CN203582187U - 粘接剂卷轴以及电路连接用带 - Google Patents

粘接剂卷轴以及电路连接用带 Download PDF

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Publication number
CN203582187U
CN203582187U CN201290000345.1U CN201290000345U CN203582187U CN 203582187 U CN203582187 U CN 203582187U CN 201290000345 U CN201290000345 U CN 201290000345U CN 203582187 U CN203582187 U CN 203582187U
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band
circuit
lining cement
base material
bond layer
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CN201290000345.1U
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English (en)
Inventor
立泽贵
藤绳贡
石川天明
关贵志
小林宏治
关耕太郎
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Resonac Corp
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Hitachi Chemical Co Ltd
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    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/18—Constructional details
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    • B65H26/00—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms
    • B65H26/06—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms responsive to predetermined lengths of webs
    • B65H26/066—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms responsive to predetermined lengths of webs responsive to information, e.g. printed mark, on the web or web roll
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Abstract

本实用新型提供的粘接剂卷轴（10）具有卷芯（1）和卷绕在卷芯（1）上的各向异性导电带（5A）。各向异性导电带（5A）具有带状的基材（6）和在其一个面上形成的粘接剂层（8）。在粘接剂层（8）的表面，设有与粘接剂层（8）不同颜色的终端标志（18）。卷芯（1）与基材（6）利用终端带（12）连接。覆盖带（14）覆盖基材（6）中未形成有粘接剂层（8）的区域（5b）。在覆盖带（14）以及终端标志（18）处，为了使与基材（6）的背面（6c）的摩擦大而实施防滑加工。该摩擦抑制卷绕于卷芯（1）上的各向异性导电带（5A）相互之间的滑动。

Description

粘接剂卷轴以及电路连接用带
技术领域
本实用新型涉及一种电路连接用带以及粘接剂卷轴。 
背景技术
以往，作为用于将具有多个电极的被连接部件彼此电连接来制造电路连接体的连接材料，使用各向异性导电膜（ACF：Anisotropic Conductive Film）。该各向异性导电膜是在印刷电路布线基板、LCD用玻璃基板、挠性印刷电路基板等基板上连接IC、LSI等半导体元件、封装等被连接部件时，以保持相对电极彼此的导通状态且保持邻接电极彼此绝缘的方式进行电连接和机械固定的连接材料。另外，作为连接材料，除了各向异性导电膜，还已知非导电膜（NCF：Non-Conductive film）等。 
上述连接材料含有含热固性树脂的粘接剂成分、以及在各向异性导电膜的情况下根据需要配合的导电粒子，在聚对苯二甲酸乙二醇酯（PET）等基材上形成薄膜状来作为粘接剂层。并且，将该薄膜状的原版以成为适用于用途的宽度的方式切断为带状形成电路连接用带，来制造将该电路连接用带卷绕于卷芯而形成为卷绕体的粘接剂卷轴（参照专利文献1）。 
对于电路连接用带，存在设有终端带的情况。终端带具有减少未被使用就被毁弃的粘接剂层的作用。也就是说，对于在电路连接体的制造中使用的压合装置而言，在粘接剂卷轴的安装位置与进行压合作业的位置之间存在规定的间隔，在使用在卷芯上直接卷绕电路连接用带的粘接剂卷轴的情况下，在放卷结束而更换成新的粘接剂卷轴时，在上述规定的间隔中残留的粘接剂层未被使用就被毁弃。于是，通过在电路连接用带的终端部附近设置终端带，能够防止在上述规定的间隔中残留粘接剂层，减少未被使用就被毁弃的粘接剂层。 
另外，对于电路连接用带，存在设有终端标志的情况。终端标志具有如下作用：通过视觉辨认电路连接用带的终端部，从而防止由过度的电路连接用带的拉出造成的压合装置的破损。 
现有技术文献 
专利文献 
专利文献1：日本特开2003-34468号公报 
实用新型内容
实用新型要解决的问题 
然而，作为使电路连接体的连接可靠性降低的原因之一，存在被称为粘连的现象。该粘连是在从粘接剂卷轴拉出电路连接用带使用时粘接剂层转印到基材背面的现象。若发生粘连，则无法在被连接部件上的规定位置配置必要量的粘接剂层，连接部的电连接或机械固定有可能变得不充分。 
另外，除了粘连以外，还存在如下空转的现象：在拉出电路连接用带时，在电路连接用带的基材背面和在其上层叠的粘接剂层之间发生滑动，从而卷轴空转。在发生空转的情况下，做成卷绕体的电路连接用带逐渐卷紧从而有可能产生粘连。进一步，还有可能产生如下现象：卷绕于卷芯而做成卷绕体的电路连接用带的一部分由于空转而向卷轴的轴方向突出，该突出的电路连接用带被卷入做成卷绕体的电路连接用带的侧面与设于卷芯两端的侧板卷轴的间隙，最终导致卷轴破坏而不再能够放卷。 
进一步，近年来，对于使用电路连接用带的电路连接体的制造，由于要求低温短时间的连接，因此多使用丙烯酸系粘接剂。然而，对于丙烯酸系粘接剂而言，在制作卷轴制品时，由于卷取时的张力，粘接剂成分容易从卷轴端面挤出，无法以高张力卷取，因此尤其是空转容易多次发生。另外，即使在环氧系粘接剂的情况中，根据单体成分的量不同，存在粘接剂容易从卷轴端面挤出而不得不以低张力卷取的情况，如果是这样的电路连接用带则容易发生空转。另外，为了做到高精细对应而提高了导电粒子密度的各向异性导电层以及非导电层这2层构成的电路连接用带的情况下，由于各向异性导电层的粘性降低，在基材背面和向其层叠的各向异性导电层之间发生滑动，存在发生空转的情况。另外，即使在厚度为10μm左右的薄电路连接用带中，由于粘性降低，在基材背面与粘接剂层之间容易发生滑动，存在发生空转的情况。进一步，最近，长度为200～300m的长尺寸的电路连接用带较多，随之由空转造成的不良状况也变多。 
这里，作为空转产生难易的指标，有空转起始负荷。该空转起始负荷在电路连接用带从粘接剂卷轴拉出时成为负载于电路连接用带的张力的标准，通常有如下倾向：在该值不到200gf的情况下，特别容易发生空转，在200～400gf左右时减少，如果是400gf以上则几乎不发生由空转造成的不良状况。 
本实用新型发明人等着眼于因空转起始负荷的不同导致上述现象容易产生，潜心研究了对其改善的策略。其结果，发现了以基材背面与设于粘接剂层上的终端标志之间的摩擦力为起因而发生空转。 
本实用新型鉴于上述实际情况而做成，目的在于提供一种电路连接用带以及粘接剂卷轴，在电路连接用带从粘接剂卷轴拉出时，能够抑制由于做成卷绕体的电路连接用带之间的滑动造成的空转，在制造电路连接体时能够得到优异的连接可靠性。 
解决问题的手段 
本实用新型的一个方面的粘接剂卷轴的特征在于，具有包括带状的基材以及在其一个面上形成的粘接剂层的电路连接用带、和卷绕有电路连接用带的卷芯，在粘接剂层的表面设有实施了防滑加工的终端标志，终端标志与基材之间的摩擦力为100gf以上。另外，本实用新型的一个方面的粘接剂卷轴的特征在于，具有包括带状的基材以及在其一个面上形成的粘接剂层的电路连接用带、和卷绕有电路连接用带的卷芯，电路连接用带具有连接至卷芯和基材的终端部的终端带，在基材的终端部至少遍及卷芯的一圈长度设有未形成粘接剂层的非粘接区域，在非粘接区域设有实施了防滑加工的覆盖带，覆盖带与基材之间的摩擦力为100gf以上。 
对于本实用新型的一个方面的粘接剂卷轴而言，在电路连接用带的粘接剂层侧的一面，设有实施了防滑加工的终端标志或实施了防滑加工的覆盖带，终端标志与基材之间的摩擦力或者覆盖带与基材之间的摩擦力为100gf以上。由此，能够防止终端标志与基材背面之间的滑动或者覆盖带与基材背面之间的滑动，抑制空转的发生。因此，在制造电路连接体时能够得到优异的连接可靠性。 
另外，覆盖带可设置为覆盖基材与终端带的边界部分。这样一来，能够提高基材与终端带之间的连接强度。 
另外，也可以覆盖基材与终端带的边界部分的方式设置粘着带。这样一来， 能够进一步提高基材与终端带的连接强度。 
另外，可在终端带的至少一个面实施防滑加工。这样一来，能够防止终端带与基材之间的滑动，进一步确实地抑制空转的发生。 
另外，覆盖带的色调可与粘接剂层的色调不同。这样一来，能够自动检测电路连接用带的终端部。 
本实用新型的一个方面的电路连接用带的特征在于，其为包括带状的基材以及在其一个面上形成的粘接剂层的长尺寸电路连接用带，在粘接剂层的表面具有实施了防滑加工的终端标志，终端标志与基材之间的摩擦力为100gf以上。另外，本实用新型的一个方面的电路连接用带的特征在于，其为包括带状的基材以及在其一个面上形成的粘接剂层的长尺寸电路连接用带，在基材的终端部连接有终端带并且在比终端带更靠前的一侧设有未形成粘接剂层的非粘接区域，在非粘接区域设有实施了防滑加工的覆盖带，覆盖带与基材之间的摩擦力为100gf以上。 
对于本实用新型的一个方面的电路连接用带而言，在粘接剂层侧的一面设有实施了防滑加工的终端标志或者实施了防滑加工的覆盖带，使终端标志与基材之间的摩擦力或者覆盖带与基材之间的摩擦力为100gf以上。由此，在将该电路连接用带做成卷绕体时，能够防止在终端标志与基材背面之间的滑动、或者覆盖带与基材背面之间的滑动，抑制空转的发生。因此，在制造电路连接体时能够得到优异的连接可靠性。 
另外，本实用新型的一个方面的层叠带作为电路连接材料的应用，是具有带状的基材和在基材的一个面上形成的粘接剂层以及设于粘接剂层的表面且实施了防滑加工的终端标志、并且终端标志与基材之间的摩擦力为100gf以上的层叠带作为电路连接材料的应用。 
另外，本实用新型的一个方面的层叠带作为电路连接材料的应用，是具有带状的基材、在基材的一个面上形成的粘接剂层、连接至基材的终端部的终端带、在基材的终端部设于比终端带更靠前的一侧且未形成粘接剂层的非粘接区域、以及设于非粘接区域且实施了防滑加工的覆盖带、并且覆盖带与基材之间的摩擦力为100gf以上的层叠带作为电路连接材料的应用。 
另外，本实用新型的一个方面的层叠带用于电路连接材料制造的应用，是 具有带状的基材、在基材的一个面上形成的粘接剂层、以及设于粘接剂层的表面且实施了防滑加工的终端标志、并且终端标志与基材之间的摩擦力为100gf以上的层叠带用于电路连接材料制造的应用。 
另外，本实用新型的一个方面的层叠带用于电路连接材料制造的应用，是具有带状的基材、在基材的一个面上形成的粘接剂层、连接至基材的终端部的终端带、在基材的终端部设于比终端带更靠前的一侧且未形成粘接剂层的非粘接区域、以及设于非粘接区域且实施了防滑加工的覆盖带、并且覆盖带与基材之间的摩擦力为100gf以上的层叠带用于电路连接材料的制造的应用。 
另外，本实用新型的一个方面的电路连接体的制造方法包括：将从粘接剂卷轴抽出的电路连接用带载置于第1电路部件的第1电路电极上，其中所述粘接剂卷轴具有包括带状的基材以及在其一个面上形成的粘接剂层的电路连接用带、和卷绕有电路连接用带的卷芯，在粘接剂层的表面设有实施了防滑加工的终端标志，并且终端标志与基材之间的摩擦力为100gf以上；对第1电路部件和电路连接用带加压，将粘接剂层临时连接至第1电路部件；从粘接剂层将基材剥离；将第2电路部件载置于粘接剂层上使得第2电路部件的第2电路电极与粘接剂层相接；一边加热粘接剂层，一边对第1电路部件和第2电路部件加压，通过粘接剂层的固化形成连接部从而得到电路连接体。 
另外，本实用新型的一个方面的电路连接体的制造方法包括：将从粘接剂卷轴抽出的电路连接用带载置于第1电路部件的第1电路电极上，其中所述粘接剂卷轴具有包括带状的基材以及在其一个面上形成的粘接剂层的电路连接用带、和卷绕有电路连接用带的卷芯，电路连接用带具有连接至卷芯与基材的终端部的终端带，在基材的终端部至少遍及卷芯的一圈长度设有未形成粘接剂层的非粘接区域，在非粘接区域设有实施了防滑加工的覆盖带，并且覆盖带与基材之间的摩擦力为100gf以上；对第1电路部件和电路连接用带加压，将粘接剂层临时连接至第1电路部件；从粘接剂层将基材剥离；将第2电路部件载置于粘接剂层上使得第2电路部件的第2电路电极与粘接剂层相接；一边加热粘接剂层，一边对第1电路部件和第2电路部件加压，通过粘接剂层的固化形成连接部从而得到电路连接体。 
实用新型效果 
利用本实用新型，在从粘接剂卷轴拉出电路连接用带时，能够抑制做成卷绕体的电路连接用带之间的滑动所造成的空转，在制造电路连接体时能够得到优异的连接可靠性。 
附图说明
图1为表示粘接剂卷轴的一个例子的立体图。 
图2为表示图1所示的粘接剂卷轴安装于压合装置的旋转轴的状态的剖面图。 
图3为表示各向异性导电带的一个例子的模式剖面图。 
图4为表示本实用新型的第1实施方式涉及的各向异性导电带的终端部的模式剖面图。 
图5为表示图4所示的终端部的第1变形例的模式剖面图。 
图6为表示图4所示的终端部的第2变形例的模式剖面图。 
图7为表示电路电极相互连接的电路连接体的一个例子的概略剖面图。 
图8为表示电路连接体的制造方法的一个例子的概略剖面图。 
图9为表示将比较例1涉及的各向异性导电带从卷轴拉出的过程的模式剖面图。 
图10为表示将比较例2涉及的各向异性导电带从卷轴拉出的过程的模式剖面图。 
图11为表示本实用新型的第2实施方式涉及的各向异性导电带的终端部的模式剖面图。 
图12为表示具有图11所示的各向异性导电带的粘接剂卷轴安装于压合装置的旋转轴的状态的剖面图。 
图13为表示覆盖带或者终端标志与基材之间的摩擦力的测定装置的概略结构图。 
具体实施方式
以下，参照附图详细说明本实用新型的适宜的实施方式。这里，在对附图的说明中，相同的要素具有相同的附图标记，省略重复的说明。另外，为了附图的方便，附图的尺寸比率未必与说明的对象一致。 
针对本实用新型的第1实施方式涉及的电路连接用带以及粘接剂卷轴进 行说明。 
图1为表示粘接剂卷轴的一个例子的立体图，图2为表示图1的粘接剂卷轴安装于压合装置的旋转轴的状态的剖面图。 
粘接剂卷轴10具有筒状的卷芯1、以及分别设于卷芯1的轴方向的两个端面的圆盘状的侧板2。在卷芯1的外表面1a卷绕有长尺寸的各向异性导电带（电路连接用带）5A，从而各向异性导电带5A做成为卷绕体。卷芯1的内表面成为用于安装至压合装置25的旋转轴25a的轴孔10a（参照图2）。这里，卷芯1的外径没有特别限制，从处理性能的角度考虑，优选为4～15cm。 
图3为表示各向异性导电带的一个例子的模式剖面图。 
各向异性导电带5A具有带状的基材6、以及在基材6的一个面上形成的粘接剂层8。 
基材6的长度例如为1～400m左右，优选为50～300m。基材6的厚度例如为4～200μm左右，优选为20～100μm。基材6的宽度例如为0.5～30mm左右，优选为0.5～3.0mm。这里，基材6的长度、厚度以及宽度不限于上述范围。另外，基材6的宽度优选与在其上形成的粘接剂层8的宽度相同或比粘接剂层8的宽度宽。 
作为基材6，例如可以使用由聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚间苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚烯烃、聚醋酸酯、聚碳酸酯、聚苯硫醚、聚酰胺、乙烯-醋酸乙烯共聚物、聚氯乙烯、聚偏二氯乙烯、合成橡胶系、液晶聚合物等构成的各种带。这里，构成基材6的材质不限定于这些。另外，作为基材6，可使用在与粘接剂层8的对接表面等上实施了脱模处理的基材。 
粘接剂层8由粘接剂组合物构成，该粘接剂组合物含有例如粘接剂成分8a和导电粒子8b。粘接剂层8的厚度配合使用的粘接剂成分以及被粘接物的种类等适当选择即可，例如为5～100μm，优选为10～40μm。另外，粘接剂层8的宽度配合使用用途调整即可，例如为0.5～5mm左右，优选为0.5～3.0mm。 
作为粘接剂层8的粘接剂成分8a，可以广泛适用在热、光作用下表现出固化性的材料，可以使用环氧系粘接剂或者丙烯酸系粘接剂。另外，从连接后的耐热性、耐湿性优异的方面来看，优选使用交联性材料。其中，含有作为热 固性树脂的环氧树脂为主成分的环氧系粘接剂由于能够在短时间内固化、连接作业性好、分子结构上的粘接性优异等特征而优选。另外，根据本发明人等的研究，在使用丙烯酸系粘接剂作为粘接剂成分8a的情况下，与使用环氧系粘接剂的情况相比，由于容易产生粘接剂层8向基材背面6c的转印，因此从这一点考虑，也优选使用环氧系粘接剂。 
作为环氧系粘接剂的具体例子，可以举出高分子量环氧、固形环氧或者液状环氧、或者将它们用氨基甲酸酯、聚酯、丙烯酸橡胶、丁腈橡胶（NBR）、合成线性聚酰胺等改性的环氧为主成分的物质。环氧系粘接剂通常是在成为主成分的上述环氧中添加固化剂、催化剂、偶联剂、填充剂等而成的物质。 
作为丙烯酸系粘接剂的具体例子，可以举出将丙烯酸、丙烯酸酯、甲基丙烯酸酯以及丙烯腈中的至少一个作为单体成分的聚合物或者共聚物。 
这里，在将IC芯片安装在玻璃基板、挠性印刷电路基板（FPC）上的情况下，从抑制IC芯片的线性膨胀系数和基板的线性膨胀系数之间的差造成的基板的翘曲的观点来看，优选在粘接剂成分中配合发挥内部应力的缓和作用的成分。具体地，优选在粘接剂成分中配合丙烯酸橡胶、弹性体成分。另外，也可以使用国际公开第98/44067号记载的那样的自由基固化系粘接剂。 
导电粒子8b分散于粘接剂成分8a中。作为导电粒子8b，例如可以举出Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊锡等金属、碳的粒子。或者，也可以使用以非导电性的玻璃、陶瓷、塑料等作为核、将该核利用上述的金属、碳被覆的被覆粒子。导电粒子8b的平均粒径从分散性、导电性的观点来看优选为1～18μm。这里，可使用将导电粒子用绝缘层被覆而形成的绝缘被覆粒子，从使邻接的电极彼此的绝缘性提高的观点来看，也可并用导电粒子和绝缘性粒子。 
导电粒子8b的配合比例相对于粘接剂层8中含有的粘接剂成分100体积份，例如为0.1～30体积份，优选为0.1～10体积份。若该配合比例不到0.1体积份，则存在相对的电极之间的连接电阻变高的倾向，若超过30体积份，则存在邻接的电极之间容易发生短路的倾向。这里，根据各向异性导电带5A的用途，也可不配合导电粒子8b、仅以粘接剂成分8a构成粘接剂层8。 
接下来，针对各向异性导电带5A的终端部的结构进行说明。 
图4为表示本实用新型的第1实施方式涉及的各向异性导电带的终端部的模式剖面图。 
基材6的终端部6a连接至终端带12的始端部12b。终端带12的终端部12a连接至卷芯1的外表面1a。终端带12的始端部12b与基材6的终端部6a的连接是通过后述的覆盖带14以及粘着带16进行。另外，终端带12的终端部12a与外表面1a的连接在这里是通过双面胶带进行。 
作为构成终端带12的材质，可以举出与构成上述的基材6的材质同样的材质（例如聚对苯二甲酸乙二醇酯）。 
就终端带12的长度而言，使其适应于从安装粘接剂卷轴10的旋转轴25a到进行压合作业的位置的距离等，根据压合装置25的结构等来适当设定即可，例如为0.5～5m左右，优选为1～3m。终端带12的厚度对应于要求的强度等适当设定即可，例如为10～100μm，优选为30～70μm。另外，终端带12的宽度对应于基材6或者粘接剂层8的宽度适当设定即可，例如为0.5～5mm左右，优选为0.5～3.0mm。 
在终端带12的至少一个面实施防滑加工。由此，能够在各向异性导电带5A卷绕于卷芯1做成卷绕体的状态下，使在相互对接的终端带12的外表面和内表面之间不易发生滑动。其结果，能够以足够高的精度将期望长度的各向异性导电带5A拉出。防滑加工在终端带12的长度为1m以上的情况下特别有用。作为防滑加工的具体例子，可以举出针对终端带12的表面的压花加工、向该表面的橡胶等的涂布。 
在基材6的终端部6a，在比终端带12更靠前的一侧设有未形成粘接剂层8的非粘接区域5b。该非粘接区域5b是在各向异性导电带5A卷绕于卷芯1做成卷绕体的状态下以至少遍及一圈长度而设置。非粘接区域5b例如能够在将各向异性导电膜切断为规定的宽度来制造各向异性导电带5A的过程中通过对各向异性导电膜的规定区域除去粘接剂层而形成。这里，设置非粘接区域5b的长度只要是在做成卷绕体的状态下为一圈长度以上则没有特别限制，可以是两圈，也可以是三圈。其中，虽然也与卷芯1的直径有关，但若非粘接区域5b的长度超过0.5m，则在非粘接区域5b上贴合覆盖带14时容易发生偏移，因此非粘接区域5b的长度优选为0.5m以下。 
在非粘接区域5b中，以覆盖该非粘接区域5b的方式设置覆盖带14。覆盖带14的终端部14a延伸到终端带12的始端部12b侧，覆盖基材6与终端带12的边界部分。 
这里，图5为表示图4所示的终端部的第1变形例的模式剖面图。如图5所示，从防止粘接剂层8剥离的观点来看，覆盖带14的始端部14b优选以覆盖粘接剂层8的终端部8c的方式延伸。这里，也可以做成粘接剂层8的终端部8c与覆盖带14的始端部14b之间设有空间的结构。 
在覆盖带14的表面实施了防滑加工。作为该防滑加工，例如可以举出针对覆盖带14表面的压花加工、向该表面的橡胶等的涂布。但是，在覆盖带14的表面涂布橡胶等的情况下，在各向异性导电带5A卷绕至卷芯1而成为卷绕体的状态下，后述的粘着带16位于覆盖带14的下层，因此，在从粘接剂卷轴10拉出各向异性导电带5A时，有可能覆盖带14同时将粘着带16剥离。因此，优选（粘着带16对基材背面6c的粘接力）>（覆盖带14对粘着带16背面的粘接力）。 
在各向异性导电带5A卷绕于卷芯1成为卷绕体的状态下，覆盖带14与位于该覆盖带14下层的基材背面6c相接，而就各向异性导电带5A而言，实施了上述防滑加工，使得基材背面6c与覆盖带14之间的摩擦力为100gf以上。 
覆盖带14的色调与粘接剂层8的色调不同。因此，利用设于压合装置25的检测装置（图中未示出），能够自动检测各向异性导电带5A的终端部。如此，覆盖带14也起到终端标志的功能。 
作为构成覆盖带14的材质，可以举出与构成上述基材6的材质同样的材质（例如聚对苯二甲酸乙二醇酯）。另外，若覆盖带14含有基材，则有时因为该基材的厚度带来的高低差而导致发生粘连等不良状况，因此从抑制这样的不良状况的观点来看，覆盖带14优选为无基材的双面带状的物质。 
覆盖带14的厚度例如为10～100μm，优选为30～70μm。另外，覆盖带14的宽度对应于基材6或者粘接剂层8的宽度适当设定即可，例如为0.5～5mm左右，优选为0.5～3.0mm。覆盖带14的长度优选在各向异性导电带5A卷绕于卷芯1而成为卷绕体的状态下为粘着带16整个长度被覆盖带14覆盖程度的长度。 
在基材背面6c侧的基材6的终端部6a与终端带12的始端部12b的边界部分，以覆盖该边界部分的方式贴附有粘着带16。粘着带16为用于提高基材6与终端带12的连接强度的带。这里，在仅利用覆盖带14就能够充分确保基材6与终端带12的连接强度的情况下，也可不贴附粘着带16。另外，在仅利用粘着带16就能够充分确保基材6与终端带12的连接强度的情况下，也可不使覆盖带14延伸至终端带12的始端部12b侧。 
这里，图6为表示图4所示的终端部的第2变形例的模式剖面图。如图6所示，以覆盖粘接剂层8侧表面的基材6的终端部6a和终端带12的始端部12b的边界部分的方式设置粘着带16，也可以进一步覆盖粘着带16的方式设置覆盖带14。 
粘着带16的长度例如为5～30mm左右，优选为10～20mm。粘着带16的厚度对应于要求的强度等适当设定即可，例如为10～100μm，优选为30～70μm。另外，粘着带16的宽度对应于基材6或者粘接剂层8的宽度适当设定即可，例如为0.5～5mm左右，优选为0.5～3.0mm。 
（电路连接体） 
接下来，针对本实施方式涉及的粘接剂卷轴10的粘接剂层8作为电路连接材料使用而制造的电路连接体进行说明。 
图7为表示电路电极彼此连接的电路连接体的概略剖面图。如图7所示，电路连接体100具有互相相对的第1电路部件30以及第2电路部件40，第1电路部件30和第2电路部件40之间设有将它们连接的连接部50a。 
第1电路部件30具有电路基板31、以及在电路基板31的主面31a上形成的电路电极32。第2电路部件40具有电路基板41、以及在电路基板41的主面41a上形成的电路电极42。 
作为一方的电路部件的具体例子，可以举出半导体芯片（IC芯片）、电阻芯片、电容器芯片等芯片部件等。这些电路部件一般具有多个电路电极。作为另一方的电路部件的具体例子，可以举出具有金属布线的挠性带、挠性印刷电路布线板、蒸镀有铟锡氧化物（ITO）的玻璃基板等布线基板。由于各向异性导电带5A能向外部释放静电，因此在连接这些电路部件时，通过使用从粘接剂卷轴10拉出的各向异性导电带5A，能够将电路部件彼此有效且高连接可靠 性地连接。因此，本实施方式涉及的各向异性导电带5A适于具有多个微细的连接端子（电路电极）的芯片部件向布线基板上进行COG安装（Chip On Glass：芯片做在玻璃基板上）或COF安装（Chip On Flex：芯片做在柔性基板上）。 
各电路电极32、42的表面可由选自金、银、锡、钌、铑、钯、锇、铱、铂以及铟锡氧化物（ITO）的1种构成，也可由2种以上构成。另外，电路电极32、42表面的材质在所有电路电极中可以相同，也可不同。 
连接部50a具有粘接剂层8中含有的粘接剂成分8a的固化物8A以及分散于其中的导电粒子8b。并且，对于电路连接体100而言，相对的电路电极32和电路电极42介由导电粒子8b电连接。也就是说，导电粒子8b与电路电极32、42双方直接接触。因此，能够充分降低电路电极32、42之间的连接电阻，实现电路电极32，42之间良好的电连接。另一方面，固化物8A具有电绝缘性，能够确保邻接的电路电极彼此的绝缘性。因此，能够使电路电极32，42之间的电流流动流畅，充分发挥电路所具有的功能。 
（电路连接体的制造方法） 
接下来，对于电路连接体100的制造方法进行说明。 
图8为将电路连接体的制造方法的一个实施方式通过概略剖面图示出的工序图。对于本制造方法而言，使各向异性导电带5A的粘接剂层8热固化，最终制造电路连接体100。 
首先，在连接装置（图中未示出）的旋转轴装上粘接剂卷轴10。从该粘接剂卷轴10将各向异性导电带5A以粘接剂层8朝向下方的方式拉出。然后，将各向异性导电带5A切断为规定的长度，载置于第1电路部件30的第1电路电极32上（参照图8（a））。 
接下来，对第1电路部件30以及各向异性导电带5A在箭头A以及B方向上加压，将粘接剂层8临时连接至第1电路部件30（参照图8（b））。此时的压力只要在不对电路部件造成损伤的范围则没有特别限制，一般地优选设为0.1～30.0MPa。另外，可一边加热一边加压，加热温度设为粘接剂层8不实质上固化的温度。加热温度一般地优选设为50～100℃。这些加热以及加压优选在0.1～2秒的范围内进行。 
接下来，从粘接剂层8将基材6剥离，以第2电路电极42与粘接剂层8 相接的方式将第2电路部件40载置于粘接剂层8上（参照图8（c））。并且，一边加热粘接剂层8，一边在箭头A以及B方向上对整体加压。此时的加热温度设为粘接剂层8的粘接剂成分8a能固化的温度。加热温度优选为60～180℃，更优选为70～170℃，进一步优选为80～160℃。若加热温度不到60℃则存在固化速度变慢的倾向，若超过180℃则存在不期望的副反应容易进行的倾向。加热时间优选为0.1～180秒，更优选为0.5～180秒，进一步优选为1～180秒。 
通过粘接剂成分8a的固化而形成连接部50a，得到如图7所示的电路连接体100。这里，连接的条件根据使用的用途、粘接剂组合物、电路部件适当选择。另外，作为粘接剂层8的粘接剂成分，在使用利用光固化的粘接剂成分的情况下，对粘接剂层8适当照射活性光线、能量线即可。作为活性光线，可以举出紫外线、可视光、红外线等。作为能量线，可以举出电子射线、X射线、γ射线、微波等。 
对于这样的用于电路连接体100制造的各向异性导电带5A而言，在粘接剂层8一侧的表面设有实施了防滑加工的覆盖带14，覆盖带14与基材背面6c之间的摩擦力设为100gf以上。由此，在将卷绕于卷芯1做成卷绕体的状态下的各向异性导电带5A从粘接剂卷轴10拉出时，能够防止覆盖带14与基材6背面之间的滑动，抑制空转的发生。因此，在制造电路连接体时能够得到优异的连接可靠性。 
另外，对于各向异性导电带5A而言，由于覆盖带14延伸至终端带12的始端部12b，覆盖基材6与终端带12的边界部分，因此能够提高基材6和终端带12的连接强度。 
另外，对于各向异性导电带5A而言，由于以覆盖基材6的终端部6a和终端带12的始端部12b的边界部分的方式设置粘着带，因此能够进一步提高基材6和终端带12的连接强度。 
另外，对于各向异性导电带5A而言，由于在终端带12的至少一个面实施了防滑加工，从而能够防止终端带12与基材背面6c之间的滑动，进一步确实地抑制空转的发生。 
另外，对于各向异性导电带5A而言，由于覆盖带14的色调与粘接剂层8 的色调不同，因此能够自动检测各向异性导电带5A的终端部。 
这里，图9为表示将比较例1涉及的各向异性导电带从卷轴拉出的过程的模式剖面图。 
比较例1涉及的各向异性导电带55与第1实施方式涉及的各向异性导电带5A的不同点是，粘接剂层8形成至基材6和终端带12的连接部这一点，以及与之伴随的未设有非粘接区域5b以及覆盖其的覆盖带14这一点。这里，在图9中，为了方便，卷芯1的外表面1a用直线绘制，但实际上为圆弧。 
如图9（a）所示，在各向异性导电带55卷绕于卷芯1的状态下，在各向异性导电带55与终端带12的连接部的上层、即在粘着带16的上层也存在粘接剂层8。由该状态拉出各向异性导电带55时，因粘着带16的厚度、粘着剂的影响，粘接剂层8从基材6剥离并转印于上层的基材6的背面，存在发生粘连的可能性（参照图9（b））。若如此将粘接剂层8转印于基材6的背面，则不能够向压合装置25适当地供给粘接剂层8（参照图9（c））。其结果，有可能无法确保电路连接体的连接可靠性。 
另外，图10为示出将比较例2涉及的各向异性导电带从卷轴拉出的过程的模式剖面图。 
比较例2涉及的各向异性导电带56与比较例1涉及的各向异性导电带55的不同点在于，设有粘着带16的位置在各向异性导电带的粘接剂层8侧这一点，以及基材6与终端带12之间贯通有粘接剂16a这一点。 
如图10（a）所示，在各向异性导电带56卷绕于卷芯1的状态下，在各向异性导电带56和终端带12的连接部的上层也存在粘接剂层8。从该状态拉出各向异性导电带56时，因粘着带16的厚度、粘着剂16a的影响，粘接剂层8从基材6剥离并转印至上层的基材6的背面，存在发生粘连的可能性（参照图10（b））。若粘接剂层8转印至基材6的背面，则无法向压合装置25适当供给粘接剂层8（参照图10c））。其结果，有可能无法确保电路连接体的连接可靠性。 
对此，就本实用新型涉及的各向异性导电带5A而言，由于在基材6的终端部6a形成不存在粘接剂层8的非粘接区域5b，因此在各向异性导电带5A卷绕于卷芯1成为卷绕体的状态下，非粘接区域5b位于基材6与终端带12 的连接部的上层。若该连接部由非粘接区域5b覆盖，则即使连接部存在些许凹凸等，也能够充分抑制由此引起的粘连的发生。 
接下来，针对本实用新型的第2实施方式涉及的粘接剂卷轴以及各向异性导电带进行说明。 
图11为表示本实用新型的第2实施方式涉及的各向异性导电带的终端部的模式剖面图，图12为表示具有图11的各向异性导电带的粘接剂卷轴安装于压合装置的旋转轴的状态的剖面图。 
各向异性导电带5B与图4所示的第1实施方式涉及的各向异性导电带5A的不同点在于，未设有终端带12这一点，与之伴随的未设有非粘接区域5b、覆盖其的覆盖带14以及粘着带16这一点，以及在粘接剂层8的表面设有终端标志18这一点。 
终端标志18的长度对应于压合装置25的结构等适当设定即可，例如为3cm～50cm左右，优选为5cm～0.4m左右。终端标志的18的厚度例如为10～100μm左右，优选为30～70μm左右。另外，终端标志18的宽度只要符合基材6或者粘接剂层8的宽度即可，例如为0.5～5mm左右，优选为0.5～3.0mm左右。 
作为构成终端标志18的材质，可以举出与构成上述基材6的材质相同的材质（例如、聚对苯二甲酸乙二醇酯）。另外，若终端标志18含有基材，则有时因为该基材的厚度带来的高低差而导致发生粘连等不良状况，因此从抑制这样的不良状况的观点来看，终端标志18优选为无基材的双面带状的物质。 
对终端标志18实施了防滑加工。作为防滑加工的具体例子，可以举出针对终端标志表面的压花加工、向该表面的橡胶等的涂布。 
在各向异性导电带5B卷绕于卷芯1成为卷绕体的状态下，终端标志18与位于该终端标志18下层的基材背面6c相接，而就各向异性导电带5B而言，实施了防滑加工，使得基材背面6c与终端标志18之间的摩擦力为100gf以上。 
对于这样的各向异性导电带5B，在粘接剂层8的表面设有实施了防滑加工的终端标志18，终端标志18与基材背面6c之间的摩擦力设为100gf以上。由此，在将卷绕于卷芯1成为卷绕体状态的各向异性导电带5B从粘接剂卷轴10拉出时，能够防止终端标志18与基材6背面之间的滑动、抑制空转的发生。 因此，制造电路连接体时能够获得优异的连接可靠性。 
这里，本实用新型不限定于上述实施方式。 
例如，在第1实施方式中例示了由于检测到各向异性导电带5A的量残留很少因此在覆盖带14与粘接剂层8之间设置色调差的情况，但也可在终端带12与基材6或者粘接剂层8之间设置色调差。例如，作为终端带12可使用黑色的终端带。或者，也可以在终端带12的表面和背面之间设置色调差等。 
另外，在上述实施方式中，例示了具有单层结构的粘接剂层8的各向异性导电带5A、5B，但粘接剂层8也可为多层结构。具有多层结构的粘接剂层的各向异性导电带能够通过将粘接剂成分以及导电粒子的种类或者它们的含量不同的层在基材6上层叠多层从而制造。例如，可通过不含有导电粒子的导电粒子非含有层以及含有导电粒子的导电粒子含有层构成二层结构的粘接剂层。这里，作为导电粒子非含有层以及导电粒子含有层的粘接剂成分，可以使用与上述粘接剂层8的粘接剂成分相同的成分。 
另外，在上述实施方式中，作为电路连接用带例示了各向异性导电带5A、5B，但电路连接用带也可以是不含有导电粒子8b的非导电带。 
实施例 
<电路连接用带、终端标志、覆盖带以及终端带的准备> 
作为电路连接用带，准备白色PET薄膜（帝人杜邦薄膜株式会社制造）。作为终端标志，准备聚酯薄膜带No.631U#12（株式会社寺冈制作所制造）。作为覆盖带，准备绝缘用的黑色粘着带（株式会社寺冈制作所制造）。作为终端带，准备Lumirror X30-50（东丽株式会社制造）。 
<试样带的准备> 
（实施例1） 
在宽度1.5mm的电路连接用带的粘接剂层侧的一面贴附实施了压花加工的终端标志，做成试样带。 
（实施例2） 
在宽度1.5mm的电路连接用带的终端部，设置终端带、非粘接区域以及覆盖带，对覆盖带实施压花加工从而做成试样带。 
（实施例3） 
在宽度1.5mm的电路连接用带的粘接剂层侧的一面，贴附实施了压花加工的终端标志，进一步对终端标志涂布苯氧树脂从而做成试样带。 
（实施例4） 
在宽度1.5mm的电路连接用带的粘接剂层侧的一面，贴附实施了压花加工的终端标志，进一步对终端标志涂布丙烯酸橡胶从而做成试样带。 
（比较例1） 
在宽度1.5mm的电路连接用带的粘接剂层侧的一面，贴附未实施防滑加工的终端标志，做成试样带。 
（比较例2） 
在宽度1.5mm的电路连接用带的粘接剂层侧的一面，贴附在双面涂布了丙烯酸系粘着剂的终端标志，做成试样带。 
（比较例3） 
在宽度1.5mm的电路连接用带的终端部，设置终端带、非粘接区域以及覆盖带从而做成试样带。对覆盖带没有实施防滑加工。 
（参考例） 
将没有终端标志以及覆盖带的宽度1.5mm的电路连接用带直接做成试样带。 
<摩擦力的测定> 
图13为表示覆盖带或者终端标志与基材之间的摩擦力的测定装置的概略结构图。如图13所示，在固定的直径30mm的固定辊200的表面贴附与电路连接用带的基材相同的基材带，由此将基材背面设于固定辊200的表面。使试样带S的贴附了终端标志18或者覆盖带14的面与固定辊200的下侧的一部分吻合。吻合的长度在固定辊200上的角度为45度左右。隔着固定辊200，试样带S的一侧沿着可旋转的直径40mm的自由辊300的上侧，在端部悬挂50g的砝码400，另一侧利用株式会社Orientec制造的滕喜龙RTM-50（以下称为“滕喜龙”）将端部以50mm/分钟的速度向上方拉伸。此时，用滕喜龙测定基材背面与终端标志18或者覆盖带14开始滑动时的拉伸负荷，将该拉伸负荷作为摩擦力。评价结果示于表1、2。 
<空转起始负荷的测定> 
将卷轴状态的试样带用滕喜龙以50mm/分钟的速度拉出。此时，用滕喜龙测定开始空转时的拉伸负荷，将该拉伸负荷作为空转起始负荷。评价结果示于表1、2。 
<粘连的测定> 
在固定为30℃（湿度为40～60%RH）的恒温槽中，将卷轴状态的试样带横置，放置1日（24h）。然后，用滕喜龙以1m/分钟的速度将试样带拉出至终端部。评价结果示于表1、2。 
【表1】 
Figure BDA0000379377040000181
【表2】 
如表1所示，在实施例1～4中，覆盖带或者终端标志与基材之间的摩擦力 均为100gf以上。另外，在实施例1～4中，空转起始负荷均为几乎不发生由于空转带来的不良状况的400gf以上，能够得到良好的空转起始负荷。并且，在实施例1～4，均未发生粘连。 
如表2所示，在比较例1、3中，摩擦力均为90gf。另外，在比较例1、3中，空转起始负荷均为容易发生空转的200gf。并且，在比较例1、3中发生粘连。由此，能够确认覆盖带或者终端标志与基材之间的摩擦力为90gf左右的话不能防止空转、粘连，为了防止空转、粘连，需要覆盖带或者终端标志与基材之间的摩擦力为100gf以上。 
在比较例2中，摩擦力为150gf，空转起始负荷为1000gf，均与实施例1～4同等。但是，终端标志剥离，发生粘连。由此可知，即使通过与防滑加工不同的粘着剂提高摩擦力、空转起始负荷，也不能防止粘连。 
在参考例中，粘接剂层与基材之间的摩擦力为600gf，空转起始负荷为700gf，均与实施例1～4同等。另外，在参考例，没有发生粘连。但是，在参考例中，由于没有设置终端标志、终端带，因此，不能减少未被使用就被毁弃的粘接剂层、不能通过视觉辨认电路连接用带的终端部。 
通过以上能够确认，利用本实用新型能够抑制空转的发生，制造电路连接体时得到优异的连接可靠性。 
附图标记说明 
1-卷芯，5-各向异性导电带（电路连接用带），5b-非粘接区域，6-基材，8-粘接剂层，10，20-粘接剂卷轴，12-终端带，12b-终端带的始端部，14-覆盖带，16-粘着带，18-终端标志。 

Claims (72)

1.一种粘接剂卷轴，其特征在于，其为具有包括带状的基材以及在其一个面上形成的粘接剂层的电路连接用带、和卷绕有所述电路连接用带的卷芯的粘接剂卷轴， 
在所述粘接剂层的表面设有实施了防滑加工的终端标志， 
所述终端标志与所述基材之间的摩擦力为100gf以上。 
2.根据权利要求1所述的粘接剂卷轴，其特征在于，所述电路连接用带的长度为200～300m。 
3.根据权利要求1所述的粘接剂卷轴，其特征在于，空转起始载荷为400gf以上。 
4.根据权利要求1所述的粘接剂卷轴，其特征在于，所述卷芯的外径为4～15cm。 
5.根据权利要求1所述的粘接剂卷轴，其特征在于，所述基材的长度为1～400m。 
6.根据权利要求5所述的粘接剂卷轴，其特征在于，所述基材的长度为5～300m。 
7.根据权利要求1所述的粘接剂卷轴，其特征在于，所述基材的宽度为0.5～30mm。 
8.根据权利要求7所述的粘接剂卷轴，其特征在于，所述基材的宽度为0.5～3.0mm。 
9.根据权利要求1所述的粘接剂卷轴，其特征在于，所述粘接剂层的宽度为0.5～5mm。 
10.根据权利要求9所述的粘接剂卷轴，其特征在于，所述粘接剂层的宽度为0.5～3.0mm。 
11.根据权利要求1所述的粘接剂卷轴，其特征在于，所述粘接剂层的粘接剂成分为环氧系粘接剂或丙烯酸系粘接剂。 
12.根据权利要求1所述的粘接剂卷轴，其特征在于，所述电路连接用带 为各向异性导电带， 
所述粘接剂层含有分散于粘接剂成分中的导电粒子。 
13.根据权利要求1所述的粘接剂卷轴，其特征在于，所述终端标志为无基材的双面带状终端标志。 
14.根据权利要求1所述的粘接剂卷轴，其特征在于，对所述终端标志实施的所述防滑加工为针对所述终端标志表面的压花加工或向所述终端标志表面的橡胶涂布。 
15.根据权利要求1所述的粘接剂卷轴，其特征在于，所述终端标志与所述基材之间的摩擦力为900gf以下。 
16.一种粘接剂卷轴，其特征在于，其为具有包括带状的基材以及在其一个面上形成的粘接剂层的电路连接用带、和卷绕有所述电路连接用带的卷芯的粘接剂卷轴， 
所述电路连接用带具有连接至所述卷芯和所述基材的终端部的终端带， 
在所述基材的终端部至少遍及所述卷芯的一圈长度设有未形成所述粘接剂层的非粘接区域， 
在所述非粘接区域设有实施了防滑加工的覆盖带， 
所述覆盖带与所述基材之间的摩擦力为100gf以上。 
17.根据权利要求16所述的粘接剂卷轴，其特征在于，所述覆盖带被设置为覆盖所述基材与所述终端带的边界部分。 
18.根据权利要求16或17所述的粘接剂卷轴，其特征在于，以覆盖所述基材与所述终端带的边界部分的方式设有粘着带。 
19.根据权利要求16所述的粘接剂卷轴，其特征在于，在所述终端带的至少一个面实施了防滑加工。 
20.根据权利要求16所述的粘接剂卷轴，其特征在于，所述覆盖带的色调与所述粘接剂层的色调不同。 
21.根据权利要求16所述的粘接剂卷轴，其特征在于，所述电路连接用带的长度为200～300m。 
22.根据权利要求16所述的粘接剂卷轴，其特征在于，空转起始载荷为 400gf以上。 
23.根据权利要求16所述的粘接剂卷轴，其特征在于，所述卷芯的外径为4～15cm。 
24.根据权利要求16所述的粘接剂卷轴，其特征在于，所述基材的长度为1～400m。 
25.根据权利要求16所述的粘接剂卷轴，其特征在于，所述基材的长度为5～300m。 
26.根据权利要求16所述的粘接剂卷轴，其特征在于，所述基材的宽度为0.5～30mm。 
27.根据权利要求26所述的粘接剂卷轴，其特征在于，所述基材的宽度为0.5～3.0mm。 
28.根据权利要求16所述的粘接剂卷轴，其特征在于，所述粘接剂层的宽度为0.5～5mm。 
29.根据权利要求28所述的粘接剂卷轴，其特征在于，所述粘接剂层的宽度为0.5～3.0mm。 
30.根据权利要求16所述的粘接剂卷轴，其特征在于，所述粘接剂层的粘接剂成分为环氧系粘接剂或丙烯酸系粘接剂。 
31.根据权利要求16所述的粘接剂卷轴，其特征在于，所述电路连接用带为各向异性导电带， 
所述粘接剂层含有分散于粘接剂成分中的导电粒子。 
32.根据权利要求16所述的粘接剂卷轴，其特征在于，所述终端带的长度为0.5～5m。 
33.根据权利要求32所述的粘接剂卷轴，其特征在于，所述终端带的长度为1～3m。 
34.根据权利要求16所述的粘接剂卷轴，其特征在于，所述终端带的长度为1m以上。 
35.根据权利要求19所述的粘接剂卷轴，其特征在于，对所述终端带实施的所述防滑加工为针对所述终端带表面的压花加工或者向所述终端带表面 的橡胶涂布。 
36.根据权利要求16所述的粘接剂卷轴，其特征在于，所述非粘接区域的长度为0.5m以下。 
37.根据权利要求16所述的粘接剂卷轴，其特征在于，对所述覆盖带实施的所述防滑加工为针对所述覆盖带表面的压花加工或向所述覆盖带表面的橡胶涂布。 
38.根据权利要求18所述的粘接剂卷轴，其特征在于，所述粘着带的长度为5～30mm。 
39.一种电路连接用带，其特征在于，其为具有带状的基材以及在其一个面上形成的粘接剂层的长尺寸的电路连接用带， 
在所述粘接剂层的表面具有实施了防滑加工的终端标志， 
所述终端标志与所述基材之间的摩擦力为100gf以上。 
40.根据权利要求39所述的电路连接用带，其特征在于，所述电路连接用带的长度为200～300m。 
41.根据权利要求39所述的电路连接用带，其特征在于，所述基材的长度为1～400m。 
42.根据权利要求41所述的电路连接用带，其特征在于，所述基材的长度为5～300m。 
43.根据权利要求39所述的电路连接用带，其特征在于，所述基材的宽度为0.5～30mm。 
44.根据权利要求43所述的电路连接用带，其特征在于，所述基材的宽度为0.5～3.0mm。 
45.根据权利要求39所述的电路连接用带，其特征在于，所述粘接剂层的宽度为0.5～5mm。 
46.根据权利要求45所述的电路连接用带，其特征在于，所述粘接剂层的宽度为0.5～3.0mm。 
47.根据权利要求39所述的电路连接用带，其特征在于，所述粘接剂层的粘接剂成分为环氧系粘接剂或丙烯酸系粘接剂。 
48.根据权利要求39所述的电路连接用带，其特征在于，所述电路连接用带为各向异性导电带， 
所述粘接剂层含有分散于粘接剂成分中的导电粒子。 
49.根据权利要求39所述的电路连接用带，其特征在于，所述终端标志为无基材的双面带状终端标志。 
50.根据权利要求39所述的电路连接用带，其特征在于，对所述终端标志实施的所述防滑加工为针对所述终端标志表面的压花加工或向所述终端标志表面的橡胶涂布。 
51.根据权利要求39所述的电路连接用带，其特征在于，所述终端标志与所述基材之间的摩擦力为900gf以下。 
52.一种电路连接用带，其特征在于，其为具有带状的基材以及在其一个面上形成的粘接剂层的长尺寸的电路连接用带， 
在所述基材的终端部连接有终端带并且在比所述终端带更靠前的一侧设有未形成所述粘接剂层的非粘接区域， 
在所述非粘接区域设有实施了防滑加工的覆盖带， 
所述覆盖带与所述基材之间的摩擦力为100gf以上。 
53.根据权利要求52所述的电路连接用带，其特征在于，所述覆盖带被设置为覆盖所述基材与所述终端带的边界部分。 
54.根据权利要求52或53所述的电路连接用带，其特征在于，以覆盖所述基材与所述终端带的边界部分的方式设有粘着带。 
55.根据权利要求52所述的电路连接用带，其特征在于，在所述终端带的至少一面实施了防滑加工。 
56.根据权利要求52所述的电路连接用带，其特征在于，所述覆盖带的色调与所述粘接剂层的色调不同。 
57.根据权利要求52所述的电路连接用带，其特征在于，所述电路连接用带的长度为200～300m。 
58.根据权利要求52所述的电路连接用带，其特征在于，所述基材的长度为1～400m。 
59.根据权利要求52所述的电路连接用带，其特征在于，所述基材的长度为5～300m。 
60.根据权利要求52所述的电路连接用带，其特征在于，所述基材的宽度为0.5～30mm。 
61.根据权利要求60所述的电路连接用带，其特征在于，所述基材的宽度为0.5～3.0mm。 
62.根据权利要求52所述的电路连接用带，其特征在于，所述粘接剂层的宽度为0.5～5mm。 
63.根据权利要求62所述的电路连接用带，其特征在于，所述粘接剂层的宽度为0.5～3.0mm。 
64.根据权利要求52所述的电路连接用带，其特征在于，所述粘接剂层的粘接剂成分为环氧系粘接剂或丙烯酸系粘接剂。 
65.根据权利要求52所述的电路连接用带，其特征在于，所述电路连接用带为各向异性导电带， 
所述粘接剂层含有分散于粘接剂成分中的导电粒子。 
66.根据权利要求52所述的电路连接用带，其特征在于，所述终端带的长度为0.5～5m。 
67.根据权利要求66所述的电路连接用带，其特征在于，所述终端带的长度为1～3m。 
68.根据权利要求52所述的电路连接用带，其特征在于，所述终端带的长度为1m以上。 
69.根据权利要求55所述的电路连接用带，其特征在于，对所述终端带实施的所述防滑加工为针对所述终端带表面的压花加工或向所述终端带表面的橡胶涂布。 
70.根据权利要求52所述的电路连接用带，其特征在于，所述非粘接区域的长度为0.5m以下。 
71.根据权利要求52所述的电路连接用带，其特征在于，对所述覆盖带实施的所述防滑加工为针对所述覆盖带表面的压花加工或者向所述覆盖带表 面的橡胶涂布。 
72.根据权利要求54所述的电路连接用带，其特征在于，所述粘着带的长度为5～30mm。 
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