TWI301339B - - Google Patents

Download PDF

Info

Publication number
TWI301339B
TWI301339B TW095132019A TW95132019A TWI301339B TW I301339 B TWI301339 B TW I301339B TW 095132019 A TW095132019 A TW 095132019A TW 95132019 A TW95132019 A TW 95132019A TW I301339 B TWI301339 B TW I301339B
Authority
TW
Taiwan
Prior art keywords
adhesive
tape
adhesive tape
bonding
roll
Prior art date
Application number
TW095132019A
Other languages
English (en)
Chinese (zh)
Other versions
TW200715672A (en
Inventor
Mitsuru Hirao
Kouichi Kawamata
Takashi Seki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200715672A publication Critical patent/TW200715672A/zh
Application granted granted Critical
Publication of TWI301339B publication Critical patent/TWI301339B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Winding, Rewinding, Material Storage Devices (AREA)
TW095132019A 2005-08-31 2006-08-30 Adhesive reel TW200715672A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005251268 2005-08-31
JP2006179765A JP4238885B2 (ja) 2005-08-31 2006-06-29 接着剤リール及び接着剤テープ

Publications (2)

Publication Number Publication Date
TW200715672A TW200715672A (en) 2007-04-16
TWI301339B true TWI301339B (enExample) 2008-09-21

Family

ID=37978091

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132019A TW200715672A (en) 2005-08-31 2006-08-30 Adhesive reel

Country Status (4)

Country Link
JP (1) JP4238885B2 (enExample)
KR (1) KR100889648B1 (enExample)
CN (5) CN102514986B (enExample)
TW (1) TW200715672A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5050832B2 (ja) * 2007-12-19 2012-10-17 日立化成工業株式会社 接着テープ用リール
WO2009133901A1 (ja) * 2008-04-28 2009-11-05 日立化成工業株式会社 回路接続材料、フィルム状接着剤、接着剤リール及び回路接続構造体
CN102037615B (zh) * 2009-02-27 2013-08-28 日立化成株式会社 粘接材料卷轴
WO2013024544A1 (ja) * 2011-08-18 2013-02-21 日立化成工業株式会社 接着材リール
KR101568659B1 (ko) * 2013-03-29 2015-11-12 제일모직주식회사 도전성 접착층을 포함하는 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
JP2016160027A (ja) * 2015-02-27 2016-09-05 デクセリアルズ株式会社 接着フィルム用リール及びこれに使用される連結体
CN107207181B (zh) * 2015-02-27 2020-10-20 迪睿合株式会社 卷筒体、薄膜连结体、薄膜卷装体及薄膜连结体的制造方法
CN107298330B (zh) * 2016-04-14 2020-06-12 康菲德斯合股公司 在芯上布置材料幅的方法
JP6668164B2 (ja) * 2016-05-20 2020-03-18 デクセリアルズ株式会社 接着テープ構造体
CN109575829B (zh) * 2017-12-29 2021-05-07 宁波大榭开发区综研化学有限公司 一种段差多层复合膜和卷材及其制备方法
JP7614099B2 (ja) * 2019-08-26 2025-01-15 リンテック株式会社 積層体の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04332782A (ja) * 1991-05-07 1992-11-19 Sekisui Chem Co Ltd ロール状粘着テープ
JPH05330722A (ja) * 1992-05-25 1993-12-14 Nitto Denko Corp テープディスペンサー
JPH0724947U (ja) * 1993-10-07 1995-05-12 祐久 小松 粘着テープ
CH689482A5 (de) * 1995-07-31 1999-05-14 Tela Papierfabrik Ag Papierrolle mit einem Endblattverschluss.
JP4465788B2 (ja) * 2000-03-28 2010-05-19 日立化成工業株式会社 異方導電材テープ及びリール
EP1249729A3 (en) * 2001-04-12 2005-07-13 Fuji Photo Film Co., Ltd. Rolled article, and method of and apparatus for processing rolled article
DE10123980B4 (de) * 2001-05-17 2008-01-10 Tesa Ag Abschlussbandage
JP4239585B2 (ja) * 2002-12-24 2009-03-18 日立化成工業株式会社 接着剤テープの接続方法及び接着剤テープ接続体
KR100838880B1 (ko) * 2002-07-30 2008-06-16 히다치 가세고교 가부시끼가이샤 접착재 테이프, 그 접속방법, 제조방법, 압착방법
JP2004077789A (ja) * 2002-08-19 2004-03-11 Konica Minolta Holdings Inc 遮光フランジ部材

Also Published As

Publication number Publication date
JP2007092028A (ja) 2007-04-12
CN101683934A (zh) 2010-03-31
KR20070026029A (ko) 2007-03-08
CN101792075A (zh) 2010-08-04
JP4238885B2 (ja) 2009-03-18
CN102514986B (zh) 2016-04-27
KR100889648B1 (ko) 2009-03-19
CN101665195B (zh) 2012-07-25
CN1923654A (zh) 2007-03-07
CN101665195A (zh) 2010-03-10
CN102514986A (zh) 2012-06-27
CN101683934B (zh) 2012-06-13
TW200715672A (en) 2007-04-16

Similar Documents

Publication Publication Date Title
TWI301339B (enExample)
JP4465788B2 (ja) 異方導電材テープ及びリール
JP4596089B2 (ja) 接着材リール
JP4596086B2 (ja) 接着材リール
JP2004059776A (ja) 異方導電材テープ
CN101233655B (zh) 各向异性导电膜及其制造方法
KR102286222B1 (ko) 접착 테이프 구조체 및 접착 테이프 수용체
CN109072025B (zh) 粘接带构造体
CN108350324A (zh) 膜卷装体和膜卷装体的制造方法
JP6696826B2 (ja) 接着テープ構造体
TWI480221B (zh) 電路連接用膠帶、接著劑捲軸以及電路連接體的製造方法
JP3712334B2 (ja) 異方導電性接着フィルム
JP6696827B2 (ja) 接着テープ構造体
JP7173055B2 (ja) 部材接続方法及び接着テープ
JP6696828B2 (ja) 接着テープ構造体
JP6668164B2 (ja) 接着テープ構造体
JP2004196540A (ja) 接着材テープの接続方法
TWI774850B (zh) 接著帶和接著帶捲繞捲筒
JP4844661B2 (ja) 異方導電材テープ
JP2007231236A (ja) 接着テープ及びリール巻き接着テープ
JP2004211018A (ja) 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法
JP2007331949A (ja) 接着材リール
JP4349450B2 (ja) 接着材テープの接続方法及び接着材テープ接続体
JP2009138203A (ja) 異方導電材テープ
JP2005330297A (ja) 接着材テープの接着材形成方法