JP4218768B2 - フレキシブル回路基板の製造方法 - Google Patents

フレキシブル回路基板の製造方法 Download PDF

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Publication number
JP4218768B2
JP4218768B2 JP2006171777A JP2006171777A JP4218768B2 JP 4218768 B2 JP4218768 B2 JP 4218768B2 JP 2006171777 A JP2006171777 A JP 2006171777A JP 2006171777 A JP2006171777 A JP 2006171777A JP 4218768 B2 JP4218768 B2 JP 4218768B2
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JP
Japan
Prior art keywords
reel
copper foil
fpcb
circuit board
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006171777A
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English (en)
Japanese (ja)
Other versions
JP2007005805A (ja
Inventor
愉▲ヨン▼ 李
基浚 朴
潤弘 梁
Original Assignee
ディーケー ユーアイエル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ディーケー ユーアイエル株式会社 filed Critical ディーケー ユーアイエル株式会社
Publication of JP2007005805A publication Critical patent/JP2007005805A/ja
Application granted granted Critical
Publication of JP4218768B2 publication Critical patent/JP4218768B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2006171777A 2005-06-22 2006-06-21 フレキシブル回路基板の製造方法 Expired - Fee Related JP4218768B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050054171A KR100666282B1 (ko) 2005-06-22 2005-06-22 멀티 레이어 연성회로기판 제조방법

Publications (2)

Publication Number Publication Date
JP2007005805A JP2007005805A (ja) 2007-01-11
JP4218768B2 true JP4218768B2 (ja) 2009-02-04

Family

ID=37583941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006171777A Expired - Fee Related JP4218768B2 (ja) 2005-06-22 2006-06-21 フレキシブル回路基板の製造方法

Country Status (4)

Country Link
JP (1) JP4218768B2 (ko)
KR (1) KR100666282B1 (ko)
CN (1) CN1886029A (ko)
TW (1) TWI307614B (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080295327A1 (en) * 2007-06-01 2008-12-04 3M Innovative Properties Company Flexible circuit
KR101009415B1 (ko) 2008-11-18 2011-01-19 삼성모바일디스플레이주식회사 플라스틱 기판을 구비한 전자장치 제조방법, 이에 의해 제조된 전자장치 및 상기 제조방법에 사용되는 장치
WO2010075158A1 (en) * 2008-12-23 2010-07-01 3M Innovative Properties Company Roll-to-roll digital photolithography
KR101051857B1 (ko) 2010-05-27 2011-07-25 우영관 Ｆｐｃ 제품에 부재 플레이트를 부착하는 방법
DE102011003570A1 (de) * 2011-02-03 2012-08-09 Robert Bosch Gmbh Elektrische Verbindung sowie Verfahren zur Herstellung einer elektrischen Verbindung
KR101180355B1 (ko) * 2012-02-21 2012-09-07 주식회사 비에이치 양면형 다층 구조의 연성인쇄회로기판 제조방법 및 이를 이용하여 제조된 양면형 다층 구조의 연성인쇄회로기판
CN103978516A (zh) * 2014-05-05 2014-08-13 厦门弘信电子科技股份有限公司 卷状柔性线路板的通孔冲孔工艺
CN105870319B (zh) * 2016-04-26 2019-03-05 贝骨新材料科技（上海）有限公司 一种长条状压电薄膜传感器卷对卷制造方法
JP6679082B1 (ja) * 2019-04-16 2020-04-15 山下マテリアル株式会社 フレキシブル配線板
KR102137278B1 (ko) * 2020-04-10 2020-07-23 김상봉 고속타발기 연동형 정밀 롤투롤 소재 연성회로기판 제조 방법
KR20210156005A (ko) * 2020-06-17 2021-12-24 주식회사 엘지에너지솔루션 연성인쇄회로기판의 제조 방법
KR20220028752A (ko) * 2020-08-31 2022-03-08 주식회사 두산 연성 인쇄회로기판의 제조방법 및 이에 의해 제조된 연성 인쇄회로기판
CN113438802B (zh) * 2021-07-27 2022-05-20 友达光电（苏州）有限公司 软性电路板与应用其的显示装置

Also Published As

Publication number Publication date
KR100666282B1 (ko) 2007-01-09
CN1886029A (zh) 2006-12-27
TWI307614B (en) 2009-03-11
JP2007005805A (ja) 2007-01-11
KR20060134475A (ko) 2006-12-28
TW200704317A (en) 2007-01-16

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