WO2012121292A1 - 回路接続用テープ、接着剤リール、積層テープの回路接続材料としての使用、積層テープの回路接続材料の製造のための使用及び回路接続体の製造方法 - Google Patents
回路接続用テープ、接着剤リール、積層テープの回路接続材料としての使用、積層テープの回路接続材料の製造のための使用及び回路接続体の製造方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/04—Kinds or types
- B65H75/08—Kinds or types of circular or polygonal cross-section
- B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/18—Constructional details
- B65H75/28—Arrangements for positively securing ends of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H26/00—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms
- B65H26/06—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms responsive to predetermined lengths of webs
- B65H26/066—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms responsive to predetermined lengths of webs responsive to information, e.g. printed mark, on the web or web roll
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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Definitions
- the present invention relates to a circuit connecting tape and an adhesive reel.
- anisotropic conductive films have been used as a connecting material for electrically connecting connected members having a large number of electrodes to manufacture a circuit connection body.
- This anisotropic conductive film is a conductive state between opposing electrodes when connecting a connected member such as a semiconductor element such as an IC or LSI or a package to a substrate such as a printed wiring board, LCD glass substrate or flexible printed circuit board. It is a connection material that performs electrical connection and mechanical fixation so as to maintain insulation and maintain insulation between adjacent electrodes.
- non-conductive films NCF: Non-Conductive film
- connection materials are known as connection materials.
- the connecting material includes an adhesive component containing a thermosetting resin and conductive particles blended as necessary in the case of an anisotropic conductive film, and is formed on a base material such as a polyethylene terephthalate film (PET). , Formed as a film as an adhesive layer. Then, this film-like raw fabric is cut into a tape shape so as to have a width suitable for the application, and is used as a circuit connection tape. An adhesive reel is produced by winding this circuit connection tape around a winding core into a wound body. (See Patent Document 1).
- the end tape may be provided for the circuit connection tape.
- End tape has the role of reducing the adhesive layer that is discarded without being used. That is, in the crimping apparatus used for manufacturing the circuit connection body, there is a predetermined interval between the position where the adhesive reel is mounted and the position where the crimping operation is performed, and the adhesive reel is obtained by directly winding the circuit connecting tape around the winding core. Is used, the adhesive layer remaining at the predetermined interval is discarded without being used when unwinding is completed and the reel is replaced with a new adhesive reel. Therefore, by providing an end tape near the terminal portion of the circuit connecting tape, it is possible to prevent the adhesive layer from remaining at the predetermined interval, and to reduce the adhesive layer discarded without being used.
- end marks may be provided on circuit connection tapes.
- the end mark has a role of preventing damage to the crimping device due to unreasonable withdrawal of the circuit connection tape by making the terminal portion of the circuit connection tape visible.
- blocking is a phenomenon in which the adhesive layer is transferred to the back surface of the substrate when the circuit connecting tape is pulled out from the adhesive reel and used.
- blocking occurs, a necessary amount of the adhesive layer cannot be disposed at a predetermined position on the connected member, and the electrical connection or mechanical fixation of the connection portion may be insufficient.
- This idling start load is a measure of the tension applied to the circuit connecting tape when the circuit connecting tape is pulled out from the adhesive reel. Generally, when the value is less than 200 gf, idling is particularly likely to occur. It decreases at about 400 gf, and if it is 400 gf or more, there is a tendency that defects due to idling hardly occur.
- the present inventors paid attention to the fact that the above phenomenon is likely to occur due to the difference in idling start load, and intensively studied the improvement measures. As a result, it was found that idling occurred due to the frictional force between the back surface of the substrate and the end mark provided on the adhesive layer.
- An object of the present invention is to provide a circuit connecting tape and an adhesive reel capable of obtaining excellent connection reliability when manufacturing a connection body.
- An adhesive reel according to one aspect of the present invention is an adhesive reel comprising a tape-like substrate and a circuit connecting tape having an adhesive layer formed on one surface thereof, and a core around which the circuit connecting tape is wound.
- the surface of the adhesive layer is provided with an end mark that has been subjected to anti-slip processing, and the frictional force between the end mark and the substrate is 100 gf or more.
- An adhesive reel according to one aspect of the present invention comprises a tape-like substrate and a circuit connecting tape having an adhesive layer formed on one surface thereof, and a core around which the circuit connecting tape is wound.
- An adhesive reel provided, wherein the circuit connection tape has an end tape connected to the core and the terminal end of the substrate, and the terminal end of the substrate has a length equivalent to at least one turn of the core.
- a non-adhesive area in which an adhesive layer is not formed is provided, and a non-slip-processed cover tape is provided in the non-adhesive area, and the frictional force between the cover tape and the base material is provided. Is 100 gf or more.
- an end mark provided with an anti-slip process or a cover tape provided with an anti-slip process is provided on the surface on the adhesive layer side of the circuit connection tape.
- the frictional force between the mark and the substrate or the frictional force between the cover tape and the substrate is 100 gf or more.
- cover tape may be provided so as to cover the boundary portion between the base material and the end tape. If it carries out like this, the connection strength of a base material and an end tape can be improved.
- an adhesive tape may be provided so as to cover the boundary portion between the base material and the end tape. If it carries out like this, the connection strength of a base material and an end tape can be improved further.
- At least one surface of the end tape may be subjected to anti-slip processing. If it carries out like this, the slip between an end tape and a base material will be prevented and generation
- the hue of the cover tape may be different from the hue of the adhesive layer. If it carries out like this, it will become possible to detect the termination
- the circuit connection tape according to one aspect of the present invention is a long circuit connection tape having a tape-shaped base material and an adhesive layer formed on one surface thereof, on the surface of the adhesive layer, An end mark having a non-slip process is provided, and the frictional force between the end mark and the base material is 100 gf or more. Further, the circuit connection tape according to one aspect of the present invention is a long circuit connection tape having a tape-shaped base material and an adhesive layer formed on one surface thereof, and is provided at the end portion of the base material.
- the end mark provided with the anti-slip process or the cover tape provided with the anti-slip process is provided on the surface on the adhesive layer side.
- the friction force between the cover tape and the base material is set to 100 gf or more. This prevents slippage between the end mark and the back surface of the base material or slippage between the cover tape and the back surface of the base material when the circuit connecting tape is rolled up, thereby preventing the occurrence of idle rotation. Can be suppressed. Therefore, it is possible to obtain excellent connection reliability when manufacturing the circuit connector.
- the use of the laminated tape of one aspect of the present invention as a circuit connection material is provided on the surface of the tape-shaped base material, the adhesive layer formed on one surface of the base material, and the adhesive layer, A laminated tape having a non-slip-processed end mark and a frictional force between the end mark and the base material of 100 gf or more.
- the use of the laminated tape of one aspect of the present invention as a circuit connecting material is connected to a tape-shaped base material, an adhesive layer formed on one surface of the base material, and a terminal portion of the base material.
- the frictional force between the cover tape and the substrate is 100 gf or more as a circuit connection material for a laminated tape.
- the use of the laminated tape according to one aspect of the present invention for the production of a circuit connecting material includes a tape-like base material, an adhesive layer formed on one surface of the base material, and a surface of the adhesive layer.
- an end mark provided with an anti-slip process, and the frictional force between the end mark and the substrate is 100 gf or more for use in the production of a circuit connecting material for laminated tape.
- the use of the laminated tape according to one aspect of the present invention for the production of a circuit connecting material includes a tape-like base material, an adhesive layer formed on one surface of the base material, and a terminal portion of the base material.
- the method for manufacturing a circuit connection body includes a tape-like base material and a circuit connection tape having an adhesive layer formed on one surface thereof, and a winding in which the circuit connection tape is wound.
- An end mark provided with an anti-slip process on the surface of the adhesive layer, and the frictional force between the end mark and the substrate is 100 gf or more from the adhesive reel.
- the fed circuit connection tape is placed on the first circuit electrode of the first circuit member, the first circuit member and the circuit connection tape are pressurized, and the adhesive layer is attached to the first circuit member.
- the second circuit member is placed on the adhesive layer and bonded so that the second circuit electrode of the second circuit member is in contact with the adhesive layer. While heating the adhesive layer, pressurize the first circuit member and the second circuit member to cure the adhesive layer. Obtaining a circuit connection member to form a connecting portion.
- the method for manufacturing a circuit connection body includes a tape-like base material and a circuit connection tape having an adhesive layer formed on one surface thereof, and a winding in which the circuit connection tape is wound.
- a circuit connecting tape having an end tape connected to the winding core and the terminal end portion of the base material, the terminal end portion of the base material having a length corresponding to at least one turn of the core.
- a non-adhesive region in which an adhesive layer is not formed is provided, and in the non-adhesive region, a cover tape that has been subjected to anti-slip processing is provided, and the frictional force between the cover tape and the substrate is
- the circuit connection tape fed out from the adhesive reel of 100 gf or more is placed on the first circuit electrode of the first circuit member, and the first circuit member and the circuit connection tape are pressurized and bonded.
- the second circuit member is placed on the adhesive layer so that the second circuit electrode of the second circuit member is in contact with the adhesive layer, and the first circuit member and the second circuit member are heated while heating the adhesive layer.
- the circuit member is pressed to form a connection portion by curing the adhesive layer to obtain a circuit connection body.
- the present invention when pulling out the circuit connection tape from the adhesive reel, it is possible to suppress idle rotation due to slippage between the circuit connection tapes wound around, and excellent in manufacturing the circuit connection body. Connection reliability can be obtained.
- FIG. 1 is a perspective view showing an example of an adhesive reel
- FIG. 2 is a cross-sectional view showing a state where the adhesive reel of FIG. 1 is mounted on a rotating shaft of a crimping apparatus.
- the adhesive reel 10 includes a cylindrical core 1 and disk-shaped side plates 2 provided on both end surfaces of the core 1 in the axial direction.
- a long anisotropic conductive tape (circuit connection tape) 5A is wound around the outer surface 1a of the core 1 so that the anisotropic conductive tape 5A is wound.
- the inner surface of the core 1 is a shaft hole 10a for mounting on the rotating shaft 25a of the crimping device 25 (see FIG. 2).
- the outer diameter of the core 1 is not particularly limited, but is preferably 4 to 15 cm from the viewpoint of handleability.
- FIG. 3 is a schematic cross-sectional view showing an example of the anisotropic conductive tape.
- the anisotropic conductive tape 5 ⁇ / b> A includes a tape-shaped base 6 and an adhesive layer 8 formed on one surface of the base 6.
- the length of the substrate 6 is, for example, about 1 to 400 m, and preferably 50 to 300 m.
- the thickness of the substrate 6 is, for example, about 4 to 200 ⁇ m, preferably 20 to 100 ⁇ m.
- the width of the substrate 6 is, for example, about 0.5 to 30 mm, and preferably 0.5 to 3.0 mm.
- the length, thickness, and width of the substrate 6 are not limited to the above ranges.
- variety of the base material 6 is the same as the width
- the substrate 6 examples include polyethylene terephthalate, polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, ethylene / vinyl acetate copolymer, polyvinyl chloride, and polyvinylidene chloride.
- Various tapes made of synthetic rubber or liquid crystal polymer can be used.
- the material which comprises the base material 6 is not limited to these. Moreover, you may use as the base material 6 what the mold release process was performed to the contact surface etc. with the adhesive bond layer 8. FIG.
- the adhesive layer 8 is made of an adhesive composition, and this adhesive composition contains, for example, an adhesive component 8a and conductive particles 8b.
- the thickness of the adhesive layer 8 may be appropriately selected according to the adhesive component to be used and the type of the adherend, and is, for example, 5 to 100 ⁇ m, preferably 10 to 40 ⁇ m. Further, the width of the adhesive layer 8 may be adjusted according to the intended use, for example, about 0.5 to 5 mm, preferably 0.5 to 3.0 mm.
- the adhesive component 8a of the adhesive layer 8 a material that exhibits curability by heat or light can be widely applied, and an epoxy adhesive or an acrylic adhesive can be used. Moreover, since it is excellent in the heat resistance and moisture resistance after a connection, use of a crosslinkable material is preferable. Among them, an epoxy adhesive containing an epoxy resin, which is a thermosetting resin, as a main component is preferable because it can be cured in a short time, has good connection workability, and has excellent adhesion in terms of molecular structure. . Further, according to the study by the present inventors, when an acrylic adhesive is used as the adhesive component 8a, the transfer of the adhesive layer 8 to the substrate back surface 6c is less than when an epoxy adhesive is used. Since it is easy to occur, it is preferable to use an epoxy adhesive also from this point.
- the epoxy adhesive examples include high molecular weight epoxy, solid epoxy or liquid epoxy, or epoxy modified with urethane, polyester, acrylic rubber, nitrile rubber (NBR), synthetic linear polyamide, or the like as a main component. Things.
- the epoxy adhesive is generally obtained by adding a curing agent, a catalyst, a coupling agent, a filler, or the like to the above-mentioned epoxy which is a main component.
- acrylic adhesive examples include a polymer or copolymer having at least one of acrylic acid, acrylic ester, methacrylic ester and acrylonitrile as a monomer component.
- the conductive particles 8b are dispersed in the adhesive component 8a.
- the conductive particles 8b include metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, and solder, and carbon particles.
- coated particles in which non-conductive glass, ceramic, plastic, or the like is used as a core and the core is coated with the above metal or carbon may be used.
- the average particle diameter of the conductive particles 8b is preferably 1 to 18 ⁇ m from the viewpoint of dispersibility and conductivity. Insulating coating particles obtained by coating conductive particles with an insulating layer may be used, and conductive particles and insulating particles may be used in combination from the viewpoint of improving the insulation between adjacent electrodes.
- the blending ratio of the conductive particles 8b is, for example, 0.1 to 30 parts by volume, preferably 0.1 to 10 parts by volume with respect to 100 parts by volume of the adhesive component contained in the adhesive layer 8. If the blending ratio is less than 0.1 part by volume, the connection resistance between the opposing electrodes tends to be high, and if it exceeds 30 parts by volume, a short circuit between adjacent electrodes tends to occur. Note that, depending on the use of the anisotropic conductive tape 5A, the adhesive layer 8 may be composed of only the adhesive component 8a without blending the conductive particles 8b.
- FIG. 4 is a schematic cross-sectional view showing a terminal portion of the anisotropic conductive tape according to the first embodiment of the present invention.
- the end portion 6 a of the base material 6 is connected to the start end portion 12 b of the end tape 12.
- the end portion 12 a of the end tape 12 is connected to the outer surface 1 a of the core 1.
- the connection between the start end 12b of the end tape 12 and the end 6a of the base 6 is made by a cover tape 14 and an adhesive tape 16 described later. Further, the connection between the end portion 12a of the end tape 12 and the outer surface 1a is performed here by a double-sided tape.
- Examples of the material constituting the end tape 12 include the same materials (for example, polyethylene terephthalate) as those constituting the base material 6 described above.
- the length of the end tape 12 may be appropriately set according to the configuration of the crimping device 25, for example, to match the distance from the rotary shaft 25a on which the adhesive reel 10 is mounted to the position where the crimping operation is performed. It is about 5 to 5 m, preferably 1 to 3 m.
- the thickness of the end tape 12 may be appropriately set according to the required strength and the like, and is, for example, 10 to 100 ⁇ m, preferably 30 to 70 ⁇ m.
- the width of the end tape 12 may be appropriately set according to the width of the substrate 6 or the adhesive layer 8, and is, for example, about 0.5 to 5 mm, preferably 0.5 to 3.0 mm.
- At least one surface of the end tape 12 is anti-slip processed.
- the anisotropic conductive tape 5A having a desired length can be drawn out with sufficiently high accuracy.
- Non-slip processing is particularly useful when the length of the end tape 12 is 1 m or longer.
- Specific examples of the anti-slip process include embossing on the surface of the end tape 12 and application of rubber or the like on the surface.
- the end portion 6 a of the base 6 is provided with a non-adhesive region 5 b where the adhesive layer 8 is not formed on the front side of the end tape 12.
- the non-adhesive region 5b is provided over a length of at least one turn in a state where the anisotropic conductive tape 5A is wound around the core 1 to form a wound body.
- the non-adhesive region 5b can be formed, for example, by removing the adhesive layer in a predetermined region of the anisotropic conductive film in the process of manufacturing the anisotropic conductive tape 5A by cutting the anisotropic conductive film into a predetermined width. .
- the length for providing the non-adhesion region 5b is not particularly limited as long as it is equal to or longer than the length of one turn in a wound state, and may be two turns or three turns. . However, although it depends on the diameter of the core 1, if the length of the non-adhesive region 5 b exceeds 0.5 m, the cover tape 14 is likely to be displaced when bonded to the non-adhesive region 5 b.
- the length of the region 5b is preferably 0.5 m or less.
- a cover tape 14 is provided in the non-adhesive region 5b so as to cover the non-adhesive region 5b.
- the end portion 14 a of the cover tape 14 extends to the start end portion 12 b side of the end tape 12 and covers the boundary portion between the base material 6 and the end tape 12.
- FIG. 5 is a schematic cross-sectional view showing a first modification of the terminal end shown in FIG.
- the start end portion 14 b of the cover tape 14 is preferably extended so as to cover the end portion 8 c of the adhesive layer 8 from the viewpoint of preventing peeling of the adhesive layer 8.
- it can also be set as the structure which provides a space between the termination
- the surface of the cover tape 14 is anti-slip processed.
- Examples of the anti-slip process include embossing on the surface of the cover tape 14 and application of rubber or the like on the surface.
- the adhesive tape 16 which will be described later, is positioned below the cover tape 14 in a state where the anisotropic conductive tape 5 ⁇ / b> A is wound around the core 1 to form a wound body.
- the cover tape 14 may peel off the adhesive tape 16 at the same time.
- the cover tape 14 comes into contact with the substrate back surface 6c located in the lower layer of the cover tape 14, but the anisotropic conductive tape In 5A, the anti-slip process is performed so that the frictional force between the substrate back surface 6c and the cover tape 14 is 100 gf or more.
- the hue of the cover tape 14 is different from the hue of the adhesive layer 8. For this reason, it is possible to automatically detect the end portion of the anisotropic conductive tape 5 ⁇ / b> A by a detecting means (not shown) provided in the crimping device 25. Thus, the cover tape 14 also functions as an end mark.
- cover tape 14 examples include the same materials as those constituting the substrate 6 (for example, polyethylene terephthalate). Further, if the cover tape 14 includes a base material, a problem such as blocking may occur due to a difference in level due to the thickness of the base material. It is preferable that it is a double-sided tape-like material.
- the thickness of the cover tape 14 is, for example, 10 to 100 ⁇ m, preferably 30 to 70 ⁇ m. Further, the width of the cover tape 14 may be appropriately set according to the width of the substrate 6 or the adhesive layer 8, and is, for example, about 0.5 to 5 mm, and preferably 0.5 to 3.0 mm.
- the length of the cover tape 14 is such that the pressure-sensitive adhesive tape 16 is covered with the cover tape 14 over the entire length in a state where the anisotropic conductive tape 5A is wound around the winding core 1 to form a wound body. Is preferred.
- the adhesive tape 16 is affixed to the boundary portion between the terminal portion 6a of the substrate 6 and the start end portion 12b of the end tape 12 on the substrate back surface 6c side so as to cover the boundary portion.
- the adhesive tape 16 is a tape for increasing the connection strength between the substrate 6 and the end tape 12. If the connection strength between the base 6 and the end tape 12 can be sufficiently secured with only the cover tape 14, the adhesive tape 16 may not be attached. Further, when the connection strength between the base material 6 and the end tape 12 can be sufficiently secured only by the adhesive tape 16, the cover tape 14 does not have to extend to the start end portion 12 b side of the end tape 12.
- FIG. 6 is a schematic cross-sectional view showing a second modification of the terminal end shown in FIG.
- an adhesive tape 16 is provided on the surface on the adhesive layer 8 side so as to cover the boundary portion between the end portion 6 a of the base 6 and the start end portion 12 b of the end tape 12.
- a cover tape 14 may be provided so as to further cover 16.
- the length of the adhesive tape 16 is, for example, about 5 to 30 mm, preferably 10 to 20 mm.
- the thickness of the pressure-sensitive adhesive tape 16 may be appropriately set according to the required strength and the like, and is, for example, 10 to 100 ⁇ m, and preferably 30 to 70 ⁇ m.
- the width of the pressure-sensitive adhesive tape 16 may be appropriately set according to the width of the substrate 6 or the adhesive layer 8, and is, for example, about 0.5 to 5 mm, preferably 0.5 to 3.0 mm.
- circuit connection Next, a circuit connection body manufactured by using the adhesive layer 8 of the adhesive reel 10 according to this embodiment as a circuit connection material will be described.
- FIG. 7 is a schematic cross-sectional view showing a circuit connection body in which circuit electrodes are connected to each other.
- the circuit connector 100 includes a first circuit member 30 and a second circuit member 40 facing each other, and the first circuit member 30 and the second circuit member 40 are connected to each other. A connecting portion 50a for connecting them is provided between them.
- the first circuit member 30 includes a circuit board 31 and circuit electrodes 32 formed on the main surface 31 a of the circuit board 31.
- the second circuit member 40 includes a circuit board 41 and circuit electrodes 42 formed on the main surface 41 a of the circuit board 41.
- the circuit member on one side include chip components such as a semiconductor chip (IC chip), a resistor chip, and a capacitor chip. These circuit members are generally provided with a large number of circuit electrodes.
- Specific examples of the circuit member on the other side include a flexible substrate having metal wiring, a flexible printed wiring board, and a wiring substrate such as a glass substrate on which indium tin oxide (ITO) is deposited. Since the anisotropic conductive tape 5A can discharge static electricity to the outside, when connecting these circuit members, the anisotropic conductive tape 5A pulled out from the adhesive reel 10 can be used to efficiently connect the circuit members to each other. Connection can be made with high connection reliability.
- the anisotropic conductive tape 5A according to the present embodiment is suitable for COG mounting (Chip On Glass) or COF mounting (Chip On Flex) on a wiring board of a chip component having many fine connection terminals (circuit electrodes). It is.
- each circuit electrode 32, 42 may be composed of one kind selected from gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, and indium tin oxide (ITO), or two or more kinds. It may be comprised. Moreover, the material of the surface of the circuit electrodes 32 and 42 may be the same in all the circuit electrodes, or may be different.
- the connecting portion 50a includes a cured product 8A of the adhesive component 8a included in the adhesive layer 8, and conductive particles 8b dispersed therein. And in the circuit connection body 100, the circuit electrode 32 and the circuit electrode 42 which oppose are electrically connected through the conductive particle 8b. That is, the conductive particles 8 b are in direct contact with both the circuit electrodes 32 and 42. For this reason, the connection resistance between the circuit electrodes 32 and 42 is sufficiently reduced, and a good electrical connection between the circuit electrodes 32 and 42 becomes possible. On the other hand, the cured product 8A has electrical insulation, and the insulation between adjacent circuit electrodes is ensured. Therefore, the flow of current between the circuit electrodes 32 and 42 can be made smooth, and the functions of the circuit can be fully exhibited.
- FIG. 8 is a process diagram showing a schematic cross-sectional view of an embodiment of a method for manufacturing a circuit connector.
- the adhesive layer 8 of the anisotropic conductive tape 5A is thermally cured to finally manufacture the circuit connector 100.
- the adhesive reel 10 is mounted on the rotating shaft of a connection device (not shown).
- the anisotropic conductive tape 5A is pulled out from the adhesive reel 10 so that the adhesive layer 8 faces downward.
- the anisotropic conductive tape 5A is cut into a predetermined length and placed on the first circuit electrode 32 of the first circuit member 30 (see FIG. 8A).
- the first circuit member 30 and the anisotropic conductive tape 5A are pressurized in the directions of arrows A and B, and the adhesive layer 8 is temporarily connected to the first circuit member 30 (see FIG. 8B).
- the pressure at this time is not particularly limited as long as it does not damage the circuit member, but it is generally preferably 0.1 to 30.0 MPa.
- you may pressurize, heating, and let heating temperature be the temperature which the adhesive bond layer 8 does not harden
- the heating temperature is preferably 50 to 100 ° C. These heating and pressurization are preferably performed in the range of 0.1 to 2 seconds.
- the heating temperature at this time is set to a temperature at which the adhesive component 8a of the adhesive layer 8 can be cured.
- the heating temperature is preferably 60 to 180 ° C, more preferably 70 to 170 ° C, and still more preferably 80 to 160 ° C. If the heating temperature is less than 60 ° C, the curing rate tends to be slow, and if it exceeds 180 ° C, unwanted side reactions tend to proceed.
- the heating time is preferably 0.1 to 180 seconds, more preferably 0.5 to 180 seconds, and still more preferably 1 to 180 seconds.
- connection part 50a is formed by hardening of the adhesive component 8a, and the circuit connection body 100 as shown in FIG. 7 is obtained.
- the connection conditions are appropriately selected depending on the application to be used, the adhesive composition, and the circuit member.
- the adhesive layer 8 may be appropriately irradiated with actinic rays or energy rays.
- the active light include ultraviolet light, visible light, and infrared light.
- energy rays include electron beams, X-rays, ⁇ rays, and microwaves.
- a cover tape 14 with anti-slip processing is provided on the surface on the adhesive layer 8 side.
- the frictional force with the back surface 6c is set to 100 gf or more. This prevents slipping between the cover tape 14 and the back surface of the base material 6 when the anisotropic conductive tape 5A wound around the core 1 and wound into a wound body is pulled out from the adhesive reel 10, and is idle. Can be suppressed. Therefore, it is possible to obtain excellent connection reliability when manufacturing the circuit connector.
- the cover tape 14 extends to the start end portion 12 b of the end tape 12 and covers the boundary portion between the base material 6 and the end tape 12.
- the connection strength with the tape 12 can be improved.
- the adhesive tape is provided so as to cover the boundary portion between the terminal end 6a of the base 6 and the start end 12b of the end tape 12, the base 6 and the end tape 12 Connection strength can be further improved.
- the anisotropic conductive tape 5A since at least one surface of the end tape 12 is subjected to anti-slip processing, the slip between the end tape 12 and the substrate back surface 6c is prevented, and the idle tape is more reliably rotated. Occurrence can be suppressed.
- the end portion of the anisotropic conductive tape 5A can be automatically detected.
- FIG. 9 is a schematic cross-sectional view showing a process of pulling out the anisotropic conductive tape according to Comparative Example 1 from the reel.
- the anisotropic conductive tape 55 according to Comparative Example 1 is different from the anisotropic conductive tape 5A according to the first embodiment in that the adhesive layer 8 is formed up to the connection portion between the base material 6 and the end tape 12. In connection with this, the non-adhesion area
- the outer surface 1a of the core 1 is drawn with a straight line, but it actually forms an arc.
- the adhesive layer 8 is also present in the upper layer.
- the adhesive layer 8 peels off from the substrate 6 due to the thickness of the adhesive tape 16 or the influence of the adhesive, and is transferred to the back surface of the upper substrate 6 to cause blocking. (See FIG. 9B).
- the adhesive layer 8 cannot be properly supplied to the crimping device 25 (see FIG. 9C). As a result, connection reliability of the circuit connector may not be ensured.
- FIG. 10 is a schematic cross-sectional view showing a process of pulling out the anisotropic conductive tape according to Comparative Example 2 from the reel.
- the anisotropic conductive tape 56 according to Comparative Example 2 is different from the anisotropic conductive tape 55 according to Comparative Example 1 in that the position where the adhesive tape 16 is provided is on the side of the adhesive layer 8 of the anisotropic conductive tape.
- the adhesive 16 a penetrates between the material 6 and the end tape 12.
- the adhesive layer 8 is also formed on the upper layer of the connection portion between the anisotropic conductive tape 56 and the end tape 12. Exists.
- the adhesive layer 8 is peeled off from the base material 6 due to the thickness of the pressure sensitive adhesive tape 16 or the influence of the pressure sensitive adhesive 16a and transferred to the back surface of the upper base material 6 to cause blocking. (See FIG. 10B).
- the adhesive layer 8 cannot be properly supplied to the crimping device 25 (see FIG. 10c). As a result, the connection reliability of the circuit connection body may not be ensured.
- the anisotropic conductive tape 5A since the non-adhesive region 5b where the adhesive layer 8 does not exist is formed in the terminal portion 6a of the base material 6, the anisotropic conductive tape 5A is formed from the core 1.
- the non-adhesive region 5b is located in the upper layer of the connection portion between the base material 6 and the end tape 12 in a state of being wound and wound. If the connection part is covered with the non-adhesion region 5b, even if there is some unevenness in the connection part, the occurrence of blocking due to this can be sufficiently suppressed.
- FIG. 11 is a schematic cross-sectional view showing the end portion of the anisotropic conductive tape according to the second embodiment of the present invention
- FIG. 12 is an adhesive reel provided with the anisotropic conductive tape of FIG. 11 attached to the rotating shaft of the crimping apparatus. It is sectional drawing which shows a state.
- the anisotropic conductive tape 5B is different from the anisotropic conductive tape 5A according to the first embodiment shown in FIG. 4 in that the end tape 12 is not provided, and accordingly, the non-adhesive region 5b and the cover tape covering the same. 14 and the adhesive tape 16 are not provided, and an end mark 18 is provided on the surface of the adhesive layer 8.
- the length of the end mark 18 may be appropriately set according to the configuration of the crimping device 25 and the like, and is, for example, about 3 cm to 50 cm, and preferably about 5 cm to 0.4 m.
- the thickness of the end mark 18 is, for example, about 10 to 100 ⁇ m, and preferably about 30 to 70 ⁇ m.
- the width of the end mark 18 may be adjusted to the width of the substrate 6 or the adhesive layer 8 and is, for example, about 0.5 to 5 mm, preferably about 0.5 to 3.0 mm.
- Examples of the material constituting the end mark 18 include the same materials (for example, polyethylene terephthalate) as those constituting the substrate 6 described above. Further, if the end mark 18 includes a base material, a problem such as blocking may occur due to a step due to the thickness of the base material. It is preferable that it is a double-sided tape-like material.
- the end mark 18 is anti-slip processed.
- Specific examples of the anti-slip process include embossing on the end mark surface and application of rubber or the like to the surface.
- the end mark 18 comes into contact with the substrate back surface 6c located under the end mark 18, but the anisotropic conductive tape In 5B, anti-slip processing is applied so that the frictional force between the substrate back surface 6c and the end mark 18 is 100 gf or more.
- an end mark 18 on which anti-slip processing is applied is provided on the surface of the adhesive layer 8, and the frictional force between the end mark 18 and the substrate back surface 6c is as follows. 100 gf or more. This prevents slipping between the end mark 18 and the back surface of the substrate 6 when the anisotropic conductive tape 5B wound around the core 1 and wound into a wound body is pulled out from the adhesive reel 10, and the idle winding Can be suppressed. Therefore, it is possible to obtain excellent connection reliability when manufacturing the circuit connector.
- the present invention is not limited to the above embodiment.
- a hue difference may be provided between 12 and the substrate 6 or the adhesive layer 8.
- a hue difference may be provided between 12 and the substrate 6 or the adhesive layer 8.
- a black end tape 12 may be used.
- a hue difference may be provided between the front surface and the back surface of the end tape 12.
- the anisotropic conductive tapes 5A and 5B having the adhesive layer 8 having a single layer structure are exemplified, but the adhesive layer 8 may have a multilayer structure.
- An anisotropic conductive tape having an adhesive layer having a multilayer structure can be produced by laminating a plurality of layers having different types of adhesive components and conductive particles or different contents thereof on the substrate 6.
- an adhesive layer having a two-layer structure may be constituted by a conductive particle non-containing layer not containing conductive particles and a conductive particle containing layer containing conductive particles.
- the adhesive component of the conductive particle non-containing layer and the conductive particle-containing layer the same adhesive component as that of the adhesive layer 8 described above can be used.
- the anisotropic conductive tapes 5A and 5B are exemplified as the circuit connecting tape.
- the circuit connecting tape may be a non-conductive tape that does not contain the conductive particles 8b.
- a white PET film (manufactured by Teijin DuPont Films Ltd.) was prepared as a circuit connection tape.
- polyester film tape No. 631U # 12 (manufactured by Teraoka Seisakusho) was prepared.
- An insulating black adhesive tape (manufactured by Teraoka Seisakusho Co., Ltd.) was prepared as a cover tape.
- Lumirror X30-50 (manufactured by Toray Industries, Inc.) was prepared as an end tape.
- Example 1 An embossed end mark was attached to the adhesive layer side surface of the circuit connection tape having a width of 1.5 mm to obtain a sample tape.
- Example 2 An end tape, a non-adhesive region, and a cover tape were provided at the end of the circuit connection tape having a width of 1.5 mm, and the cover tape was embossed to obtain a sample tape.
- Example 3 An end mark subjected to embossing was attached to the adhesive layer side surface of the circuit connection tape having a width of 1.5 mm, and a phenoxy resin was further applied to the end mark to obtain a sample tape.
- Example 4 An end mark with embossing was attached to the adhesive layer side surface of the circuit connection tape having a width of 1.5 mm, and acrylic rubber was applied to the end mark to obtain a sample tape.
- FIG. 13 is a schematic configuration diagram showing a measuring device for the frictional force between the cover tape or end mark and the substrate.
- the same base tape as the base of the circuit connection tape is applied to the surface of the fixed roll 200 having a diameter of 30 mm, thereby providing the back of the base on the surface of the fixed roll 200. It was.
- the surface of the sample tape S on which the end mark 18 or the cover tape 14 was attached was placed along a part of the lower side of the fixed roll 200. The length to be along was about 45 degrees in terms of the angle of the fixed roll 200.
- a 50 g weight 400 is suspended at the end along the upper side of the rotatable free roll 300 having a diameter of 40 mm.
- Tensilon RTM-50 (hereinafter referred to as “Tensilon”) was pulled upward at a speed of 50 mm / min.
- Tensilon was pulled upward at a speed of 50 mm / min.
- the tensile load when the back surface of the substrate and the end mark 18 or the cover tape 14 began to slide was measured with Tensilon, and this tensile load was defined as the frictional force.
- the evaluation results are shown in Tables 1 and 2.
- Example 1 to 4 the frictional force between the cover tape or end mark and the substrate was 100 gf or more.
- the idling start load was 400 gf or more, which is considered to cause almost no problems due to idling, and a satisfactory idling start load was obtained. In Examples 1 to 4, no blocking occurred.
- the frictional force between the adhesive layer and the substrate was 600 gf, and the idling start load was 700 gf, both of which were the same as in Examples 1 to 4.
- the end mark and the end tape are not provided, it is impossible to reduce the adhesive layer that is discarded without being used or to visually recognize the terminal portion of the circuit connecting tape.
- SYMBOLS 1 ... Core, 5 ... Anisotropic conductive tape (circuit connection tape), 5b ... Non-adhesion area
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Abstract
Description
また、本発明の一側面の積層テープの回路接続材料としての使用は、テープ状の基材と、基材の一方面上に形成された接着剤層と、接着剤層の表面に設けられ、滑り止め加工が施されたエンドマークと、を備え、エンドマークと基材との間の摩擦力は、100gf以上である積層テープの回路接続材料としての使用である。
また、本発明の一側面の積層テープの回路接続材料としての使用は、テープ状の基材と、基材の一方面上に形成された接着剤層と、基材の終端部に接続されたエンドテープと、基材の終端部においてエンドテープよりも手前側に設けられ、接着剤層が形成されていない非接着領域と、非接着領域に設けられ、滑り止め加工が施されたカバーテープと、を備え、カバーテープと基材との間の摩擦力は、100gf以上である積層テープの回路接続材料としての使用である。
また、本発明の一側面の積層テープの回路接続材料の製造のための使用は、テープ状の基材と、基材の一方面上に形成された接着剤層と、接着剤層の表面に設けられ、滑り止め加工が施されたエンドマークと、を備え、エンドマークと基材との間の摩擦力は、100gf以上である積層テープの回路接続材料の製造のための使用である。
また、本発明の一側面の積層テープの回路接続材料の製造のための使用は、テープ状の基材と、基材の一方面上に形成された接着剤層と、基材の終端部に接続されたエンドテープと、基材の終端部においてエンドテープよりも手前側に設けられ、接着剤層が形成されていない非接着領域と、非接着領域に設けられ、滑り止め加工が施されたカバーテープと、を備え、カバーテープと基材との間の摩擦力は、100gf以上である積層テープの回路接続材料の製造のための使用である。
また、本発明の一側面の回路接続体の製造方法は、テープ状の基材及びその一方面上に形成された接着剤層を有する回路接続用テープと、回路接続用テープが巻かれた巻芯と、を備え、接着剤層の表面には、滑り止め加工が施されたエンドマークが設けられており、エンドマークと基材との間の摩擦力は、100gf以上である接着剤リールから繰り出された回路接続用テープを、第1の回路部材の第1の回路電極上に載置し、第1の回路部材と回路接続用テープとを加圧し、接着剤層を第1の回路部材に仮接続し、接着剤層から基材を剥がし、第2の回路部材の第2の回路電極が接着剤層と接するように、第2の回路部材を接着剤層上に載置し、接着剤層を加熱しながら、第1の回路部材と第2の回路部材とを加圧し、接着剤層の硬化により接続部を形成して回路接続体を得る。
また、本発明の一側面の回路接続体の製造方法は、テープ状の基材及びその一方面上に形成された接着剤層を有する回路接続用テープと、回路接続用テープが巻かれた巻芯と、を備え、回路接続用テープは、巻芯と基材の終端部とに接続されたエンドテープを有し、基材の終端部には、少なくとも巻芯の一巻き分の長さにわたって、接着剤層が形成されていない非接着領域が設けられ、非接着領域には、滑り止め加工が施されたカバーテープが設けられており、カバーテープと基材との間の摩擦力は、100gf以上である接着剤リールから繰り出された回路接続用テープを、第1の回路部材の第1の回路電極上に載置し、第1の回路部材と回路接続用テープとを加圧し、接着剤層を第1の回路部材に仮接続し、接着剤層から基材を剥がし、第2の回路部材の第2の回路電極が接着剤層と接するように、第2の回路部材を接着剤層上に載置し、接着剤層を加熱しながら、第1の回路部材と第2の回路部材とを加圧し、接着剤層の硬化により接続部を形成して回路接続体を得る。
次に、本実施形態に係る接着剤リール10の接着剤層8が回路接続材料として使用されて製造された回路接続体について説明する。
次に、回路接続体100の製造方法について説明する。
回路接続用テープとして、白色PETフィルム(帝人デュポンフィルム株式会社製)を準備した。エンドマークとして、ポリエステルフィルムテープNo.631U#12(株式会社寺岡製作所製)を準備した。カバーテープとして、絶縁用の黒色粘着テープ(株式会社寺岡製作所製)を準備した。エンドテープとして、ルミラーX30-50(東レ株式会社製)を準備した。
(実施例1)
幅1.5mmの回路接続用テープの接着剤層側の面に、エンボス加工が施されたエンドマークを貼り付け、試料テープとした。
幅1.5mmの回路接続用テープの終端部に、エンドテープ、非接着領域及びカバーテープを設け、カバーテープにはエンボス加工を施して試料テープとした。
幅1.5mmの回路接続用テープの接着剤層側の面に、エンボス加工が施されたエンドマークを貼り付け、さらにエンドマークにフェノキシ樹脂を塗布して試料テープとした。
幅1.5mmの回路接続用テープの接着剤層側の面に、エンボス加工が施されたエンドマークを貼り付け、さらにエンドマークにアクリルゴムを塗布して試料テープとした。
幅1.5mmの回路接続用テープの接着剤層側の面に、滑り止め加工が施されていないエンドマークを貼り付け、試料テープとした。
幅1.5mmの回路接続用テープの接着剤層側の面に、両面にアクリル系粘着剤が塗布されたエンドマークを貼り付け、試料テープとした。
幅1.5mmの回路接続用テープの終端部に、エンドテープ、非接着領域及びカバーテープを設けて試料テープとした。カバーテープには、滑り止め加工は施さなかった。
エンドマーク及びカバーテープの無い幅1.5mmの回路接続用テープをそのまま試料テープとした。
図13は、カバーテープ又はエンドマークと基材との間の摩擦力の測定装置を示す概略構成図である。図13に示すように、固定された直径30mmの固定ロール200の表面に、回路接続用テープの基材と同一の基材テープを貼り付け、これにより固定ロール200の表面に基材背面を設けた。試料テープSのエンドマーク18又はカバーテープ14が貼り付けられた面を固定ロール200の下側の一部に沿わせた。沿わせる長さは、固定ロール200における角度で45度程度であった。固定ロール200を挟んで試料テープSの一方側は、回転可能な直径40mmのフリーロール300の上側に沿わせて、端に50gの分銅400を吊り下げ、他方側は、端を株式会社オリエンテック製テンシロンRTM-50(以下、「テンシロン」という)で50mm/minの速度で上方に引っ張った。この際、基材背面とエンドマーク18又はカバーテープ14とが滑り始めるときの引張荷重をテンシロンで測定し、この引張荷重を摩擦力とした。評価結果を表1、2に示す。
リール状態の試料テープをテンシロンで50mm/minの速度で引き出した。この際、空回りを始めるときの引張荷重をテンシロンで測定し、この引張荷重を空回り開始荷重とした。評価結果を表1、2に示す。
30℃(湿度は40~60%RH)に固定された恒温槽中に、リール状態の試料テープを横にし、1日(24h)放置した。その後、テンシロンで1m/minの速度で試料テープを終端部まで引き出した。評価結果を表1、2に示す。
Claims (14)
- テープ状の基材及びその一方面上に形成された接着剤層を有する回路接続用テープと、前記回路接続用テープが巻かれた巻芯とを備える接着剤リールであって、
前記接着剤層の表面には、滑り止め加工が施されたエンドマークが設けられており、
前記エンドマークと前記基材との間の摩擦力は、100gf以上であることを特徴とする接着剤リール。 - テープ状の基材及びその一方面上に形成された接着剤層を有する回路接続用テープと、前記回路接続用テープが巻かれた巻芯とを備える接着剤リールであって、
前記回路接続用テープは、前記巻芯と前記基材の終端部とに接続されたエンドテープを有し、
前記基材の終端部には、少なくとも前記巻芯の一巻き分の長さにわたって、前記接着剤層が形成されていない非接着領域が設けられ、
前記非接着領域には、滑り止め加工が施されたカバーテープが設けられており、
前記カバーテープと前記基材との間の摩擦力は、100gf以上であることを特徴とする接着剤リール。 - 前記カバーテープは、前記基材と前記エンドテープとの境界部分を覆うように設けられていることを特徴とする請求項2に記載の接着剤リール。
- 前記基材と前記エンドテープとの境界部分を覆うように粘着テープが設けられていることを特徴とする請求項2又は3に記載の接着剤リール。
- 前記エンドテープの少なくとも一方の面に滑り止め加工が施されていることを特徴とする請求項2~4のいずれか一項に記載の接着剤リール。
- 前記カバーテープの色相は、前記接着剤層の色相と異なっていることを特徴とする請求項2~5のいずれか一項に記載の接着剤リール。
- テープ状の基材及びその一方面上に形成された接着剤層を有する長尺の回路接続用テープであって、
前記接着剤層の表面には、滑り止め加工が施されたエンドマークを備え、
前記エンドマークと前記基材との間の摩擦力は、100gf以上であることを特徴とする回路接続用テープ。 - テープ状の基材及びその一方面上に形成された接着剤層を有する長尺の回路接続用テープであって、
前記基材の終端部には、エンドテープが接続されていると共に、前記エンドテープよりも手前側に前記接着剤層が形成されていない非接着領域が設けられ、
前記非接着領域には、滑り止め加工が施されたカバーテープが設けられており、
前記カバーテープと前記基材との間の摩擦力は、100gf以上であることを特徴とする回路接続用テープ。 - テープ状の基材と、
前記基材の一方面上に形成された接着剤層と、
前記接着剤層の表面に設けられ、滑り止め加工が施されたエンドマークと、を備え、
前記エンドマークと前記基材との間の摩擦力は、100gf以上である積層テープの回路接続材料としての使用。 - テープ状の基材と、
前記基材の一方面上に形成された接着剤層と、
前記基材の終端部に接続されたエンドテープと、
前記基材の終端部において前記エンドテープよりも手前側に設けられ、前記接着剤層が形成されていない非接着領域と、
前記非接着領域に設けられ、滑り止め加工が施されたカバーテープと、を備え、
前記カバーテープと前記基材との間の摩擦力は、100gf以上である積層テープの回路接続材料としての使用。 - テープ状の基材と、
前記基材の一方面上に形成された接着剤層と、
前記接着剤層の表面に設けられ、滑り止め加工が施されたエンドマークと、を備え、
前記エンドマークと前記基材との間の摩擦力は、100gf以上である積層テープの回路接続材料の製造のための使用。 - テープ状の基材と、
前記基材の一方面上に形成された接着剤層と、
前記基材の終端部に接続されたエンドテープと、
前記基材の終端部において前記エンドテープよりも手前側に設けられ、前記接着剤層が形成されていない非接着領域と、
前記非接着領域に設けられ、滑り止め加工が施されたカバーテープと、を備え、
前記カバーテープと前記基材との間の摩擦力は、100gf以上である積層テープの回路接続材料の製造のための使用。 - テープ状の基材及びその一方面上に形成された接着剤層を有する回路接続用テープと、前記回路接続用テープが巻かれた巻芯と、を備え、前記接着剤層の表面には、滑り止め加工が施されたエンドマークが設けられており、前記エンドマークと前記基材との間の摩擦力は、100gf以上である接着剤リールから繰り出された前記回路接続用テープを、第1の回路部材の第1の回路電極上に載置し、
前記第1の回路部材と前記回路接続用テープとを加圧し、前記接着剤層を前記第1の回路部材に仮接続し、
前記接着剤層から前記基材を剥がし、
第2の回路部材の第2の回路電極が前記接着剤層と接するように、前記第2の回路部材を前記接着剤層上に載置し、
前記接着剤層を加熱しながら、前記第1の回路部材と前記第2の回路部材とを加圧し、前記接着剤層の硬化により接続部を形成して回路接続体を得る、
回路接続体の製造方法。 - テープ状の基材及びその一方面上に形成された接着剤層を有する回路接続用テープと、前記回路接続用テープが巻かれた巻芯と、を備え、前記回路接続用テープは、前記巻芯と前記基材の終端部とに接続されたエンドテープを有し、前記基材の終端部には、少なくとも前記巻芯の一巻き分の長さにわたって、前記接着剤層が形成されていない非接着領域が設けられ、前記非接着領域には、滑り止め加工が施されたカバーテープが設けられており、前記カバーテープと前記基材との間の摩擦力は、100gf以上である接着剤リールから繰り出された前記回路接続用テープを、第1の回路部材の第1の回路電極上に載置し、
前記第1の回路部材と前記回路接続用テープとを加圧し、前記接着剤層を前記第1の回路部材に仮接続し、
前記接着剤層から前記基材を剥がし、
第2の回路部材の第2の回路電極が前記接着剤層と接するように、前記第2の回路部材を前記接着剤層上に載置し、
前記接着剤層を加熱しながら、前記第1の回路部材と前記第2の回路部材とを加圧し、前記接着剤層の硬化により接続部を形成して回路接続体を得る、
回路接続体の製造方法。
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