TWI480221B - 電路連接用膠帶、接著劑捲軸以及電路連接體的製造方法 - Google Patents

電路連接用膠帶、接著劑捲軸以及電路連接體的製造方法 Download PDF

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TWI480221B
TWI480221B TW101107996A TW101107996A TWI480221B TW I480221 B TWI480221 B TW I480221B TW 101107996 A TW101107996 A TW 101107996A TW 101107996 A TW101107996 A TW 101107996A TW I480221 B TWI480221 B TW I480221B
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Taiwan
Prior art keywords
tape
circuit
adhesive layer
adhesive
substrate
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TW101107996A
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English (en)
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TW201242884A (en
Inventor
Takashi Tatsuzawa
Tohru Fujinawa
Takaaki Ishikawa
Takashi Seki
Kouji Kobayashi
Kotaro Seki
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Hitachi Chemical Co Ltd
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Publication of TW201242884A publication Critical patent/TW201242884A/zh
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Publication of TWI480221B publication Critical patent/TWI480221B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/18—Constructional details
    • B65H75/28—Arrangements for positively securing ends of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H26/00—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms
    • B65H26/06—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms responsive to predetermined lengths of webs
    • B65H26/066—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms responsive to predetermined lengths of webs responsive to information, e.g. printed mark, on the web or web roll
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
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    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
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Description

電路連接用膠帶、接著劑捲軸以及電路連接體的製造 方法
本發明是有關於電路連接用膠帶及接著劑捲軸。
先前，用以將多個具有電極的被連接構件彼此進行電性連接，而製造電路連接體的連接材料，是使用異方性導電膜(ACF：Anisotropic Conductive Film)。此異方性導電膜是，在將IC(integrated circuit，積體電路)、LSI(large scale integrated circuit，大型積體電路)等半導體元件或封裝等被連接構件連接於印刷配線基板、LCD(liquid-crystal display，液晶顯示器)用玻璃基板、軟性印刷基板等基板時，以保持相對的電極彼此的導通狀態，並保持鄰接的電極彼此的絕緣的方式，進行電性連接與機械性固著的連接材料。另外，連接材料除了異方性導電膜外，亦已知非導電膜(NCF：Non-Conductive film)等。
上述連接材料包含：含有熱硬化性樹脂的接著劑成分、以及為異方性導電膜時根據需要而調配的導電粒子；在聚對苯二甲酸乙二酯膜(PET)等基材上，形成為膜狀作為接著劑層。並且，將此膜狀的整幅以成為適合於用途的寬度的方式切割成膠帶狀，而製成電路連接用膠帶，將此電路連接用膠帶沿著捲芯捲繞而製造捲繞體的接著劑捲軸(參照專利文獻1)。
電路連接用膠帶有時設置有終端膠帶。終端膠帶具有削減不使用而廢棄的接著劑層的作用。即，藉由電路連接 體的製造時所使用的壓接裝置，在接著劑捲軸的安裝位置與進行壓接作業的位置之間存在特定間隔，在使用將電路連接用膠帶沿著捲芯直接捲繞而成的接著劑捲軸時，在捲出結束而更換為新的接著劑捲軸時，上述特定的間隔所殘留的接著劑層不使用而廢棄。因此，藉由在電路連接用膠帶的終端部附近設置終端膠帶，而防止接著劑層殘留於上述特定的間隔，可削減不使用而廢棄的接著劑層。
另外，電路連接用膠帶有時設置有終端標記。終端標記由於使電路連接用膠帶的終端部可視覺辨認，而有防止因不恰當地拉出電路連接用膠帶引起的壓接裝置的破損的作用。
先前技術文獻
專利文獻
專利文獻1：日本專利特開2003-34468號公報
然而，使電路連接體的連接可靠性降低的原因之一是有被稱為黏連的現象。此黏連是在自接著劑捲軸拉出電路連接用膠帶而使用時，接著劑層轉印至基材背面的現象。若產生黏連，則無法將必需量的接著劑層配置在被連接構件上的特定位置，而有連接部的電性連接或機械性固著不充分的擔憂。
另外，與黏連不同，存在空轉的現象，即在拉出電路連接用膠帶時，在電路連接用膠帶的基材背面、與積層於其上的接著劑層之間發生滑動，藉此捲軸空轉。產生空轉時，形成為捲繞體的電路連接用膠帶緩慢捲結，而有引起 黏連的擔憂。而且亦有引起如下現象的擔憂：即沿著捲芯捲繞形成為捲繞體的電路連接用膠帶的一部分，由於空轉而向捲軸的軸方向伸出，此伸出的電路連接用膠帶捲入至設置於形成為捲繞體的電路連接用膠帶的側面與捲芯的兩端的側板捲軸之間的間隙，最後直至捲軸破壞而無法捲出。
而且，近年來，在使用電路連接用膠帶的電路連接體的製造中，要求低溫短時間連接，因此使用丙烯酸系接著劑的情況增多。然而，藉由丙烯酸系接著劑製作捲軸品時，因捲取時的張力而接著劑成分容易自捲軸端面溢出，無法藉由較高的張力捲取，因此特別是空轉容易大量發生。另外，在環氧系接著劑時，根據單體成分的量接著劑容易自捲軸端面溢出且不得不以低張力捲取，此種電路連接用膠帶容易發生空轉。另外，在包含為了應對高精細而提高導電粒子密度的異方性導電層及非導電層的2層的電路連接用膠帶時，由於異方性導電層的黏膩性降低，因而有時在基材背面與積層於其上的異方性導電層之間發生滑動，而發生空轉。另外，在厚度為10μm左右的較薄的電路連接用膠帶中，由於黏膩性降低，因而亦有時在基材背面與接著劑層之間容易發生滑動，而發生空轉。而且，最近，長度為200m~300m的長條的電路連接用膠帶較多，隨之因空轉引起的問題亦變多。
此處，空轉的容易性的指標有空轉起始負載。此空轉起始負載在自接著劑捲軸拉出電路連接用膠帶時，成為電路連接用膠帶所負荷的張力的標準，通常其值小於200gf 時，特別容易發生空轉，在其值為200gf~400gf左右時空轉減少，若其值為400gf以上，則有幾乎不發生因空轉引起的問題的傾向。
本發明者等人著眼於根據空轉起始負載的不同而容易引起上述現象，對其改善策略進行努力研究。其結果發現，由於基材背面與設置於接著劑層上的終端標記之間的摩擦力，而發生空轉。
本發明是鑒於上述實際情況而完成，目的是提供在自接著劑捲軸拉出電路連接用膠帶時，可抑制因形成為捲繞體的電路連接用膠帶間的滑動所引起的空轉，並在製造電路連接體時可獲得優異的連接可靠性的電路連接用膠帶及接著劑捲軸。
本發明的一個方面的接著劑捲軸包括：具有膠帶狀的基材及形成於上述基材的一個面上的接著劑層的電路連接用膠帶、以及捲繞電路連接用膠帶的捲芯，且上述接著劑捲軸的特徵在於：在接著劑層的表面設置實施了防滑加工的終端標記，終端標記與基材之間的摩擦力為100gf以上。另外，本發明的一個方面的接著劑捲軸包括：具有膠帶狀的基材及形成於上述基材的一個面上的接著劑層的電路連接用膠帶、以及捲繞電路連接用膠帶的捲芯，且上述接著劑捲軸的特徵在於：電路連接用膠帶具有與捲芯及基材的終端部連接的終端膠帶，在基材的終端部，在遍及至少相當於捲芯的一捲的長度上，設置未形成接著劑層的非 接著區域，在非接著區域設置實施了防滑加工的覆蓋膠帶，覆蓋膠帶與基材之間的摩擦力為100gf以上。
在本發明的一個方面的接著劑捲軸中，在電路連接用膠帶的接著劑層側的面上，設置有實施了防滑加工的終端標記或實施了防滑加工的覆蓋膠帶，終端標記與基材之間的摩擦力、或覆蓋膠帶與基材之間的摩擦力設為100gf以上。藉此，可防止終端標記與基材背面之間的滑動、或防止覆蓋膠帶與基材背面之間的滑動，從而可抑制空轉的發生。因此，在製造電路連接體時可獲得優異的連接可靠性。
另外，覆蓋膠帶能夠以覆蓋基材與終端膠帶的邊界部分的方式設置。若如此，則可提高基材與終端膠帶的連接強度。
另外，亦能夠以覆蓋基材與終端膠帶的邊界部分的方式，設置黏著膠帶。若如此，則可進一步提高基材與終端膠帶的連接強度。
另外，可對終端膠帶的至少一個面實施防滑加工。若如此，則可防止終端膠帶與基材之間的滑動，從而可更加可靠地抑制空轉的發生。
另外，覆蓋膠帶的色相(hue)可與接著劑層的色相不同。若如此，則可自動檢測電路連接用膠帶的終端部。
本發明的一個方面的電路連接用膠帶是具有膠帶狀的基材及形成於上述基材的一個面上的接著劑層的長條的電路連接用膠帶，且上述電路連接用膠帶的特徵在於：在接著劑層的表面，包括實施了防滑加工的終端標記，終端標 記與基材之間的摩擦力為100gf以上。另外，本發明的一個方面的電路連接用膠帶是具有膠帶狀的基材及形成於上述基材的一個面上的接著劑層的長條的電路連接用膠帶，且上述電路連接用膠帶的特徵在於：終端膠帶與基材的終端部連接，並且在比終端膠帶更靠近前面的側設置未形成接著劑層的非接著區域，在非接著區域設置實施了防滑加工的覆蓋膠帶，覆蓋膠帶與基材之間的摩擦力為100gf以上。
本發明的一個方面的電路連接用膠帶中，在接著劑層側的面上，設置實施了防滑加工的終端標記或實施了防滑加工的覆蓋膠帶，終端標記與基材之間的摩擦力、或覆蓋膠帶與基材之間的摩擦力設為100gf以上。藉此，在將此電路連接用膠帶形成為捲繞體時，可防止終端標記與基材背面之間的滑動、或防止覆蓋膠帶與基材背面之間的滑動，並可抑制空轉的發生。因此，在製造電路連接體時，可獲得優異的連接可靠性。
另外，本發明的一個方面的作為積層膠帶的電路連接材料的使用中，上述積層膠帶的電路連接材料包括膠帶狀的基材、形成於基材的一個面上的接著劑層、以及設置於接著劑層的表面並實施了防滑加工的終端標記，終端標記與基材之間的摩擦力為100gf以上。
另外，本發明的一個方面的作為積層膠帶的電路連接材料的使用中，上述積層膠帶的電路連接材料包括膠帶狀的基材、形成於基材的一個面上的接著劑層、與基材的終 端部連接的終端膠帶、在基材的終端部設置於比終端膠帶更靠近前面的側且未形成接著劑層的非接著區域、設置於非接著區域且實施了防滑加工的覆蓋膠帶，覆蓋膠帶與基材之間的摩擦力為100gf以上。
另外，本發明的一個方面的積層膠帶的電路連接材料製造用的使用中，上述積層膠帶的電路連接材料包括膠帶狀的基材、形成於基材的一個面上的接著劑層、設置於接著劑層的表面且實施了防滑加工的終端標記，終端標記與基材之間的摩擦力為100gf以上。
另外，本發明的一個方面的積層膠帶的電路連接材料製造用的使用中，上述積層膠帶的電路連接材料：包括膠帶狀的基材、形成於基材的一個面上的接著劑層、與基材的終端部連接的終端膠帶、在基材的終端部設置於比終端膠帶更靠近前面的側且未形成接著劑層的非接著區域、設置於非接著區域且實施了防滑加工的覆蓋膠帶，覆蓋膠帶與基材之間的摩擦力為100gf以上。
另外，本發明的一個方面的電路連接體的製造方法中，其包括：將自接著劑捲軸抽出的電路連接用膠帶載置於第1電路構件的第1電路電極上，上述接著劑捲軸包括具有膠帶狀的基材及形成於上述基材的一個面上的接著劑層的電路連接用膠帶、以及捲繞上述電路連接用膠帶的捲芯，且在上述接著劑層的表面設置實施了防滑加工的終端標記，終端標記與基材之間的摩擦力為100gf以上，將第1電路構件與電路連接用膠帶加壓，將接著劑層暫時連接 於第1電路構件，自接著劑層剝離基材，以第2電路構件的第2電路電極與接著劑層接觸的方式，將第2電路構件載置於接著劑層上，一邊將接著劑層加熱，一邊將第1電路構件與第2電路構件加壓，藉由接著劑層的硬化而形成連接部從而獲得電路連接體。
另外，本發明的一個方面的電路連接體的製造方法中，其包括：將自接著劑捲軸抽出的電路連接用膠帶載置於第1電路構件的第1電路電極上，上述接著劑捲軸包括具有膠帶狀的基材及形成於上述基材的一個面上的接著劑層的電路連接用膠帶、以及捲繞電路連接用膠帶的捲芯，且電路連接用膠帶具有與捲芯及基材的終端部連接的終端膠帶，在基材的終端部之遍及至少相當於捲芯的一捲的長度上，設置未形成接著劑層的非接著區域，在非接著區域設置實施了防滑加工的覆蓋膠帶，覆蓋膠帶與基材之間的摩擦力為100gf以上，將第1電路構件與電路連接用膠帶加壓，將接著劑層暫時連接於第1電路構件，自接著劑層剝離基材，以第2電路構件的第2電路電極與接著劑層接觸的方式，將第2電路構件載置於接著劑層上，一邊將接著劑層加熱，一邊將第1電路構件與第2電路構件加壓，藉由接著劑層的硬化而形成連接部從而獲得電路連接體。
根據本發明，在自接著劑捲軸拉出電路連接用膠帶時，可抑制因形成為捲繞體的電路連接用膠帶間的滑動引起的空轉，在製造電路連接體時可獲得優異的連接可靠性。
以下，一邊參照隨附圖式一邊對本發明的較佳實施形態進行詳細地說明。另外，圖式的說明中，對相同的要素給予相同的符號，省略重複的說明。另外，為了圖式的方便，圖式的尺寸比率未必與說明的尺寸比率一致。
對本發明的第1實施形態的電路連接用膠帶及接著劑捲軸進行說明。
圖1是表示接著劑捲軸之一例的立體圖，圖2是表示將圖1的接著劑捲軸安裝於壓接裝置的旋轉軸的狀態的剖面圖。
接著劑捲軸10包括：筒狀捲芯1、分別設置於捲芯1的軸方向的兩端面的圓盤狀側板2。在捲芯1的外面1a捲繞長條狀異方性導電膠帶(電路連接用膠帶)5A，藉此異方性導電膠帶5A形成為捲繞體。捲芯1的內面成為用以安裝於壓接裝置25的旋轉軸25a的軸孔10a(參照圖2)。另外，捲芯1的外徑並無特別限制，就操作性的方面而言，較佳為4cm~15cm。
圖3是表示異方性導電膠帶之一例的示意剖面圖。
異方性導電膠帶5A包括：膠帶狀的基材6、形成於基材6的一個面上的接著劑層8。
基材6的長度例如為1m~400m左右，較佳為50m~300m。基材6的厚度例如為4μm~200μm左右，較佳為20μm~100μm。基材6的寬度例如為0.5mm~30mm左右，較佳為0.5mm~3.0mm。另外，基材6的長度、厚度、及寬度並不限定於上述範圍。另外，基材6的寬度較 佳為，與形成於其上的接著劑層8的寬度相同，或比接著劑層8的寬度寬。
基材6例如可使用：包含聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚間苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚烯烴、聚乙酸酯、聚碳酸酯、聚苯硫醚、聚醯胺、乙烯-乙酸乙烯酯共聚物、聚氯乙烯、聚偏二氯乙烯、合成橡膠系、液晶聚合物等的各種膠帶。另外，構成基材6的材質並不限定於該些材質。另外，基材6可使用對與接著劑層8的抵接面等實施了脫模處理的基材。
接著劑層8包含接著劑組成物，此接著劑組成物例如含有接著劑成分8a與導電粒子8b。接著劑層8的厚度根據所使用的接著劑成分及被接著物的種類等進行適當選擇即可，例如為5μm~100μm，較佳為10μm~40μm。另外，接著劑層8的寬度根據使用用途進行調整即可，例如為0.5mm~5mm左右，較佳為0.5mm~3.0mm。
接著劑層8的接著劑成分8a可廣泛應用藉由熱或光而表現硬化性的材料，可使用環氧系接著劑或丙烯酸系接著劑。另外，就連接後的耐熱性或耐濕性優異而言，較佳為使用交聯性材料。其中含有作為熱硬化性樹脂的環氧樹脂作為主成分的環氧系接著劑，能以短時間進行硬化，因而連接作業性佳，就分子結構上接著性優異等的特徵而言，較佳。另外，根據本發明者等人的研究，使用丙烯酸系接著劑作為接著劑成分8a的情形，與使用環氧系接著劑的情形相比，更容易引起接著劑層8轉印至基材背面6c，因此 就此方面而言，亦較佳為使用環氧系接著劑。
環氧系接著劑的具體例可列舉：以高分子量環氧樹脂、固態環氧樹脂或液態環氧樹脂、或將該些環氧樹脂藉由胺基甲酸酯、聚酯、丙烯酸系橡膠、腈橡膠(NBR)、合成線狀聚醯胺等改質而成的環氧樹脂為主成分的接著劑。環氧系接著劑通常是在成為主成分的上述環氧樹脂中添加硬化劑、觸媒、偶合劑、填充劑等而成的環氧系接著劑。
丙烯酸系接著劑的具體例可列舉：以丙烯酸、丙烯酸酯、甲基丙烯酸酯及丙烯腈中的至少一種為單體成分的聚合物或共聚物。
另外，將IC晶片安裝於玻璃基板或軟性印刷基板(FPC)上時，就抑制由IC晶片的線膨脹係數與基板的線膨脹係數之差產生的基板的翹曲的觀點而言，較佳為將發揮內部應力的緩和作用的成分調配至接著劑成分中。具體而言，較佳為在接著劑成分中調配丙烯酸系橡膠或彈性體成分。另外，亦可使用如國際公開第98/44067號所記載的自由基硬化系接著劑。
導電粒子8b分散於接著劑成分8a中。導電粒子8b例如可列舉：Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等金屬或碳的粒子。或可使用：以非導電性玻璃、陶瓷、塑膠等為核，並藉由上述金屬或碳被覆此核而得被覆粒子。導電粒子8b的平均粒徑就分散性、導電性的觀點而言，較佳為1μm~18μm。另外，可使用藉由絕緣層被覆導電粒 子而成的絕緣被覆粒子，就提高鄰接的電極彼此的絕緣性的觀點而言，可併用導電粒子與絕緣性粒子。
導電粒子8b的調配比例相對於接著劑層8所含的接著劑成分100體積份，例如為0.1體積份~30體積份，較佳為0.1體積份~10體積份。若此調配比例小於0.1體積份，則有對向的電極間的連接電阻變高的傾向，若此調配比例超過30體積份，則有容易發生鄰接的電極間的短路的傾向。另外，根據異方性導電膠帶5A的用途，可不調配導電粒子8b，而僅由接著劑成分8a構成接著劑層8。
接著，對異方性導電膠帶5A的終端部的構成進行說明。
圖4是表示本發明的第1實施形態的異方性導電膠帶的終端部的示意剖面圖。
基材6的終端部6a與終端膠帶12的始端部12b連接。終端膠帶12的終端部12a與捲芯1的外面1a連接。終端膠帶12的始端部12b與基材6的終端部6a的連接，是藉由後述的覆蓋膠帶14及黏著膠帶16來進行。另外，終端膠帶12的終端部12a與外面1a的連接，此處可藉由雙面膠帶來進行。
構成終端膠帶12的材質可列舉：與構成上述基材6的材質相同的材質(例如聚對苯二甲酸乙二酯)。
終端膠帶12的長度根據適合於自安裝接著劑捲軸10的旋轉軸25a至進行壓接作業的位置為止的距離等、壓接裝置25的構成等進行適當設定即可，例如為0.5m~5m 左右，較佳為1m~3m。終端膠帶12的厚度根據所要求的強度等進行適當設定即可，例如為10μm~100μm，較佳為30μm~70μm。另外，終端膠帶12的寬度根據基材6或接著劑層8的寬度進行適當設定即可，例如為0.5mm~5mm左右，較佳為0.5mm~3.0mm。
對終端膠帶12的至少一個面實施防滑加工。藉此，可在將異方性導電膠帶5A沿著捲芯1捲繞而形成捲繞體的狀態下，使相互抵接的終端膠帶12的外面與內面之間難以發生滑動。其結果能以充分高的精度拉出所需要的長度的異方性導電膠帶5A。防滑加工特別有用於終端膠帶12的長度為1m以上的情形。防滑加工的具體例可列舉：針對終端膠帶12的表面的壓紋加工、或對此表面塗佈橡膠等。
在基材6的終端部6a，在比終端膠帶12更靠近前面的側設置未形成接著劑層8的非接著區域5b。此非接著區域5b在將異方性導電膠帶5A沿著捲芯1捲繞而形成捲繞體的狀態下，在遍及至少相當於一捲的長度上而設置。非接著區域5b例如在將異方性導電膜切割成特定寬度而製造異方性導電膠帶5A的過程中，可藉由對異方性導電膜的特定區域除去接著劑層而形成。另外，設置非接著區域5b的長度只要在形成為捲繞體的狀態下為相當於一捲的長度以上，則並無特別限制，可為相當於二捲，亦可為相當於三捲。但是，亦取決於捲芯1的直徑，若非接著區域5b的長度超過0.5m，則在非接著區域5b上貼合覆蓋膠帶14時容易產生偏差，因此非接著區域5b的長度較佳為0.5 m以下。
在非接著區域5b，以覆蓋此非接著區域5b的方式，設置覆蓋膠帶14。覆蓋膠帶14的終端部14a延伸至終端膠帶12的始端部12b側為止，而覆蓋基材6與終端膠帶12的邊界部分。
此處，圖5是表示圖4所示的終端部的第1變形例的示意剖面圖。如圖5所示，覆蓋膠帶14的始端部14b就防止接著劑層8的剝離的觀點而言，較佳為以覆蓋接著劑層8的終端部8c的方式延伸。另外，亦可形成在接著劑層8的終端部8c與覆蓋膠帶14的始端部14b之間設置空間的結構。
對覆蓋膠帶14的表面實施防滑加工。此防滑加工例如可列舉：針對覆蓋膠帶14的表面的壓紋加工、或在此表面塗佈橡膠等。但在覆蓋膠帶14的表面塗佈橡膠等時，在將異方性導電膠帶5A沿著捲芯1捲繞形成捲繞體的狀態下，後述黏著膠帶16位於覆蓋膠帶14的下層，因此自接著劑捲軸10拉出異方性導電膠帶5A時，有覆蓋膠帶14同時剝離黏著膠帶16的擔憂。因此，較佳為(黏著膠帶16對基材背面6c的接著力)>(覆蓋膠帶14對黏著膠帶16背面的接著力)。
在將異方性導電膠帶5A沿著捲芯1捲繞而形成捲繞體的狀態下，覆蓋膠帶14與位於此覆蓋膠帶14的下層的基材背面6c接觸，但異方性導電膠帶5A中，以基材背面6c與覆蓋膠帶14之間的摩擦力為100gf以上的方式實施 上述防滑加工。
覆蓋膠帶14的色相與接著劑層8的色相不同。因此藉由設置於壓接裝置25的檢測機構(未圖示)，可自動檢測異方性導電膠帶5A的終端部。如此，覆蓋膠帶14亦發揮出作為終端標記的功能。
構成覆蓋膠帶14的材質可列舉：與構成上述基材6的材質相同的材質(例如聚對苯二甲酸乙二酯)。另外，若覆蓋膠帶14含有基材，則有由於此基材的厚度的階差而發生黏連等問題，因此就此種問題的抑制的方面而言，較佳為覆蓋膠帶14為無基材的雙面膠帶狀的膠帶。
覆蓋膠帶14的厚度例如為10μm~100μm，較佳為30μm~70μm。另外，覆蓋膠帶14的寬度根據基材6或接著劑層8的寬度適當設定即可，例如為0.5mm~5mm左右，較佳為0.5mm~3.0mm。覆蓋膠帶14的長度較佳為，在將異方性導電膠帶5A沿著捲芯1捲繞而形成捲繞體的狀態下，黏著膠帶16的全長被覆蓋膠帶14覆蓋的程度的長度。
在基材背面6c側、且基材6的終端部6a與終端膠帶12的始端部12b的邊界部分，以覆蓋此邊界部分的方式，貼附黏著膠帶16。黏著膠帶16是用以提高基材6與終端膠帶12的連接強度的膠帶。另外，在僅藉由覆蓋膠帶14可充分確保基材6與終端膠帶12的連接強度時，可不貼附黏著膠帶16。另外，在僅藉由黏著膠帶16可充分確保基材6與終端膠帶12的連接強度時，可不將覆蓋膠帶14延 伸至終端膠帶12的始端部12b側。
此處，圖6是表示圖4所示的終端部的第2變形例的示意剖面圖。如圖6所示，亦可在接著劑層8側的表面，以覆蓋基材6的終端部6a與終端膠帶12的始端部12b的邊界部分的方式，設置黏著膠帶16，並且以進一步覆蓋此黏著膠帶16的方式，設置覆蓋膠帶14。
黏著膠帶16的長度例如為5mm~30mm左右，較佳為10mm~20mm。黏著膠帶16的厚度根據所要求的強度等進行適當設定即可，例如為10μm~100μm，較佳為30μm~70μm。另外，黏著膠帶16的寬度根據基材6或接著劑層8的寬度進行適當設定即可，例如為0.5mm~5mm左右，較佳為0.5mm~3.0mm。
(電路連接體)
接著，對使用本實施形態的接著劑捲軸10的接著劑層8作為電路連接材料而製造的電路連接體進行說明。
圖7是表示將電路電極彼此連接的電路連接體的概略剖面圖。如圖7所示，電路連接體100包括相互對向的第1電路構件30及第2電路構件40，第1電路構件30與第2電路構件40之間可設置將該些電路構件連接的連接部50a。
第1電路構件30包括：電路基板31、形成於電路基板31的主面31a上的電路電極32。第2電路構件40包括：電路基板41、形成於電路基板41的主面41a上的電路電極42。
一側的電路構件的具體例可列舉：半導體晶片(IC晶片)、電阻體晶片、電容器晶片等晶片零件等。該些電路構件通常包括多個電路電極。另一側的電路構件的具體例可列舉：具有金屬配線的軟性膠帶、軟性印刷配線板、蒸鍍了銦錫氧化物(ITO)的玻璃基板等配線基板。異方性導電膠帶5A由於可對外部進行靜電放電，因此將該些電路構件連接時，可藉由使用自接著劑捲軸10拉出的異方性導電膠帶5A，而以高效率且高連接可靠性將電路構件彼此連接。因此，本實施形態的異方性導電膠帶5A適合於：在包括多個微細的連接端子(電路電極)的晶片零件的配線基板上的COG封裝(Chip On Glass，玻璃覆晶)或COF封裝(Chip On Flex，軟板覆晶)。
各電路電極32、電路電極42的表面可包含選自金、銀、錫、釕、銠、鈀、鋨、銥、鉑及銦錫氧化物(ITO)的1種，亦可包含2種以上。另外，電路電極32、電路電極42的表面的材質在所有的電路電極中可相同，亦可不同。
連接部50a包括：接著劑層8所含的接著劑成分8a的硬化物8A、以及分散於其中的導電粒子8b。並且，在電路連接體100中，對向的電路電極32與電路電極42經由導電粒子8b而電性連接。即，導電粒子8b與電路電極32、電路電極42的雙方直接接觸。因此，電路電極32、電路電極42間的連接電阻充分降低，並可實現電路電極32、電路電極42間的良好的電性連接。另一方面，硬化物 8A具有電絕緣性，鄰接的電路電極彼此會確保絕緣性。因此，可使電路電極32、電路電極42間的電流流動平穩，可充分發揮出電路所具有的功能。
(電路連接體的製造方法)
接著，對電路連接體100的製造方法進行說明。
圖8(a)、圖8(b)、圖8(c)是藉由概略剖面圖表示電路連接體的製造方法之一實施形態的步驟圖。本製造方法中，使異方性導電膠帶5A的接著劑層8熱硬化，最終製造電路連接體100。
首先，在連接裝置(未圖示)的旋轉軸上安裝接著劑捲軸10。以接著劑層8朝向下方的方式自此接著劑捲軸10拉出異方性導電膠帶5A。接著，將異方性導電膠帶5A切割成特定長度，而載置於第1電路構件30的第1電路電極32上(參照圖8(a))。
接著，將第1電路構件30及異方性導電膠帶5A沿著箭頭A及箭頭B方向加壓，將接著劑層8暫時連接於第1電路構件30(參照圖8(b))。此時的壓力若為不對電路構件造成損傷的範圍，則並無特別限制，通常較佳為設為0.1MPa~30.0MPa。另外，可一邊加熱一邊加壓，加熱溫度設為接著劑層8實質上不硬化的溫度。加熱溫度通常較佳為設為50℃~100℃。該些加熱及加壓較佳為在0.1秒~2秒的範圍內進行。
接著，自接著劑層8剝離基材6，以第2電路電極42與接著劑層8接觸的方式，將第2電路構件40載置於接著 劑層8上(參照圖8(c))。並且，一邊將接著劑層8加熱，一邊沿著箭頭A及箭頭B方向對整體加壓。此時的加熱溫度設為接著劑層8的接著劑成分8a可硬化的溫度。加熱溫度較佳為60℃~180℃，更佳為70℃~170℃，尤佳為80℃~160℃。若加熱溫度小於60℃，則有硬化速度變慢的傾向，若加熱溫度超過180℃，則有不期望的副反應容易進行的傾向。加熱時間較佳為0.1秒~180秒，更佳為0.5秒~180秒，尤佳為1秒~180秒。
藉由接著劑成分8a的硬化而形成連接部50a，而獲得如圖7所示的電路連接體100。另外，連接的條件根據所使用的用途、接著劑組成物、電路構件進行適當選擇。另外，在接著劑層8的接著劑成分使用藉由光而硬化的接著劑成分時，只要對接著劑層8照射適量活性光線或能量線即可。活性光線可列舉：紫外線、可見光、紅外線等。能量線可列舉：電子束、X射線、γ射線、微波等。
用於製造此種電路連接體100的異方性導電膠帶5A中，在接著劑層8側的面上設置實施了防滑加工的覆蓋膠帶14，覆蓋膠帶14與基材背面6c之間的摩擦力設為100gf以上。藉此，在將沿著捲芯1捲繞而形成捲繞體的狀態的異方性導電膠帶5A自接著劑捲軸10拉出時，可防止覆蓋膠帶14與基材6背面之間的滑動，並抑制空轉的發生。因此，在製造電路連接體時可獲得優異的連接可靠性。
另外，異方性導電膠帶5A中，覆蓋膠帶14延伸至終端膠帶12的始端部12b，覆蓋基材6與終端膠帶12的邊 界部分，因此可提高基材6與終端膠帶12的連接強度。
另外，異方性導電膠帶5A中，以覆蓋基材6的終端部6a與終端膠帶12的始端部12b的邊界部分的方式，設置黏著膠帶，因此可進一步提高基材6與終端膠帶12的連接強度。
另外，異方性導電膠帶5A中，對終端膠帶12的至少一個面實施防滑加工，因此可防止終端膠帶12與基材背面6c之間的滑動，並可更確實地抑制空轉的發生。
另外，異方性導電膠帶5A中，覆蓋膠帶14的色相與接著劑層8的色相不同，因此可自動檢測異方性導電膠帶5A的終端部。
此處，圖9(a)、圖9(b)、圖9(c)是表示將比較例1的異方性導電膠帶自捲軸拉出的過程的示意剖面圖。
比較例1的異方性導電膠帶55與第1實施形態的異方性導電膠帶5A不同之處在於：接著劑層8形成至基材6與終端膠帶12的連接部為止；隨之並未設置非接著區域5b及覆蓋非接著區域5b的覆蓋膠帶14。另外，圖9(a)、圖9(b)、圖9(c)中，為了方便，用直線描繪捲芯1的外面1a，實際是成為圓弧。
如圖9(a)所示，是異方性導電膠帶55沿著捲芯1而捲繞的狀態，異方性導電膠帶55與終端膠帶12的連接部的上層、即黏著膠帶16的上層亦存在接著劑層8。若由此狀態拉出異方性導電膠帶55，則由於黏著膠帶16的厚度或黏著劑的影響，而有可能接著劑層8自基材6剝離並 轉印至上層的基材6的背面，而發生黏連(參照圖9(b))。若如此接著劑層8轉印至基材6的背面，則無法對壓接裝置25適當供給接著劑層8(參照圖9(c))。其結果有無法確保電路連接體的連接可靠性的擔憂。
另外，圖10(a)、圖10(b)、圖10(c)是表示將比較例2的異方性導電膠帶自捲軸拉出的過程的示意剖面圖。
比較例2的異方性導電膠帶56與比較例1的異方性導電膠帶55不同之處在於：設置有黏著膠帶16的位置是異方性導電膠帶的接著劑層8側；接著劑16a貫通基材6與終端膠帶12之間。
如圖10(a)所示，是異方性導電膠帶56沿著捲芯1而捲繞的狀態，在異方性導電膠帶56與終端膠帶12的連接部的上層亦存在接著劑層8。若由此狀態拉出異方性導電膠帶56，則由於黏著膠帶16的厚度或黏著劑16a的影響，有可能接著劑層8自基材6剝離而轉印至上層的基材6的背面，而發生黏連(參照圖10(b))。若接著劑層8轉印至基材6的背面，則無法對壓接裝置25適當供給接著劑層8(參照圖10(c))。其結果有無法確保電路連接體的連接可靠性的擔憂。
相對於此，本發明的異方性導電膠帶5A中，由於在基材6的終端部6a形成不存在接著劑層8的非接著區域5b，因此在異方性導電膠帶5A沿著捲芯1而捲繞形成捲繞體的狀態下，非接著區域5b位於基材6與終端膠帶12 的連接部的上層。若此連接部被非接著區域5b覆蓋，則即便連接部具有少許的凹凸等，亦可充分抑制由凹凸等引起的黏連的發生。
接著，對本發明的第2實施形態的接著劑捲軸及異方性導電膠帶進行說明。
圖11是表示本發明的第2實施形態的異方性導電膠帶的終端部的示意剖面圖，圖12是表示將包括圖11的異方性導電膠帶的接著劑捲軸安裝於壓接裝置的旋轉軸的狀態的剖面圖。
異方性導電膠帶5B與圖4所示的第1實施形態的異方性導電膠帶5A不同之處在於：未設置終端膠帶12；隨之未設置非接著區域5b、覆蓋非接著區域5b的覆蓋膠帶14及黏著膠帶16；在接著劑層8的表面設置終端標記18。
終端標記18的長度根據壓接裝置25的構成等進行適當設定即可，例如為3cm~50cm左右，較佳為5cm~0.4m左右。終端標記18的厚度例如為10μm~100μm左右，較佳為30μm~70μm左右。另外，終端標記18的寬度與基材6或接著劑層8的寬度匹配即可，例如為0.5mm~5mm左右，較佳為0.5mm~3.0mm左右。
構成終端標記18的材質可列舉與上述構成基材6的材質相同的材質(例如聚對苯二甲酸乙二酯)。另外，若終端標記18含有基材，則有由於此基材的厚度的階差而發生黏連等問題，因此就抑制此種問題的方面而言，較佳為終端標記18為無基材的雙面膠帶狀終端標記。
對終端標記18實施防滑加工。防滑加工的具體例可列舉：針對終端標記表面的壓紋加工、或對此表面塗佈橡膠等。
在異方性導電膠帶5B沿著捲芯1而捲繞形成捲繞體的狀態下，終端標記18與位於此終端標記18的下層的基材背面6c接觸，在異方性導電膠帶5B中，以基材背面6c與終端標記18之間的摩擦力為100gf以上的方式實施防滑加工。
在此種異方性導電膠帶5B中，在接著劑層8的表面設置實施了防滑加工的終端標記18，終端標記18與基材背面6c之間的摩擦力設為100gf以上。藉此，將沿著捲芯1捲繞形成捲繞體的狀態的異方性導電膠帶5B自接著劑捲軸10拉出時，可防止終端標記18與基材6背面之間的滑動，並可抑制空轉的發生。因此，在製造電路連接體時，可獲得優異的連接可靠性。
另外，本發明並不限定於上述實施形態。
例如，第1實施形態中，例示了為了檢測異方性導電膠帶5A的量少量殘留，而在覆蓋膠帶14與接著劑層8之間設置色相差的情形，但亦可在終端膠帶12與基材6或接著劑層8之間設置色相差。例如，終端膠帶12可使用黑色終端膠帶。或亦可在終端膠帶12的表面與背面之間設置色相差等。
另外，上述實施形態中，例示了具有單層結構的接著劑層8的異方性導電膠帶5A、異方性導電膠帶5B，但接 著劑層8亦可為多層結構。具有多層結構的接著劑層的異方性導電膠帶，可藉由在基材6上積層多層的接著劑成分及導電粒子的種類或該些的含量不同的層而製造。例如可藉由不含有導電粒子的導電粒子非含有層及含有導電粒子的導電粒子含有層，構成二層結構的接著劑層。另外，導電粒子非含有層及導電粒子含有層的接著劑成分可使用與上述接著劑層8的接著劑成分相同者。
另外，上述實施形態中，例示了異方性導電膠帶5A、異方性導電膠帶5B作為電路連接用膠帶，但電路連接用膠帶亦可為不含有導電粒子8b的非導電膠帶。
實例
〈電路連接用膠帶、終端標記、覆蓋膠帶、及終端膠帶的準備〉
準備白色PET膜(杜邦帝人薄膜股份有限公司製造)作為電路連接用膠帶。準備聚酯膜膠帶No.631U#12(寺岡製作所股份有限公司製造)作為終端標記。準備絕緣用黑色黏著膠帶(寺岡製作所股份有限公司製造)作為覆蓋膠帶。準備Lumirror X30-50(東麗股份有限公司製造)作為終端膠帶。
〈試樣膠帶的準備〉
(實例1)
在寬度1.5mm的電路連接用膠帶的接著劑層側的面上，貼附實施了壓紋加工的終端標記，而製成試樣膠帶。
(實例2)
在寬度1.5mm的電路連接用膠帶的終端部，設置終端膠帶、非接著區域及覆蓋膠帶，對覆蓋膠帶實施壓紋加工，而製成試樣膠帶。
(實例3)
在寬度1.5mm的電路連接用膠帶的接著劑層側的面上，貼附實施了壓紋加工的終端標記，接著在終端標記上塗佈苯氧樹脂，而製成試樣膠帶。
(實例4)
在寬度1.5mm的電路連接用膠帶的接著劑層側的面上，貼附實施了壓紋加工的終端標記，接著在終端標記上塗佈丙烯酸系橡膠，而製成試樣膠帶。
(比較例1)
在寬度1.5mm的電路連接用膠帶的接著劑層側的面上，貼附未實施防滑加工的終端標記，而製成試樣膠帶。
(比較例2)
在寬度1.5mm的電路連接用膠帶的接著劑層側的面上，貼附在雙面塗佈了丙烯酸系黏著劑的終端標記，而製成試樣膠帶。
(比較例3)
在寬度1.5mm的電路連接用膠帶的終端部，設置終端膠帶、非接著區域及覆蓋膠帶而製成試樣膠帶。覆蓋膠帶上未實施防滑加工。
(參考例)
將無終端標記及覆蓋膠帶的寬度1.5mm的電路連接 用膠帶直接作為試樣膠帶。
〈摩擦力的測定〉
圖13是表示覆蓋膠帶或終端標記與基材之間的摩擦力的測定裝置的概略構成圖，如圖13所示，在固定的直徑30mm的固定輥200的表面，貼附與電路連接用膠帶的基材相同的基材膠帶，藉此在固定輥200的表面設置基材背面。使貼附了試樣膠帶S的終端標記18或覆蓋膠帶14的面沿著固定輥200的下側的一部分。所沿著的長度以固定輥200的角度計為45度左右。夾住固定輥200，試樣膠帶S的一側沿著可旋轉的直徑40mm的自由輥300的上側，在端部懸掛50g的秤錘400，另一側藉由Orientec股份有限公司製造的Tensilon RTM-50(以下稱為「Tensilon」)以50mm/min的速度向上方拉伸端部。此時，藉由Tensilon測定基材背面與終端標記18或覆蓋膠帶14開始滑動時的拉伸負載，將此拉伸負載作為摩擦力。評價結果示於表1、表2。
〈空轉起始負載的測定〉
藉由Tensilon以50mm/min的速度拉出捲軸狀態的試樣膠帶。此時，藉由Tensilon測定開始空轉時的拉伸負載，將此拉伸負載作為空轉起始負載。評價結果示於表1、表2。
<黏連(blocking)的測定>
在固定於30℃(濕度為40%RH~60%RH)的恆溫槽中，使捲軸狀態的試樣膠帶橫向放置1日(24h)。然後，藉由Tensilon以1m/min的速度拉出試樣膠帶直至終端 部。評價結果示於表1、表2。
如表1所示，實例~實例4中，覆蓋膠帶或終端標記與基材之間的摩擦力均為100gf以上。另外，實例1~實例4中，空轉起始負載均為幾乎不發生因空轉引起的問題的400gf以上，而獲得良好的空轉起始負載。並且，實例1~實例4中，均未發生黏連。
如表2所示，比較例1、比較例3中，摩擦力均為90gf。另外，比較例1、比較例3中，空轉起始負載均為容易發 生空轉的200gf。並且，比較例1、比較例3中，發生黏連。藉此確認，覆蓋膠帶或終端標記與基材之間的摩擦力為90gf左右而無法防止空轉或黏連，為了防止該些問題，覆蓋膠帶或終端標記與基材之間的摩擦力必須為100gf以上。
比較例2中，摩擦力為150gf，空轉起始負載為1000gf，均與實例1~實例4同等。但終端標記剝離並發生黏連。由此可知，即便藉由與防滑加工不同的黏著劑提高摩擦力或空轉起始負載，亦無法防止黏連。
參考例中，接著劑層與基材之間的摩擦力為600gf，空轉起始負載為700gf，均與實例1~實例4同等。另外，參考例中，未發生黏連。但參考例中，由於未設置終端標記或覆蓋膠帶，因此無法削減不使用而廢棄的接著劑層、或無法視覺辨認電路連接用膠帶的終端部。
根據以上所述可確認，根據本發明，可抑制空轉的發生，並在製造電路連接體時可獲得優異的連接可靠性。
1‧‧‧捲芯
1a‧‧‧外面
2‧‧‧側板
5A、5B、55、56‧‧‧異方性導電膠帶(電路連接用膠帶)
5b‧‧‧非接著區域
6‧‧‧基材
6a、8c、12a、14a、‧‧‧終端部
6c‧‧‧基材背面
8‧‧‧接著劑層
8A‧‧‧硬化物
8a‧‧‧接著劑成分
8b‧‧‧導電粒子
10‧‧‧接著劑捲軸
10a‧‧‧軸孔
12‧‧‧終端膠帶
12b、14b‧‧‧終端膠帶的始端部
14‧‧‧覆蓋膠帶
16‧‧‧黏著膠帶
16a‧‧‧接著劑
18‧‧‧終端標記
25‧‧‧壓接裝置
25a‧‧‧旋轉軸
30‧‧‧第1電路構件
31、41‧‧‧電路基板
31a、41a‧‧‧主面
32、42‧‧‧電路電極
40‧‧‧第2電路構件
50a‧‧‧連接部
100‧‧‧電路連接體
200‧‧‧固定輥
300‧‧‧自由輥
400‧‧‧秤錘
A、B‧‧‧箭頭
S‧‧‧試樣膠帶
圖1是表示接著劑捲軸之一例的立體圖。
圖2是表示將圖1所示的接著劑捲軸安裝於壓接裝置的旋轉軸的狀態的剖面圖。
圖3是表示異方性導電膠帶之一例的示意剖面圖。
圖4是表示本發明的第1實施形態的異方性導電膠帶的終端部的示意剖面圖。
圖5是表示圖4所示的終端部的第1變形例的示意剖 面圖。
圖6是表示圖4所示的終端部的第2變形例的示意剖面圖。
圖7是表示將電路電極彼此連接的電路連接體之一例的概略剖面圖。
圖8(a)、圖8(b)、圖8(c)是表示電路連接體的製造方法之一例的概略剖面圖。
圖9(a)、圖9(b)、圖9(c)是表示將比較例1的異方性導電膠帶自捲軸拉出的過程的示意剖面圖。
圖10(a)、圖10(b)、圖10(c)是表示將比較例2的異方性導電膠帶自捲軸拉出的過程的示意剖面圖。
圖11是表示本發明的第2實施形態的異方性導電膠帶的終端部的示意剖面圖。
圖12是表示將包括圖11所示的異方性導電膠帶的接著劑捲軸安裝於壓接裝置的旋轉軸的狀態的剖面圖。
圖13是表示覆蓋膠帶或終端標記與基材之間的摩擦力的測定裝置的概略構成圖。
1‧‧‧捲芯
1a‧‧‧外面
5A‧‧‧異方性導電膠帶(電路連接用膠帶)
5b‧‧‧非接著區域
6‧‧‧基材
6a、8c、12a、14a‧‧‧終端部
6c‧‧‧基材背面
8‧‧‧接著劑層
12‧‧‧終端膠帶
12b‧‧‧終端膠帶的始端部
14‧‧‧覆蓋膠帶
14b‧‧‧始端部
16‧‧‧黏著膠帶

Claims (10)

  1. 一種接著劑捲軸，其包括：具有膠帶狀的基材及形成於上述基材的一個面上的接著劑層的電路連接用膠帶、以及捲繞上述電路連接用膠帶的捲芯，且上述接著劑捲軸的特徵在於：在上述接著劑層的表面設置有實施了防滑加工的終端標記，上述終端標記與上述基材之間的摩擦力為100gf以上。
  2. 一種接著劑捲軸，其包括：具有膠帶狀的基材及形成於上述基材的一個面上的接著劑層的電路連接用膠帶、以及捲繞上述電路連接用膠帶的捲芯，且上述接著劑捲軸的特徵在於：上述電路連接用膠帶具有與上述捲芯及上述基材的終端部連接的終端膠帶，在上述基材的終端部，在遍及至少相當於上述捲芯的一捲的長度上，設置未形成上述接著劑層的非接著區域，在上述非接著區域，設置實施了防滑加工的覆蓋膠帶，上述覆蓋膠帶與上述基材之間的摩擦力為100gf以上。
  3. 如申請專利範圍第2項所述之接著劑捲軸，其中上述覆蓋膠帶是以覆蓋上述基材與上述終端膠帶的邊界部分的方式設置。
  4. 如申請專利範圍第2項或第3項所述之接著劑捲 軸，其中以覆蓋上述基材與上述終端膠帶的邊界部分的方式設置黏著膠帶。
  5. 如申請專利範圍第2項或第3項所述之接著劑捲軸，其中對上述終端膠帶的至少一個面實施防滑加工。
  6. 如申請專利範圍第2項或第3項所述之接著劑捲軸，其中上述覆蓋膠帶的色相與上述接著劑層的色相不同。
  7. 一種電路連接用膠帶，其是具有膠帶狀的基材及形成於上述基材的一個面上的接著劑層的長條的電路連接用膠帶，且上述電路連接用膠帶的特徵在於：在上述接著劑層的表面包括實施了防滑加工的終端標記，上述終端標記與上述基材之間的摩擦力為100gf以上。
  8. 一種電路連接用膠帶，其是具有膠帶狀的基材及形成於上述基材的一個面上的接著劑層的長條的電路連接用膠帶，且上述電路連接用膠帶的特徵在於：在上述基材的終端部，連接有終端膠帶，並且在比上述終端膠帶更靠近前面的側設置未形成上述接著劑層的非接著區域，在上述非接著區域設置實施了防滑加工的覆蓋膠帶，上述覆蓋膠帶與上述基材之間的摩擦力為100gf以上。
  9. 一種電路連接體的製造方法，其包括：將自接著劑捲軸抽出的電路連接用膠帶載置於第1電 路構件的第1電路電極上，上述接著劑捲軸包括具有膠帶狀的基材及形成於上述基材的一個面上的接著劑層的上述電路連接用膠帶、以及捲繞上述電路連接用膠帶的捲芯，且在上述接著劑層的表面設置實施了防滑加工的終端標記，上述終端標記與上述基材之間的摩擦力為100gf以上；將上述第1電路構件與上述電路連接用膠帶加壓，而將上述接著劑層暫時連接於上述第1電路構件；自上述接著劑層剝離上述基材；以第2電路構件的第2電路電極與上述接著劑層接觸的方式，將上述第2電路構件載置於上述接著劑層上；以及一邊加熱上述接著劑層，一邊將上述第1電路構件與上述第2電路構件加壓，並藉由上述接著劑層的硬化而形成連接部從而獲得電路連接體。
  10. 一種電路連接體的製造方法，其包括：將自接著劑捲軸抽出的電路連接用膠帶載置於第1電路構件的第1電路電極上，上述接著劑捲軸包括具有膠帶狀的基材及形成於上述基材的一個面上的接著劑層的上述電路連接用膠帶、以及捲繞上述電路連接用膠帶的捲芯，且上述電路連接用膠帶具有與上述捲芯及上述基材的終端部連接的終端膠帶，在上述基材的終端部之遍及至少相當於上述捲芯的一捲的長度上，設置未形成上述接著劑層的非接著區域，在上述非接著區域設置實施了防滑加工的覆蓋膠帶，上述覆蓋膠帶與上述基材之間的摩擦力為100gf 以上；將上述第1電路構件與上述電路連接用膠帶加壓，而將上述接著劑層暫時連接於上述第1電路構件；自上述接著劑層剝離上述基材；以第2電路構件的第2電路電極與上述接著劑層接觸的方式，將上述第2電路構件載置於上述接著劑層上；一邊加熱上述接著劑層，一邊將上述第1電路構件與上述第2電路構件加壓，並藉由上述接著劑層的硬化而形成連接部從而獲得電路連接體。
TW101107996A 2011-03-09 2012-03-09 電路連接用膠帶、接著劑捲軸以及電路連接體的製造方法 TWI480221B (zh)

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