KR100889648B1 - 접착제 릴 - Google Patents

접착제 릴 Download PDF

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Publication number
KR100889648B1
KR100889648B1 KR1020060079857A KR20060079857A KR100889648B1 KR 100889648 B1 KR100889648 B1 KR 100889648B1 KR 1020060079857 A KR1020060079857 A KR 1020060079857A KR 20060079857 A KR20060079857 A KR 20060079857A KR 100889648 B1 KR100889648 B1 KR 100889648B1
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KR
South Korea
Prior art keywords
adhesive
reel
adhesive tape
tape
support film
Prior art date
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KR1020060079857A
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English (en)
Korean (ko)
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KR20070026029A (ko
Inventor
미츠루 히라오
코우이치 카와마타
타카시 세키
Original Assignee
히다치 가세고교 가부시끼가이샤
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Publication of KR20070026029A publication Critical patent/KR20070026029A/ko
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Publication of KR100889648B1 publication Critical patent/KR100889648B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Winding, Rewinding, Material Storage Devices (AREA)
KR1020060079857A 2005-08-31 2006-08-23 접착제 릴 Active KR100889648B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00251268 2005-08-31
JP2005251268 2005-08-31
JP2006179765A JP4238885B2 (ja) 2005-08-31 2006-06-29 接着剤リール及び接着剤テープ
JPJP-P-2006-00179765 2006-06-29

Publications (2)

Publication Number Publication Date
KR20070026029A KR20070026029A (ko) 2007-03-08
KR100889648B1 true KR100889648B1 (ko) 2009-03-19

Family

ID=37978091

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060079857A Active KR100889648B1 (ko) 2005-08-31 2006-08-23 접착제 릴

Country Status (4)

Country Link
JP (1) JP4238885B2 (enExample)
KR (1) KR100889648B1 (enExample)
CN (5) CN102514986B (enExample)
TW (1) TW200715672A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5050832B2 (ja) * 2007-12-19 2012-10-17 日立化成工業株式会社 接着テープ用リール
WO2009133901A1 (ja) * 2008-04-28 2009-11-05 日立化成工業株式会社 回路接続材料、フィルム状接着剤、接着剤リール及び回路接続構造体
CN102037615B (zh) * 2009-02-27 2013-08-28 日立化成株式会社 粘接材料卷轴
WO2013024544A1 (ja) * 2011-08-18 2013-02-21 日立化成工業株式会社 接着材リール
KR101568659B1 (ko) * 2013-03-29 2015-11-12 제일모직주식회사 도전성 접착층을 포함하는 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
JP2016160027A (ja) * 2015-02-27 2016-09-05 デクセリアルズ株式会社 接着フィルム用リール及びこれに使用される連結体
CN107207181B (zh) * 2015-02-27 2020-10-20 迪睿合株式会社 卷筒体、薄膜连结体、薄膜卷装体及薄膜连结体的制造方法
CN107298330B (zh) * 2016-04-14 2020-06-12 康菲德斯合股公司 在芯上布置材料幅的方法
JP6668164B2 (ja) * 2016-05-20 2020-03-18 デクセリアルズ株式会社 接着テープ構造体
CN109575829B (zh) * 2017-12-29 2021-05-07 宁波大榭开发区综研化学有限公司 一种段差多层复合膜和卷材及其制备方法
JP7614099B2 (ja) * 2019-08-26 2025-01-15 リンテック株式会社 積層体の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050023355A (ko) * 2002-07-30 2005-03-09 히다치 가세고교 가부시끼가이샤 접착재 테이프, 그 접속방법, 제조방법, 압착방법, 접착재 릴, 접착장치, 접착재 테이프 카세트, 이것을 사용한 접착제의 압착방법 및 이방도전재 테이프

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04332782A (ja) * 1991-05-07 1992-11-19 Sekisui Chem Co Ltd ロール状粘着テープ
JPH05330722A (ja) * 1992-05-25 1993-12-14 Nitto Denko Corp テープディスペンサー
JPH0724947U (ja) * 1993-10-07 1995-05-12 祐久 小松 粘着テープ
CH689482A5 (de) * 1995-07-31 1999-05-14 Tela Papierfabrik Ag Papierrolle mit einem Endblattverschluss.
JP4465788B2 (ja) * 2000-03-28 2010-05-19 日立化成工業株式会社 異方導電材テープ及びリール
EP1249729A3 (en) * 2001-04-12 2005-07-13 Fuji Photo Film Co., Ltd. Rolled article, and method of and apparatus for processing rolled article
DE10123980B4 (de) * 2001-05-17 2008-01-10 Tesa Ag Abschlussbandage
JP4239585B2 (ja) * 2002-12-24 2009-03-18 日立化成工業株式会社 接着剤テープの接続方法及び接着剤テープ接続体
JP2004077789A (ja) * 2002-08-19 2004-03-11 Konica Minolta Holdings Inc 遮光フランジ部材

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050023355A (ko) * 2002-07-30 2005-03-09 히다치 가세고교 가부시끼가이샤 접착재 테이프, 그 접속방법, 제조방법, 압착방법, 접착재 릴, 접착장치, 접착재 테이프 카세트, 이것을 사용한 접착제의 압착방법 및 이방도전재 테이프

Also Published As

Publication number Publication date
JP2007092028A (ja) 2007-04-12
CN101683934A (zh) 2010-03-31
KR20070026029A (ko) 2007-03-08
CN101792075A (zh) 2010-08-04
JP4238885B2 (ja) 2009-03-18
CN102514986B (zh) 2016-04-27
TWI301339B (enExample) 2008-09-21
CN101665195B (zh) 2012-07-25
CN1923654A (zh) 2007-03-07
CN101665195A (zh) 2010-03-10
CN102514986A (zh) 2012-06-27
CN101683934B (zh) 2012-06-13
TW200715672A (en) 2007-04-16

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