TWI303248B - Vinyl silane compounds containing epoxy functionality - Google Patents

Vinyl silane compounds containing epoxy functionality Download PDF

Info

Publication number
TWI303248B
TWI303248B TW091122782A TW91122782A TWI303248B TW I303248 B TWI303248 B TW I303248B TW 091122782 A TW091122782 A TW 091122782A TW 91122782 A TW91122782 A TW 91122782A TW I303248 B TWI303248 B TW I303248B
Authority
TW
Taiwan
Prior art keywords
compound
vinyl
epoxy
compounds containing
functional group
Prior art date
Application number
TW091122782A
Other languages
English (en)
Chinese (zh)
Inventor
Osama M Musa
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Application granted granted Critical
Publication of TWI303248B publication Critical patent/TWI303248B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804—Compounds having Si-O-C linkages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
TW091122782A 2001-09-28 2002-09-27 Vinyl silane compounds containing epoxy functionality TWI303248B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/966,454 US6590018B2 (en) 2001-09-28 2001-09-28 Vinyl silane compounds containing epoxy functionality

Publications (1)

Publication Number Publication Date
TWI303248B true TWI303248B (en) 2008-11-21

Family

ID=25511434

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091122782A TWI303248B (en) 2001-09-28 2002-09-27 Vinyl silane compounds containing epoxy functionality

Country Status (6)

Country Link
US (1) US6590018B2 (https=)
EP (1) EP1430063A1 (https=)
JP (1) JP4309267B2 (https=)
KR (1) KR100973777B1 (https=)
TW (1) TWI303248B (https=)
WO (1) WO2003029255A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7183353B2 (en) * 2004-04-29 2007-02-27 Hewlett-Packard Development Company, L.P. UV curable coating composition
JP6828281B2 (ja) * 2015-06-25 2021-02-10 東洋インキＳｃホールディングス株式会社 活性エネルギー線重合性樹脂組成物
US11028208B2 (en) 2016-04-21 2021-06-08 Bridgestone Corporation Terminal-functionalized polymer, rubber composition containing same and related processes
US10297564B2 (en) * 2017-10-05 2019-05-21 Infineon Technologies Ag Semiconductor die attach system and method
WO2019101551A1 (en) * 2017-11-23 2019-05-31 Basf Se Herbicidal phenylethers

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3803196A (en) 1971-03-01 1974-04-09 Gen Electric Aliphatically unsaturated organopolysiloxanes
US3770768A (en) 1971-03-01 1973-11-06 Gen Electric Aliphatically unsaturated organopolysiloxanes
US3944707A (en) * 1973-04-02 1976-03-16 Owens-Corning Fiberglas Corporation Glass fibers coated with compositions containing complex organo silicon compounds
JPS57141447A (en) 1981-02-27 1982-09-01 Toshiba Silicone Co Ltd Polyorganosiloxane composition curable at room temperature
GB8531568D0 (en) 1985-12-21 1986-02-05 Dow Corning Sa Curable organopolysiloxane compositions
JPH0813825B2 (ja) 1987-09-11 1996-02-14 東芝シリコーン株式会社 エポキシ基含有有機ケイ素化合物
JPS6469607A (en) 1987-09-11 1989-03-15 Japan Synthetic Rubber Co Ltd Manufacture of modified acrylic copolymer
JPH02251556A (ja) 1989-03-25 1990-10-09 Toshiba Silicone Co Ltd 変性アクリルゴム組成物
JP3836925B2 (ja) 1997-01-22 2006-10-25 株式会社日本触媒 液晶表示板用スペーサーの製造方法

Also Published As

Publication number Publication date
EP1430063A1 (en) 2004-06-23
US6590018B2 (en) 2003-07-08
US20030083452A1 (en) 2003-05-01
WO2003029255A1 (en) 2003-04-10
JP2005504128A (ja) 2005-02-10
KR100973777B1 (ko) 2010-08-03
KR20040047840A (ko) 2004-06-05
JP4309267B2 (ja) 2009-08-05

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