TWI291969B - Curing agent for epoxy resins and epoxy resin composition - Google Patents
Curing agent for epoxy resins and epoxy resin composition Download PDFInfo
- Publication number
- TWI291969B TWI291969B TW094110387A TW94110387A TWI291969B TW I291969 B TWI291969 B TW I291969B TW 094110387 A TW094110387 A TW 094110387A TW 94110387 A TW94110387 A TW 94110387A TW I291969 B TWI291969 B TW I291969B
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- hardener
- compound
- amine
- group
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004102617 | 2004-03-31 | ||
JP2004226431 | 2004-08-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200613358A TW200613358A (en) | 2006-05-01 |
TWI291969B true TWI291969B (en) | 2008-01-01 |
Family
ID=35063735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094110387A TWI291969B (en) | 2004-03-31 | 2005-03-31 | Curing agent for epoxy resins and epoxy resin composition |
Country Status (8)
Country | Link |
---|---|
US (1) | US7820772B2 (fr) |
EP (1) | EP1731545A4 (fr) |
JP (1) | JP4583373B2 (fr) |
KR (1) | KR100804293B1 (fr) |
CN (1) | CN1957012B (fr) |
CA (1) | CA2561414A1 (fr) |
TW (1) | TWI291969B (fr) |
WO (1) | WO2005095486A1 (fr) |
Families Citing this family (53)
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JPWO2007046262A1 (ja) * | 2005-10-18 | 2009-04-23 | 日本化薬株式会社 | エポキシ樹脂、エポキシ樹脂組成物、感光性樹脂組成物およびその硬化物 |
EP1980580A1 (fr) * | 2006-02-03 | 2008-10-15 | Asahi Kasei Chemicals Corporation | Agent de durcissement de type microcapsule pour resine epoxy, composition d'agent de durcissement de type melange maitre pour resine epoxy, composition de resine epoxy de type en une partie et article traite |
JP4911981B2 (ja) * | 2006-02-03 | 2012-04-04 | 旭化成イーマテリアルズ株式会社 | 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007204669A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP4969363B2 (ja) * | 2006-08-07 | 2012-07-04 | 東レ株式会社 | プリプレグおよび炭素繊維強化複合材料 |
KR100798675B1 (ko) | 2006-12-12 | 2008-01-28 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시수지 조성물 및 이를 이용한반도체 소자 |
TWI427092B (zh) * | 2006-12-18 | 2014-02-21 | Shiima Electronics Inc | Wire frame fixing material, lead frame and semiconductor device |
US7875503B2 (en) * | 2006-12-28 | 2011-01-25 | Intel Corporation | Reducing underfill keep out zone on substrate used in electronic device processing |
US7687890B2 (en) * | 2007-03-29 | 2010-03-30 | Intel Corporation | Controlling substrate surface properties via colloidal coatings |
TWI405519B (zh) * | 2007-04-23 | 2013-08-11 | Panasonic Corp | A conductive paste composition for hole filling, a printed circuit board using the same, and a method for manufacturing the same |
JP5228644B2 (ja) * | 2007-10-05 | 2013-07-03 | 日立化成株式会社 | エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、一液性エポキシ樹脂組成物並びにエポキシ樹脂硬化物 |
JP5687187B2 (ja) * | 2008-04-30 | 2015-03-18 | シーカ・テクノロジー・アーゲー | エポキシ樹脂組成物のための活性剤 |
JP5355113B2 (ja) * | 2009-01-29 | 2013-11-27 | 株式会社Adeka | 一液型シアン酸エステル−エポキシ複合樹脂組成物 |
TWI449723B (zh) * | 2009-02-27 | 2014-08-21 | Asahi Kasei E Materials Corp | A hardening agent for a microcapsule type epoxy resin, a hardener composition for a masterbatch type epoxy resin, a single-liquid epoxy resin composition, and a processed product |
US8044154B2 (en) * | 2009-06-12 | 2011-10-25 | Trillion Science, Inc. | Latent hardener for epoxy compositions |
US8067484B2 (en) | 2010-03-12 | 2011-11-29 | Trillion Science, Inc. | Latent hardener with improved barrier properties and compatibility |
EP2295487A1 (fr) | 2009-09-11 | 2011-03-16 | Elantas GMBH | Composition d'Indicateur de durcissement de résine époxide |
US8262895B2 (en) | 2010-03-15 | 2012-09-11 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
US20110220512A1 (en) * | 2010-03-15 | 2011-09-15 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
US8268157B2 (en) * | 2010-03-15 | 2012-09-18 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
KR20130061132A (ko) | 2010-04-16 | 2013-06-10 | 발스파 소싱 인코포레이티드 | 패키징 용품을 위한 코팅 조성물 및 코팅 방법 |
JP2011231143A (ja) * | 2010-04-23 | 2011-11-17 | Asahi Kasei E-Materials Corp | 異方導電性接着フィルム及び接続方法 |
RS53581B1 (en) * | 2010-05-31 | 2015-02-27 | Craig Rookstool | COMPRESSOR HOUSING COAT |
BR112013020026B1 (pt) | 2011-02-07 | 2021-03-02 | Swimc Llc | artigo, composição de revestimento, e, método |
JP2013001875A (ja) * | 2011-06-20 | 2013-01-07 | Asahi Kasei E-Materials Corp | マスターバッチ型硬化剤組成物、それを用いる一液性エポキシ樹脂組成物及び成形品、並びにマスターバッチ型硬化剤組成物の製造方法 |
JP5802081B2 (ja) * | 2011-08-24 | 2015-10-28 | 株式会社タムラ製作所 | 異方性導電性ペースト |
EP3640308B1 (fr) * | 2012-02-07 | 2024-05-01 | Swimc Llc | Compositions pour récipients et autres articles et leurs procédés d'utilisation |
US9051465B1 (en) | 2012-02-21 | 2015-06-09 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
US9243164B1 (en) | 2012-02-21 | 2016-01-26 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
DE102012010271B4 (de) * | 2012-05-25 | 2017-10-12 | Premium Aerotec Gmbh | Verfahren zur Herstellung eines Faserverbundbauteils mittels eines Vakuumaufbaues |
WO2014025411A1 (fr) | 2012-08-09 | 2014-02-13 | Valspar Sourcing, Inc. | Système de revêtement de récipient |
ES2849526T3 (es) | 2012-08-09 | 2021-08-19 | Swimc Llc | Composiciones para contenedores y otros artículos y métodos de utilización de los mismos |
JP6085130B2 (ja) * | 2012-09-07 | 2017-02-22 | 旭化成株式会社 | 液状樹脂組成物、及び加工品 |
JP6106389B2 (ja) * | 2012-09-13 | 2017-03-29 | ナミックス株式会社 | 先設置型半導体封止用フィルム |
JP2014065782A (ja) * | 2012-09-25 | 2014-04-17 | Asahi Kasei E-Materials Corp | エポキシ樹脂用硬化剤、及び該硬化剤を含有する硬化性エポキシ樹脂組成物 |
JP6320403B2 (ja) * | 2012-11-13 | 2018-05-09 | ダウ グローバル テクノロジーズ エルエルシー | 樹脂移送成形プロセスのためのポリエチレンテトラアミンおよびトリエチレンジアミン触媒を含有するエポキシ樹脂系 |
KR101706521B1 (ko) * | 2013-09-12 | 2017-02-13 | 센주긴조쿠고교 가부시키가이샤 | 세정용 플럭스 및 세정용 솔더 페이스트 |
US10611876B2 (en) * | 2014-04-04 | 2020-04-07 | Daicel Corporation | Epoxy-amine adduct, thermoplastic resin composition, sizing agent, sizing agent coated carbon fiber, and fiber-reinforced composite material |
EP3131965B1 (fr) | 2014-04-14 | 2024-06-12 | Swimc Llc | Procédés de préparation de compositions pour contenants et autres articles et procédés d'utilisation desdites compositions |
US9439294B2 (en) * | 2014-04-16 | 2016-09-06 | Rohm And Haas Electronic Materials Llc | Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens |
EP3237163B1 (fr) | 2014-12-23 | 2021-03-10 | Ecosynthetix Inc. | Biopolymère et liant à base d'isocyanate et matériaux composites |
JP6653152B2 (ja) * | 2015-09-30 | 2020-02-26 | ナミックス株式会社 | エポキシ樹脂組成物 |
CN107615151A (zh) * | 2015-10-26 | 2018-01-19 | 积水化学工业株式会社 | 液晶显示元件用密封剂、上下导通材料及液晶显示元件 |
TWI614275B (zh) | 2015-11-03 | 2018-02-11 | Valspar Sourcing Inc | 用於製備聚合物的液體環氧樹脂組合物 |
CN105646843B (zh) * | 2016-04-05 | 2018-08-10 | 广州市固研电子材料有限公司 | 改性脂环胺型环氧树脂潜伏性固化剂和促进剂及其制备方法 |
CN109312057B (zh) * | 2016-06-24 | 2021-09-03 | Sk化学株式会社 | 用于纤维增强复合材料的环氧树脂组合物及利用它的预浸料 |
CN106183641B (zh) * | 2016-08-10 | 2018-01-23 | 青岛永祥专用车辆有限公司 | 一种用于平板车的滚轮、其制备方法及平板车 |
KR102042239B1 (ko) * | 2017-08-08 | 2019-11-08 | 주식회사 케이씨씨 | 양이온성 우레탄 경화제 및 이를 포함하는 전착 도료 조성물 |
EP3792298A4 (fr) | 2018-05-11 | 2022-03-09 | Samyang Corporation | Dispersion solide, procédé pour sa préparation, polyuréthane à chaîne étendue l'utilisant et composition de résine époxy la comprenant |
KR102373002B1 (ko) * | 2018-05-24 | 2022-03-14 | 주식회사 삼양사 | 에폭시 경화용 고체 분산체, 분산체를 포함하는 에폭시 수지 조성물 및 이의 경화물 |
JP6705046B1 (ja) * | 2019-12-12 | 2020-06-03 | 株式会社ノリタケカンパニーリミテド | 低温成形用導電性組成物および導電膜付き基板 |
CN111234749A (zh) * | 2020-01-16 | 2020-06-05 | 交通运输部科学研究院 | 混凝土早期裂缝修复材料、制备方法及使用方法 |
TW202330702A (zh) | 2021-11-19 | 2023-08-01 | 日商納美仕有限公司 | 硬化性樹脂組成物 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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BE793212A (fr) | 1971-12-24 | 1973-06-22 | Ciba Geigy | Matieres durcissables a base de resines epoxydiques |
JPS5938226A (ja) * | 1982-08-26 | 1984-03-02 | Mitsubishi Rayon Co Ltd | 炭素繊維強化用エポキシ樹脂組成物 |
US4656207A (en) * | 1985-02-19 | 1987-04-07 | Hercules Incorporated | Epoxy thermosets having improved toughness |
US4783506A (en) * | 1986-07-09 | 1988-11-08 | Hercules Incorporated | Damage tolerant composites containing infusible particles |
US4680076A (en) * | 1986-08-28 | 1987-07-14 | Hercules Incorporated | Multiphase epoxy thermosets having rubber within disperse phase |
US4833226A (en) | 1987-08-26 | 1989-05-23 | Asahi Kasei Kogyo Kabushiki Kaisha | Hardener for curable one-package epoxy resin system |
EP0459745B1 (fr) | 1990-05-28 | 1997-08-20 | W.R. Grace & Co.-Conn. | Durcisseur pour résines époxydes |
JP2914390B2 (ja) * | 1990-06-21 | 1999-06-28 | ナショナル・スターチ・アンド・ケミカル・インベストメント・ホールディング・コーポレーション | 改良されたエポキシ樹脂用硬化剤マスターバッチ |
US5350826A (en) | 1991-11-29 | 1994-09-27 | Tonen Corporation | Epoxy resin composition containing a polyaminoamide and a latent curing agent for fiber impregnation |
JP3261749B2 (ja) * | 1992-08-04 | 2002-03-04 | 味の素株式会社 | 一液性エポキシ樹脂組成物 |
EP0955675B1 (fr) * | 1998-05-07 | 2004-12-15 | Shin-Etsu Chemical Co., Ltd. | Compositions de résines époxydes et des dispositifs semi-conducteurs, qui en sont encapsulés |
US6376564B1 (en) * | 1998-08-27 | 2002-04-23 | Henkel Corporation | Storage-stable compositions useful for the production of structural foams |
ES2237437T3 (es) | 1999-07-28 | 2005-08-01 | Huntsman Advanced Materials (Switzerland) Gmbh | Endurecedor aminico para resinas epoxi. |
JP2004063992A (ja) * | 2002-07-31 | 2004-02-26 | Sumitomo Bakelite Co Ltd | 半導体用樹脂ペースト及び半導体装置 |
CA2625794A1 (fr) * | 2005-09-29 | 2007-04-05 | Asahi Kasei Chemicals Corporation | Agent de durcissement microencapsule presentant une grande stabilite pour resine epoxy et composition de resine epoxy |
-
2005
- 2005-03-30 CN CN2005800169381A patent/CN1957012B/zh active Active
- 2005-03-30 JP JP2006511752A patent/JP4583373B2/ja active Active
- 2005-03-30 CA CA002561414A patent/CA2561414A1/fr not_active Abandoned
- 2005-03-30 US US10/594,594 patent/US7820772B2/en active Active
- 2005-03-30 KR KR1020067022903A patent/KR100804293B1/ko active IP Right Grant
- 2005-03-30 EP EP05727940A patent/EP1731545A4/fr not_active Withdrawn
- 2005-03-30 WO PCT/JP2005/006129 patent/WO2005095486A1/fr active Application Filing
- 2005-03-31 TW TW094110387A patent/TWI291969B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW200613358A (en) | 2006-05-01 |
JPWO2005095486A1 (ja) | 2008-02-21 |
EP1731545A4 (fr) | 2008-11-12 |
CA2561414A1 (fr) | 2005-10-13 |
WO2005095486A1 (fr) | 2005-10-13 |
US20070244268A1 (en) | 2007-10-18 |
CN1957012A (zh) | 2007-05-02 |
JP4583373B2 (ja) | 2010-11-17 |
US7820772B2 (en) | 2010-10-26 |
KR100804293B1 (ko) | 2008-02-18 |
EP1731545A1 (fr) | 2006-12-13 |
CN1957012B (zh) | 2011-07-20 |
KR20070009662A (ko) | 2007-01-18 |
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