CN106304631A - 电路板压接结构及电路板压接结构制作方法 - Google Patents
电路板压接结构及电路板压接结构制作方法 Download PDFInfo
- Publication number
- CN106304631A CN106304631A CN201510366516.2A CN201510366516A CN106304631A CN 106304631 A CN106304631 A CN 106304631A CN 201510366516 A CN201510366516 A CN 201510366516A CN 106304631 A CN106304631 A CN 106304631A
- Authority
- CN
- China
- Prior art keywords
- wire
- circuit board
- joint portion
- connecting portion
- crimping structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
电路板压接结构 | 100 |
第一软性电路板 | 10 |
第二软性电路板 | 20 |
导电胶体 | 30 |
第一连接部 | 11 |
第一基材层 | 12 |
第一导线层 | 13 |
第一导线 | 131 |
第一结合部 | 132 |
第二连接部 | 21 |
第二基材层 | 22 |
第二导线层 | 23 |
第二导线 | 231 |
第二结合部 | 232 |
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510366516.2A CN106304631A (zh) | 2015-06-29 | 2015-06-29 | 电路板压接结构及电路板压接结构制作方法 |
TW104125031A TWI608772B (zh) | 2015-06-29 | 2015-07-31 | 電路板壓接結構及電路板壓接結構製作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510366516.2A CN106304631A (zh) | 2015-06-29 | 2015-06-29 | 电路板压接结构及电路板压接结构制作方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106304631A true CN106304631A (zh) | 2017-01-04 |
Family
ID=57651040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510366516.2A Pending CN106304631A (zh) | 2015-06-29 | 2015-06-29 | 电路板压接结构及电路板压接结构制作方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN106304631A (zh) |
TW (1) | TWI608772B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107741676A (zh) * | 2017-10-19 | 2018-02-27 | 武汉华星光电半导体显示技术有限公司 | 一种耦合压接端子结构及显示装置 |
CN111867273A (zh) * | 2019-04-24 | 2020-10-30 | 鹏鼎控股(深圳)股份有限公司 | 电路板连接构造及其制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6355504B1 (en) * | 1998-02-27 | 2002-03-12 | Micron Technology, Inc. | Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive |
CN101310573A (zh) * | 2005-11-15 | 2008-11-19 | 3M创新有限公司 | 用于连接印刷电路板的方法 |
KR100907576B1 (ko) * | 2008-02-13 | 2009-07-14 | 엘에스엠트론 주식회사 | 전극 간 단락 방지용 반도체 디바이스 및 이를 이용한반도체 패키지 |
JP2011151103A (ja) * | 2010-01-20 | 2011-08-04 | Fujikura Ltd | 電子部品相互の接続構造及び接続方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200919662A (en) * | 2007-10-16 | 2009-05-01 | Advanced Semiconductor Eng | Tenon-type package structure and method thereof |
TWI400021B (zh) * | 2010-08-30 | 2013-06-21 | Zhen Ding Technology Co Ltd | 電路板模組之製作方法 |
WO2012121292A1 (ja) * | 2011-03-09 | 2012-09-13 | 日立化成工業株式会社 | 回路接続用テープ、接着剤リール、積層テープの回路接続材料としての使用、積層テープの回路接続材料の製造のための使用及び回路接続体の製造方法 |
-
2015
- 2015-06-29 CN CN201510366516.2A patent/CN106304631A/zh active Pending
- 2015-07-31 TW TW104125031A patent/TWI608772B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6355504B1 (en) * | 1998-02-27 | 2002-03-12 | Micron Technology, Inc. | Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive |
CN101310573A (zh) * | 2005-11-15 | 2008-11-19 | 3M创新有限公司 | 用于连接印刷电路板的方法 |
KR100907576B1 (ko) * | 2008-02-13 | 2009-07-14 | 엘에스엠트론 주식회사 | 전극 간 단락 방지용 반도체 디바이스 및 이를 이용한반도체 패키지 |
JP2011151103A (ja) * | 2010-01-20 | 2011-08-04 | Fujikura Ltd | 電子部品相互の接続構造及び接続方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107741676A (zh) * | 2017-10-19 | 2018-02-27 | 武汉华星光电半导体显示技术有限公司 | 一种耦合压接端子结构及显示装置 |
WO2019075791A1 (zh) * | 2017-10-19 | 2019-04-25 | 武汉华星光电半导体显示技术有限公司 | 一种耦合压接端子结构及显示装置 |
CN111867273A (zh) * | 2019-04-24 | 2020-10-30 | 鹏鼎控股(深圳)股份有限公司 | 电路板连接构造及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI608772B (zh) | 2017-12-11 |
TW201711542A (zh) | 2017-03-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170301 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518105 Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Shenzhen Baoan District city Songgang street Chuanyan Luzhen Yan Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
|
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170104 |