片81以及第2外圍覆蓋片82,完成第)第卜圍, 以及第2外圍FPCB92(S33)’於該第丨外圍圍FPCB91 ►第2外圍麵2之圖案P之端部進行^ 及 完成連接器端子CT後(S34),以位置感測丄 基準,根據單位類別進行沖切,藉此可6志、—二L Η為 刷電路板100(S35)。 错此了凡成稷數層軟性印 即,使位置感測用導向孔Η進行咸測,舻姑抑 2 ^ ^ M C . 4 ^ 72 „ ^;C ^ ^ ; * 一(〇A) 一片片地被覆第1外圍覆蓋片81以f第 片82 ’完成第1外圍FPCB91以及第2外圍 二並對其施行絕緣,同時,為防止外部刮傷,= 以及第2外圍FPCB92之圖案P之端部進行Ϊ i端ΐ;電鍍,完成連接於主電路板以及LCD模組之連接 亦ΰτ ί時、,連接器電鍍可利用Au、Sn、Ag或SnPb進行, 接為一種用以與主電路板以及lcd模組等緊密連 接之補強電鍍。 于、在連 電路圖3e#表示本發明第3實施形態之軟性印刷 电路板之製造方法的流程圖。 冲j 本發明第3實施形態之軟性印刷電路板之製造方法 1307614 * · 如圖3a至圖3c所示’分別以卷帶式提供設有位置感測用 ,向孔^之第1中間銅箔c之疊層膜4丨以及第2中間銅 落C之豐層膜42,並根據單位類別對該等膜進行圖案化, 同時以卷帶式供給第丨中間覆蓋片51以及第2中間覆蓋 片52並被覆,分別準備第1中間FPCB61以及第2中間 FPCB62 (S41) ’以卷帶式提供該第丨中間FpCM1以及第 2中間FPCB62並使其重疊,分別以卷帶式供給於其上下 部設有位置感測用導向孔H之第i外圍銅箔c之疊声膜 71以及第2外圍銅箔C之疊層膜72,同時根據單位類別 使其一部分黏著並形成通孔v後,進行鍍銅(S42)。 繼而,根據單位類別對第丨外圍銅箔c之疊層膜 以及第2、外圍銅箔C之疊層臈72的銅箔c進行圖案化後, f 以卷帶式提供第1外圍覆蓋膜83以及第 2外圍覆盍膜84,完成第!外圍FpcB91以 rsBi2(psi3i!:;*1 ^ fpcb91 2 ^ ^ ,圖木P之螭。卩進仃一部分連接器電鍍,具現連接器端子 (S44),以位置感測用導向孔H為基準,根據 行沖切,藉此可最終完成包含葙I戽畆 員另J進 1〇〇 (S45)。 70攻匕3稷數層之軟性印刷電路板 > 以上’通過本發明之目的、構成以及作用效 本發明之核心技術在於:利用卷帶方式’並= 用導向孔之感測追蹤正確位置,萨此 :置感測 置、覆蓋膜以及覆蓋片之黏著置位案化位 等吻合,極大地提高生產力以及可靠性,且^ f 屠膜之銅猪之橫向寬度限制為4〇〜18 : 平行光,並充分利用賦有鉻金屬圖案 ^先時使用 精細圖案⑴ne Pattern),減少以璃保障 J可:現積體化等’從而可相對減少軟性印 數;其他可改變之工序以及構成可理解為多種多匕: 4 • 4 1307614 如,圖示為對銅箔賦予一行圖 2中3「行同時圖案化之過程的情形)冗外Π進行2 ί 士 :並」以及「〜同時」等僅表示-夺列之術 乾圍之解釋亦以此為准。 厅有^形,申請專利 【圖式簡單說明】 圖1 a以及圖1 b係表示本發明第 刷電路板之製造方法的流程圖。月弟1貫施形怒之軟性印The copper ore is usually electrolyzed with copper after electroless copper ore, and U 2 is connected to the inside of the through hole V. First, electroless copper plating is performed, followed by electrolytic copper plating (S32). The manufacturing method of the flexible printed circuit board in the embodiment can also be used to enter the first intermediate body 61 and the second intermediate FPCB 62 by sensing the tracking position of the steering hole 感. The peripheral FP_ and the second outer passing position sensing hole H are sensed, and S is electrically connected, and can be laminated with a copper porcine by a laser, an NC drill or a ΐC: f The main material is copper to a neighbor, j, s depending on the situation, can also be completed for other materials, can be only copper two through hole V for copper plating, or can also include the second through the hole V, the stack of C The entire copper foil C of the laminated film 72 of the layer film 71 and the second peripheral copper foil C is made of copper. Further, the layer film 72 is first placed adjacent to the first intermediate FPCB 61 and the second intermediate FpCB 62, and the laminated film 71 of the five C sheets and the laminated layer of the second peripheral copper foil c 13 1307614 *. The portion of the film 72 causes position sensing With the guide hole η, the blade connector terminal α is partially passed through the adhesive (for example, the portion other than the terminal α is placed next to each other = 1 = H, and the connector is soft. After this can be broken, The copper undulation of the laminated film 72 of the second peripheral surface and the second peripheral copper case C according to the unit type is covered with an open area according to the unit type ((4) after the wooding of the cover sheet 81 and the second peripheral cover sheet 82) , the completion of the fourth circumference, and the second peripheral FPCB 92 (S33)' at the end of the second peripheral FPCB 91 ► the second peripheral surface 2 pattern P and after the completion of the connector terminal CT (S34), The position sensing 丄 reference is punched according to the unit type, so that the 6th and the second Η can be used as the brush circuit board 100 (S35). The wrong position is used to make the position sensing guide The hole was tested by salt, and the sputum was suppressed by 2 ^ ^ MC . 4 ^ 72 „ ^; C ^ ^ ; * one (〇A) piece covered piece 1 The peripheral cover sheet 81 completes and insulates the first peripheral FPCB 91 and the second peripheral portion by the f-th sheet 82', and at the same time, to prevent external scratching, and the end portion of the pattern P of the second peripheral FPCB 92 is Ϊ i-end ΐ; electroplating, when the connection to the main circuit board and the LCD module is also completed, the connector plating can be performed by Au, Sn, Ag or SnPb, and connected to the main circuit board and the lcd module. A method of manufacturing a flexible printed circuit board according to a third embodiment of the present invention is shown in Fig. 3e#. Fig. 3 is a diagram showing a method of manufacturing a flexible printed circuit board according to a third embodiment of the present invention. As shown in Fig. 3a to Fig. 3c, the laminated film 4 of the first intermediate copper foil c and the second intermediate copper C are provided in the tape-reel type, respectively. And patterning the film according to the unit type, and simultaneously feeding and winding the second intermediate cover sheet 51 and the second intermediate cover sheet 52 in a tape form, and preparing the first intermediate FPCB 61 and the second intermediate FPCB 62 (S41), respectively. 'Trouble the second intermediate FpCM1 And the second intermediate FPCB 62 is overlapped, and the stack of the acoustic film 71 and the second peripheral copper foil C of the i-th peripheral copper foil c provided with the position sensing guide hole H in the upper and lower portions thereof are respectively wound and wound. The layer film 72 is simultaneously adhered to the via hole v according to the unit type, and then copper plating is performed (S42). Then, the laminated film of the second peripheral copper foil c according to the unit type and the second and peripheral copper foil C are used. After the copper foil c of the laminate 72 is patterned, the first outer cover film 83 and the second outer cover film 84 are provided in a tape-wound manner to complete the first! The peripheral FpcB91 is rsBi2 (psi3i!:;*1 ^ fpcb91 2 ^ ^ , and the figure P is 螭. Some of the connectors are plated, and the connector terminal (S44) is used, and the position sensing hole H is used as the reference. According to the line punching, it is possible to finally complete the inclusion of the 葙I 另 另 〇〇 〇〇 (S45). 70 匕 匕 3 稷 之 之 软 & & & & 以上 以上 以上 以上 以上 以上 以上 以上 以上 以上 以上 以上 以上 以上 以上 以上 以上 以上 以上 以上 以上 以上The core technology of the invention lies in: using the tape winding method 'and = tracking the correct position with the sensing of the guiding hole, such as: the sensing device, the cover film and the adhesive film positioning position of the cover sheet, etc. To improve productivity and reliability, and to limit the lateral width of copper pigs with a film thickness of 4〇~18: Parallel light, and make full use of the chrome metal pattern ^Use the fine pattern (1)ne Pattern), reduce the glass protection J Can be: now integrated so that 'relatively reduce the number of soft impressions; other changes in the process and composition can be understood as a variety of defects: 4 • 4 1307614 For example, the illustration of the copper foil given a row of Figure 3 3 "rows At the same time the situation of the process of patterning) 2 ί disabilities: and "and" - at the same time ", etc. only that - explain the operation of the girth of the columns also won this subject. The hall has a shape and is patented. [Simplified description of the drawings] Fig. 1a and Fig. 1b show a flow chart of a method of manufacturing the first brush circuit board of the present invention. The soft print of the anger of the moon brother

圖2a至圖2c係表示本發明第2者你游 電路板之製造方法的流程圖。 Λ施瓜4之軟性印刷 圖3 a至圖3 c係表示本發明篦q每 電路板之製造方法的流程圖。弟3只施形癌之敕性印刷 圖4係表示適用於本發明之 方法的圖案化過程之流程圖。 板之製造 【主要元件符號說明】 10 銅箔疊層膜 21覆蓋片 22 覆蓋膜 30 軟性印刷電路板 41 第1中間銅箔疊層膜 42 第2中間銅箔叠層膜 51 第1中間覆蓋膜 52 第2中間覆蓋膜Fig. 2a to Fig. 2c are flowcharts showing a method of manufacturing the second circuit board of the present invention. Soft printing of the melon 4 Fig. 3a to Fig. 3c are flowcharts showing the manufacturing method of the circuit board of the present invention. The third embodiment of the invention is shown in Figure 4, which is a flow chart showing the patterning process applicable to the method of the present invention. Manufacturing of the board [Description of main components] 10 Copper foil laminated film 21 Covering sheet 22 Covering film 30 Flexible printed circuit board 41 First intermediate copper foil laminated film 42 Second intermediate copper foil laminated film 51 First intermediate film 52 second intermediate film

61 第1中間FPCB61 1st intermediate FPCB

62 第2中間FPCB 71 第1外圍銅箔疊層膜 72 第2外圍銅箔疊層膜 81 第1外圍覆蓋片 82 第2外圍覆蓋片 16 1507614 4 83 第1外圍覆蓋膜 84 第2外圍覆蓋膜62 2nd intermediate FPCB 71 1st peripheral copper foil laminated film 72 2nd peripheral copper foil laminated film 81 1st peripheral cover sheet 82 2nd peripheral cover sheet 16 1507614 4 83 1st peripheral cover film 84 2nd outer cover film

91 第1外圍FPCB91 1st peripheral FPCB

92 第2外圍FPCB 10 0 軟性印刷電路板 C 銅簿 CT連接器端子 Η 位置感測用導向孔 Μ 光罩 Ρ 圖案 ® PR乾膜 V 通孔92 2nd Peripheral FPCB 10 0 Flexible Printed Circuit Board C Copper Book CT Connector Terminal Η Positioning Guide Hole Μ Photo Mask Ρ Pattern ® PR Dry Film V Through Hole

Claims (1)

1307614 4 * 十、申請專利範圍: 1 . 一種軟性印刷電路板之製造方法’其特徵在於包 含: ^別=卷帶式提供設有位置感測用導向孔之第1中 間銅f自之璺層膜以及第2中間銅箔之疊層膜,並根據單位 3別對該等膜進行圖案化,同時以卷帶式供給第丨中間覆 f膜以及第2中間覆蓋膜進行被覆,分別準備第1中間 FPCB以及第2中間FPCB之步驟; 、,以卷,式提供上述第1中間FPCB以及第2中間FPCB ,S 2 f :哲分!別以卷帶式供給於其上下部設有位置感測 V向孔之第1外圍銅箔之疊層膜以及第2 同時根據單位類別使其-部分黏著並形成通;: 後貫施鐘銅之步驟; 外圍=使上述第'外圍銅猪之叠層膜以及第2 =銅嶋化後,根據單位類別分別被 匕有ί放5域(〇Α)之第1外圍覆蓋片以及第2外圍覆 里,完成第1外圍FPCB以及第2外圍FPCB之步驟. 進行及第2外圍FPCB之圖案端部 連接裔%鑛’完成連接器端子之步驟;以 ’沖切以ίίΐ”測用導向孔為基準,根據單位類別進行 製作軟性印刷電路板之步驟。 含:2. —種軟性印刷電路板之製造方法,其特徵在於包 門钿J別,卷帶式提供設有位置感測用導向孔之第i中 曰、5 4之豐層膜以及第2中間銅羯之疊声膜, 類別對該等膜谁耔岡安几门± 層膜亚根據早位 FPCB二这ο : 膜進行被覆’分別準備第1中間 以及第2中間FPCB之步驟; 丄甲間 以卷帶式提供上述第丨中間FpcB以及第2中間啊B 18 1307614 * 製造方法,其中將光罩置於上述乾膜上進行曝光之步驟 (b)利用平行光。 以 8.如申請專利範圍第5項所述之軟性印刷電路板之 製造方法,其中上述圖案化根據單位類別,依據上述位 感測用導向孔之感測而實施。 9^^”利範圍第142類述之軟性印刷電路板 之製,,、中上述連接器電鍍以及沖切根據單位類 別,依據上述位置感測用導向孔之感測而實施。1307614 4 * X. Patent application scope: 1. A method for manufacturing a flexible printed circuit board, characterized in that it comprises: ^ 别 = tape-and-reel type providing a first intermediate copper f with a guide hole for position sensing The laminated film of the film and the second intermediate copper foil is patterned according to the unit 3, and the second intermediate film and the second intermediate film are wound and wound in a tape-wound type, and the first film is prepared. The intermediate FPCB and the second intermediate FPCB are provided; and the first intermediate FPCB and the second intermediate FPCB are provided in a roll, and the second intermediate FPCB, S 2 f: Zhefen; the tape is supplied to the upper and lower portions thereof for position sensing. The laminated film of the first peripheral copper foil of the V-direction hole and the second portion are simultaneously adhered and formed according to the unit type; the step of applying the copper to the rear; the periphery = the lamination of the above-mentioned 'peripheral copper pig After the film and the second = copper smelting, the steps of the first peripheral FPCB and the second peripheral FPCB are completed according to the unit type, the first peripheral cover sheet and the second peripheral cover of the 5 field (〇Α). Performing and patterning the end of the 2nd peripheral FPCB The step of the connector terminal; the step of manufacturing the flexible printed circuit board according to the unit type based on the 'punching and smearing the measuring guide hole'. The method includes: 2. A method for manufacturing a flexible printed circuit board, characterized in that The door 钿J, the tape-and-belt type provides the ith middle 曰, the 5 4 thick film and the 2nd intermediate gong of the sound hole film for the position sensing guide hole, and the class of the film ± layer film sub-according to the early FPCB two ο: film coating 'the steps of preparing the first intermediate and the second intermediate FPCB respectively; the armor is provided with the above-mentioned second intermediate FpcB and the second intermediate B 18 1307614 a manufacturing method in which a photomask is placed on the above-mentioned dry film for exposure (b), and a parallel printed light is used. The method for manufacturing a flexible printed circuit board according to claim 5, wherein the patterning is performed. According to the unit type, it is implemented according to the sensing of the above-mentioned position sensing guide hole. 9^^" The range of the soft printed circuit board described in the 142th category, the above-mentioned connector plating and punching according to the unit type, in accordance with And said position sensing embodiment of a sensing guide hole. 專利範圍第14 2項所述之軟性印刷電路 板之方法,其中上述銅箱之寬度為40〜180 fflm。The method of the flexible printed circuit board according to the above aspect, wherein the copper box has a width of 40 to 180 fflm. 2020
TW095122380A 2005-06-22 2006-06-22 Method for manufacturing flexible printed circuit board TWI307614B (en)

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US20080295327A1 (en) * 2007-06-01 2008-12-04 3M Innovative Properties Company Flexible circuit
KR101009415B1 (en) 2008-11-18 2011-01-19 삼성모바일디스플레이주식회사 Method for manufacturing electronic apparatus comprising plastic substrate, electronic apparatus manufactured by that method, and apparatus to be used in that method
CN102301280B (en) * 2008-12-23 2014-11-26 3M创新有限公司 Roll-to-roll digital photolithography
KR101051857B1 (en) * 2010-05-27 2011-07-25 우영관 Method of adhering additional plate to fpc product
DE102011003570A1 (en) * 2011-02-03 2012-08-09 Robert Bosch Gmbh Electrical connector for interconnecting e.g. gearbox control apparatus and strip conductor film in motor car, has electrically conductive junctions for forming electrical contact between terminal pins, flexible wiring layouts and bushes
KR101180355B1 (en) * 2012-02-21 2012-09-07 주식회사 비에이치 Manufacturing method of dual side multi layer typed flexible printed circuit board and dual side multi layer typed flexible printed circuit board manufactured by the method thereof
CN103978516A (en) * 2014-05-05 2014-08-13 厦门弘信电子科技股份有限公司 Through hole punching technology for rolled flexible circuit board
CN105870319B (en) * 2016-04-26 2019-03-05 贝骨新材料科技(上海)有限公司 A kind of roll-to-roll manufacturing method of strip piezoelectric film sensor
JP6679082B1 (en) * 2019-04-16 2020-04-15 山下マテリアル株式会社 Flexible wiring board
KR102137278B1 (en) * 2020-04-10 2020-07-23 김상봉 Method of manufacturing roll to roll FPCB with high speed punching
KR20210156005A (en) * 2020-06-17 2021-12-24 주식회사 엘지에너지솔루션 Method for manufacturing flexible printed circuit board
KR20220028752A (en) * 2020-08-31 2022-03-08 주식회사 두산 Method for manufacturing flexible printed circuit board, and flexible printed circuit board manufactured by the same
CN113438802B (en) * 2021-07-27 2022-05-20 友达光电(苏州)有限公司 Flexible circuit board and display device using same

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KR20060134475A (en) 2006-12-28
JP2007005805A (en) 2007-01-11
CN1886029A (en) 2006-12-27
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KR100666282B1 (en) 2007-01-09
JP4218768B2 (en) 2009-02-04

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