CN102514986B - 粘接剂带卷 - Google Patents

粘接剂带卷 Download PDF

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Publication number
CN102514986B
CN102514986B CN201110307866.3A CN201110307866A CN102514986B CN 102514986 B CN102514986 B CN 102514986B CN 201110307866 A CN201110307866 A CN 201110307866A CN 102514986 B CN102514986 B CN 102514986B
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CN
China
Prior art keywords
adhesive
mentioned
adhesive tape
support film
arbitrary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201110307866.3A
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English (en)
Chinese (zh)
Other versions
CN102514986A (zh
Inventor
平尾充
川俣耕一
关贵志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN102514986A publication Critical patent/CN102514986A/zh
Application granted granted Critical
Publication of CN102514986B publication Critical patent/CN102514986B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Adhesive Tapes (AREA)
  • Winding, Rewinding, Material Storage Devices (AREA)
  • Die Bonding (AREA)
CN201110307866.3A 2005-08-31 2006-08-30 粘接剂带卷 Active CN102514986B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2005-251268 2005-08-31
JP2005251268 2005-08-31
JP2006179765A JP4238885B2 (ja) 2005-08-31 2006-06-29 接着剤リール及び接着剤テープ
JP2006-179765 2006-06-29
CNA2006101219806A CN1923654A (zh) 2005-08-31 2006-08-30 粘接剂带卷

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNA2006101219806A Division CN1923654A (zh) 2005-08-31 2006-08-30 粘接剂带卷

Publications (2)

Publication Number Publication Date
CN102514986A CN102514986A (zh) 2012-06-27
CN102514986B true CN102514986B (zh) 2016-04-27

Family

ID=37978091

Family Applications (5)

Application Number Title Priority Date Filing Date
CN201110307866.3A Active CN102514986B (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN2009101684040A Active CN101665195B (zh) 2005-08-31 2006-08-30 一种粘接剂带以及粘结剂带的引出方法
CN201010003397A Pending CN101792075A (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN2009101682990A Active CN101683934B (zh) 2005-08-31 2006-08-30 粘接剂带卷
CNA2006101219806A Pending CN1923654A (zh) 2005-08-31 2006-08-30 粘接剂带卷

Family Applications After (4)

Application Number Title Priority Date Filing Date
CN2009101684040A Active CN101665195B (zh) 2005-08-31 2006-08-30 一种粘接剂带以及粘结剂带的引出方法
CN201010003397A Pending CN101792075A (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN2009101682990A Active CN101683934B (zh) 2005-08-31 2006-08-30 粘接剂带卷
CNA2006101219806A Pending CN1923654A (zh) 2005-08-31 2006-08-30 粘接剂带卷

Country Status (4)

Country Link
JP (1) JP4238885B2 (enExample)
KR (1) KR100889648B1 (enExample)
CN (5) CN102514986B (enExample)
TW (1) TW200715672A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5050832B2 (ja) * 2007-12-19 2012-10-17 日立化成工業株式会社 接着テープ用リール
WO2009133901A1 (ja) * 2008-04-28 2009-11-05 日立化成工業株式会社 回路接続材料、フィルム状接着剤、接着剤リール及び回路接続構造体
CN102037615B (zh) * 2009-02-27 2013-08-28 日立化成株式会社 粘接材料卷轴
WO2013024544A1 (ja) * 2011-08-18 2013-02-21 日立化成工業株式会社 接着材リール
KR101568659B1 (ko) * 2013-03-29 2015-11-12 제일모직주식회사 도전성 접착층을 포함하는 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
JP2016160027A (ja) * 2015-02-27 2016-09-05 デクセリアルズ株式会社 接着フィルム用リール及びこれに使用される連結体
CN107207181B (zh) * 2015-02-27 2020-10-20 迪睿合株式会社 卷筒体、薄膜连结体、薄膜卷装体及薄膜连结体的制造方法
CN107298330B (zh) * 2016-04-14 2020-06-12 康菲德斯合股公司 在芯上布置材料幅的方法
JP6668164B2 (ja) * 2016-05-20 2020-03-18 デクセリアルズ株式会社 接着テープ構造体
CN109575829B (zh) * 2017-12-29 2021-05-07 宁波大榭开发区综研化学有限公司 一种段差多层复合膜和卷材及其制备方法
JP7614099B2 (ja) * 2019-08-26 2025-01-15 リンテック株式会社 積層体の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1380224A (zh) * 2001-04-12 2002-11-20 富士胶片株式会社 卷状物品以及加工卷状物品的方法和装置
JP4465788B2 (ja) * 2000-03-28 2010-05-19 日立化成工業株式会社 異方導電材テープ及びリール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04332782A (ja) * 1991-05-07 1992-11-19 Sekisui Chem Co Ltd ロール状粘着テープ
JPH05330722A (ja) * 1992-05-25 1993-12-14 Nitto Denko Corp テープディスペンサー
JPH0724947U (ja) * 1993-10-07 1995-05-12 祐久 小松 粘着テープ
CH689482A5 (de) * 1995-07-31 1999-05-14 Tela Papierfabrik Ag Papierrolle mit einem Endblattverschluss.
DE10123980B4 (de) * 2001-05-17 2008-01-10 Tesa Ag Abschlussbandage
JP4239585B2 (ja) * 2002-12-24 2009-03-18 日立化成工業株式会社 接着剤テープの接続方法及び接着剤テープ接続体
KR100838880B1 (ko) * 2002-07-30 2008-06-16 히다치 가세고교 가부시끼가이샤 접착재 테이프, 그 접속방법, 제조방법, 압착방법
JP2004077789A (ja) * 2002-08-19 2004-03-11 Konica Minolta Holdings Inc 遮光フランジ部材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4465788B2 (ja) * 2000-03-28 2010-05-19 日立化成工業株式会社 異方導電材テープ及びリール
CN1380224A (zh) * 2001-04-12 2002-11-20 富士胶片株式会社 卷状物品以及加工卷状物品的方法和装置

Also Published As

Publication number Publication date
JP2007092028A (ja) 2007-04-12
CN101683934A (zh) 2010-03-31
KR20070026029A (ko) 2007-03-08
CN101792075A (zh) 2010-08-04
JP4238885B2 (ja) 2009-03-18
KR100889648B1 (ko) 2009-03-19
TWI301339B (enExample) 2008-09-21
CN101665195B (zh) 2012-07-25
CN1923654A (zh) 2007-03-07
CN101665195A (zh) 2010-03-10
CN102514986A (zh) 2012-06-27
CN101683934B (zh) 2012-06-13
TW200715672A (en) 2007-04-16

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Address after: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Applicant after: HITACHI CHEMICAL Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: HITACHI CHEMICAL Co.,Ltd.

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GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Patentee after: Lishennoco Co.,Ltd.

Address before: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Patentee before: HITACHI CHEMICAL Co.,Ltd.

CP01 Change in the name or title of a patent holder