TWI307411B - Testing device - Google Patents

Testing device Download PDF

Info

Publication number
TWI307411B
TWI307411B TW095120312A TW95120312A TWI307411B TW I307411 B TWI307411 B TW I307411B TW 095120312 A TW095120312 A TW 095120312A TW 95120312 A TW95120312 A TW 95120312A TW I307411 B TWI307411 B TW I307411B
Authority
TW
Taiwan
Prior art keywords
inspection
contact
wiring pattern
conductive
negative pressure
Prior art date
Application number
TW095120312A
Other languages
English (en)
Chinese (zh)
Other versions
TW200710404A (en
Inventor
Shigeki Ishikawa
Yosuke Mabune
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of TW200710404A publication Critical patent/TW200710404A/zh
Application granted granted Critical
Publication of TWI307411B publication Critical patent/TWI307411B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW095120312A 2005-06-08 2006-06-08 Testing device TWI307411B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005168593A JP5244288B2 (ja) 2005-06-08 2005-06-08 検査装置
JP2006011327 2006-06-06

Publications (2)

Publication Number Publication Date
TW200710404A TW200710404A (en) 2007-03-16
TWI307411B true TWI307411B (en) 2009-03-11

Family

ID=37498444

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120312A TWI307411B (en) 2005-06-08 2006-06-08 Testing device

Country Status (3)

Country Link
JP (1) JP5244288B2 (ja)
TW (1) TWI307411B (ja)
WO (1) WO2006132243A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425221B (zh) * 2010-11-26 2014-02-01 Nihon Micronics Kk Probe cards and semiconductor inspection devices and semiconductor inspection methods

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8225683B2 (en) * 2007-09-28 2012-07-24 Lam Research Corporation Wafer bow metrology arrangements and methods thereof
JP2012220451A (ja) * 2011-04-13 2012-11-12 Seiken Co Ltd 検査ユニット
CN111951877B (zh) * 2019-05-16 2024-06-25 第一检测有限公司 检测设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59122555U (ja) * 1983-02-08 1984-08-17 株式会社フジクラ プリント回路板検査装置
JPH0714927Y2 (ja) * 1988-11-17 1995-04-10 日置電機株式会社 回路基板検査装置におけるピンボード構造
JPH03199976A (ja) * 1989-12-27 1991-08-30 Toshiba Corp プローブカード
JPH05288802A (ja) * 1992-04-09 1993-11-05 Fuji Electric Co Ltd 半導体チップの電気特性検査方法およびウェーハプローバ
JPH10206480A (ja) * 1997-01-20 1998-08-07 Okano Denki Kk 導体回路基板検査装置における導体回路基板の支持方法
JP2000009785A (ja) * 1998-06-25 2000-01-14 Onishi Denshi Kk プリント基板検査装置
JP2000266799A (ja) * 1999-03-15 2000-09-29 Taiyo Kogyo Kk プリント基板検査装置
JP2001296325A (ja) * 2000-04-18 2001-10-26 Hioki Ee Corp 回路基板検査方法および回路基板検査装置
JP2003185695A (ja) * 2001-12-20 2003-07-03 Seiko Epson Corp 配線パターン検査方法および配線パターン検査装置
EP1496366A4 (en) * 2002-04-16 2005-09-14 Nhk Spring Co Ltd HOLDER FOR CONDUCTIVE CONTACT
JP2003322670A (ja) * 2002-04-30 2003-11-14 Kyoritsu Denki Kk プリント基板検査装置
JP2004271237A (ja) * 2003-03-05 2004-09-30 Tdk Corp 検査装置
JP4264310B2 (ja) * 2003-08-06 2009-05-13 日本電産リード株式会社 基板検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425221B (zh) * 2010-11-26 2014-02-01 Nihon Micronics Kk Probe cards and semiconductor inspection devices and semiconductor inspection methods

Also Published As

Publication number Publication date
JP5244288B2 (ja) 2013-07-24
JP2006343197A (ja) 2006-12-21
TW200710404A (en) 2007-03-16
WO2006132243A1 (ja) 2006-12-14

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees