JP4238885B2 - 接着剤リール及び接着剤テープ - Google Patents

接着剤リール及び接着剤テープ Download PDF

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Publication number
JP4238885B2
JP4238885B2 JP2006179765A JP2006179765A JP4238885B2 JP 4238885 B2 JP4238885 B2 JP 4238885B2 JP 2006179765 A JP2006179765 A JP 2006179765A JP 2006179765 A JP2006179765 A JP 2006179765A JP 4238885 B2 JP4238885 B2 JP 4238885B2
Authority
JP
Japan
Prior art keywords
adhesive
reel
adhesive tape
tape
support film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006179765A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007092028A5 (enExample
JP2007092028A (ja
Inventor
充 平尾
耕一 川俣
貴志 関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2006179765A priority Critical patent/JP4238885B2/ja
Priority to KR1020060079857A priority patent/KR100889648B1/ko
Priority to CN2009101684040A priority patent/CN101665195B/zh
Priority to TW095132019A priority patent/TW200715672A/zh
Priority to CN201110307866.3A priority patent/CN102514986B/zh
Priority to CN201010003397A priority patent/CN101792075A/zh
Priority to CNA2006101219806A priority patent/CN1923654A/zh
Priority to CN2009101682990A priority patent/CN101683934B/zh
Publication of JP2007092028A publication Critical patent/JP2007092028A/ja
Publication of JP2007092028A5 publication Critical patent/JP2007092028A5/ja
Application granted granted Critical
Publication of JP4238885B2 publication Critical patent/JP4238885B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Winding, Rewinding, Material Storage Devices (AREA)
JP2006179765A 2005-08-31 2006-06-29 接着剤リール及び接着剤テープ Expired - Fee Related JP4238885B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2006179765A JP4238885B2 (ja) 2005-08-31 2006-06-29 接着剤リール及び接着剤テープ
KR1020060079857A KR100889648B1 (ko) 2005-08-31 2006-08-23 접착제 릴
TW095132019A TW200715672A (en) 2005-08-31 2006-08-30 Adhesive reel
CN201110307866.3A CN102514986B (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN2009101684040A CN101665195B (zh) 2005-08-31 2006-08-30 一种粘接剂带以及粘结剂带的引出方法
CN201010003397A CN101792075A (zh) 2005-08-31 2006-08-30 粘接剂带卷
CNA2006101219806A CN1923654A (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN2009101682990A CN101683934B (zh) 2005-08-31 2006-08-30 粘接剂带卷

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005251268 2005-08-31
JP2006179765A JP4238885B2 (ja) 2005-08-31 2006-06-29 接着剤リール及び接着剤テープ

Publications (3)

Publication Number Publication Date
JP2007092028A JP2007092028A (ja) 2007-04-12
JP2007092028A5 JP2007092028A5 (enExample) 2007-10-04
JP4238885B2 true JP4238885B2 (ja) 2009-03-18

Family

ID=37978091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006179765A Expired - Fee Related JP4238885B2 (ja) 2005-08-31 2006-06-29 接着剤リール及び接着剤テープ

Country Status (4)

Country Link
JP (1) JP4238885B2 (enExample)
KR (1) KR100889648B1 (enExample)
CN (5) CN102514986B (enExample)
TW (1) TW200715672A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5050832B2 (ja) * 2007-12-19 2012-10-17 日立化成工業株式会社 接着テープ用リール
WO2009133901A1 (ja) * 2008-04-28 2009-11-05 日立化成工業株式会社 回路接続材料、フィルム状接着剤、接着剤リール及び回路接続構造体
CN102037615B (zh) * 2009-02-27 2013-08-28 日立化成株式会社 粘接材料卷轴
WO2013024544A1 (ja) * 2011-08-18 2013-02-21 日立化成工業株式会社 接着材リール
KR101568659B1 (ko) * 2013-03-29 2015-11-12 제일모직주식회사 도전성 접착층을 포함하는 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
JP2016160027A (ja) * 2015-02-27 2016-09-05 デクセリアルズ株式会社 接着フィルム用リール及びこれに使用される連結体
CN107207181B (zh) * 2015-02-27 2020-10-20 迪睿合株式会社 卷筒体、薄膜连结体、薄膜卷装体及薄膜连结体的制造方法
CN107298330B (zh) * 2016-04-14 2020-06-12 康菲德斯合股公司 在芯上布置材料幅的方法
JP6668164B2 (ja) * 2016-05-20 2020-03-18 デクセリアルズ株式会社 接着テープ構造体
CN109575829B (zh) * 2017-12-29 2021-05-07 宁波大榭开发区综研化学有限公司 一种段差多层复合膜和卷材及其制备方法
JP7614099B2 (ja) * 2019-08-26 2025-01-15 リンテック株式会社 積層体の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04332782A (ja) * 1991-05-07 1992-11-19 Sekisui Chem Co Ltd ロール状粘着テープ
JPH05330722A (ja) * 1992-05-25 1993-12-14 Nitto Denko Corp テープディスペンサー
JPH0724947U (ja) * 1993-10-07 1995-05-12 祐久 小松 粘着テープ
CH689482A5 (de) * 1995-07-31 1999-05-14 Tela Papierfabrik Ag Papierrolle mit einem Endblattverschluss.
JP4465788B2 (ja) * 2000-03-28 2010-05-19 日立化成工業株式会社 異方導電材テープ及びリール
EP1249729A3 (en) * 2001-04-12 2005-07-13 Fuji Photo Film Co., Ltd. Rolled article, and method of and apparatus for processing rolled article
DE10123980B4 (de) * 2001-05-17 2008-01-10 Tesa Ag Abschlussbandage
JP4239585B2 (ja) * 2002-12-24 2009-03-18 日立化成工業株式会社 接着剤テープの接続方法及び接着剤テープ接続体
KR100838880B1 (ko) * 2002-07-30 2008-06-16 히다치 가세고교 가부시끼가이샤 접착재 테이프, 그 접속방법, 제조방법, 압착방법
JP2004077789A (ja) * 2002-08-19 2004-03-11 Konica Minolta Holdings Inc 遮光フランジ部材

Also Published As

Publication number Publication date
JP2007092028A (ja) 2007-04-12
CN101683934A (zh) 2010-03-31
KR20070026029A (ko) 2007-03-08
CN101792075A (zh) 2010-08-04
CN102514986B (zh) 2016-04-27
KR100889648B1 (ko) 2009-03-19
TWI301339B (enExample) 2008-09-21
CN101665195B (zh) 2012-07-25
CN1923654A (zh) 2007-03-07
CN101665195A (zh) 2010-03-10
CN102514986A (zh) 2012-06-27
CN101683934B (zh) 2012-06-13
TW200715672A (en) 2007-04-16

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