TWI291723B - Protective tape applying and separating method - Google Patents
Protective tape applying and separating method Download PDFInfo
- Publication number
- TWI291723B TWI291723B TW091137247A TW91137247A TWI291723B TW I291723 B TWI291723 B TW I291723B TW 091137247 A TW091137247 A TW 091137247A TW 91137247 A TW91137247 A TW 91137247A TW I291723 B TWI291723 B TW I291723B
- Authority
- TW
- Taiwan
- Prior art keywords
- protective tape
- tape
- protective
- peeling
- semiconductor wafer
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 285
- 238000000034 method Methods 0.000 title claims description 58
- 239000004065 semiconductor Substances 0.000 claims description 59
- 239000000853 adhesive Substances 0.000 claims description 41
- 230000001070 adhesive effect Effects 0.000 claims description 33
- 239000002390 adhesive tape Substances 0.000 claims description 13
- 210000002784 stomach Anatomy 0.000 claims 3
- 239000000758 substrate Substances 0.000 description 11
- 238000011084 recovery Methods 0.000 description 7
- 239000013078 crystal Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/68395—Separation by peeling using peeling wheel
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1994—Means for delaminating from release surface
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Investigation Of Foundation Soil And Reinforcement Of Foundation Soil By Compacting Or Drainage (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001396919A JP3880397B2 (ja) | 2001-12-27 | 2001-12-27 | 保護テープの貼付・剥離方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200402784A TW200402784A (en) | 2004-02-16 |
| TWI291723B true TWI291723B (en) | 2007-12-21 |
Family
ID=19189136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091137247A TWI291723B (en) | 2001-12-27 | 2002-12-25 | Protective tape applying and separating method |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6716295B2 (de) |
| EP (1) | EP1326266B1 (de) |
| JP (1) | JP3880397B2 (de) |
| KR (1) | KR100917084B1 (de) |
| CN (1) | CN1287426C (de) |
| AT (1) | ATE355613T1 (de) |
| DE (1) | DE60218417T2 (de) |
| SG (1) | SG103375A1 (de) |
| TW (1) | TWI291723B (de) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4088070B2 (ja) * | 2000-03-24 | 2008-05-21 | 富士通株式会社 | 自動取引システム、自動取引方法および金融サーバ装置 |
| JP2003209082A (ja) * | 2002-01-15 | 2003-07-25 | Nitto Denko Corp | 保護テープの貼付方法およびその装置並びに保護テープの剥離方法 |
| JP4060641B2 (ja) * | 2002-05-22 | 2008-03-12 | 株式会社ディスコ | テープ剥離方法 |
| JP4444619B2 (ja) * | 2003-10-10 | 2010-03-31 | リンテック株式会社 | マウント装置及びマウント方法 |
| JP4494753B2 (ja) | 2003-10-27 | 2010-06-30 | リンテック株式会社 | シート剥離装置及び剥離方法 |
| JP2005175253A (ja) * | 2003-12-12 | 2005-06-30 | Nitto Denko Corp | 保護テープ剥離方法およびこれを用いた装置 |
| JP2005175384A (ja) * | 2003-12-15 | 2005-06-30 | Nitto Denko Corp | 保護テープの貼付方法及び剥離方法 |
| JP4326418B2 (ja) * | 2004-07-16 | 2009-09-09 | 株式会社東京精密 | フィルム剥離方法およびフィルム剥離装置 |
| JP2006100728A (ja) * | 2004-09-30 | 2006-04-13 | Nitto Denko Corp | 保護テープ剥離方法およびこれを用いた装置 |
| US7348216B2 (en) * | 2005-10-04 | 2008-03-25 | International Business Machines Corporation | Rework process for removing residual UV adhesive from C4 wafer surfaces |
| TW200743146A (en) * | 2006-05-02 | 2007-11-16 | Touch Micro System Tech | Method of thinning a wafer |
| JP4376250B2 (ja) | 2006-06-21 | 2009-12-02 | テイコクテーピングシステム株式会社 | 多層構造体の形成方法 |
| JP5111938B2 (ja) * | 2007-05-25 | 2013-01-09 | 日東電工株式会社 | 半導体ウエハの保持方法 |
| KR100888920B1 (ko) * | 2007-08-31 | 2009-03-16 | 에스티에스반도체통신 주식회사 | 반도체 다이 적층용 접착테이프 이송 및 절단 장치 |
| JP5442288B2 (ja) * | 2009-03-27 | 2014-03-12 | 日東電工株式会社 | 保護テープ剥離方法およびこれを用いた保護テープ剥離装置 |
| JP5396227B2 (ja) * | 2009-10-15 | 2014-01-22 | 株式会社ディスコ | 保護テープ剥離装置 |
| JP4740381B2 (ja) * | 2010-03-12 | 2011-08-03 | リンテック株式会社 | シート剥離装置及び剥離方法 |
| US8574398B2 (en) * | 2010-05-27 | 2013-11-05 | Suss Microtec Lithography, Gmbh | Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers |
| CN109920774A (zh) * | 2012-03-26 | 2019-06-21 | 先进封装技术私人有限公司 | 用于半导体封装的多层基底 |
| KR20140142026A (ko) * | 2013-06-03 | 2014-12-11 | 삼성디스플레이 주식회사 | 기판 합착용 하부 필름, 기판 밀봉체 및 이들을 이용한 유기 발광 표시 장치의 제조 방법 |
| TWI618131B (zh) * | 2013-08-30 | 2018-03-11 | 半導體能源研究所股份有限公司 | 剝離起點形成裝置及形成方法、疊層體製造裝置 |
| US20150147850A1 (en) * | 2013-11-25 | 2015-05-28 | Infineon Technologies Ag | Methods for processing a semiconductor workpiece |
| KR102374162B1 (ko) * | 2015-03-02 | 2022-03-11 | 에스케이하이닉스 주식회사 | 적층형 반도체 소자용 층간 접착 부재의 인장 모드 접착력의 정량화 방법 및 이의 정량화를 위한 측정 장치 |
| TWI738049B (zh) * | 2019-09-04 | 2021-09-01 | 志聖工業股份有限公司 | 層膜裁切裝置、層膜裁切方法、晶圓貼膜機以及晶圓貼膜方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3181988A (en) * | 1961-01-03 | 1965-05-04 | Kleen Stik Products Inc | Tape applying machine |
| JPH07105433B2 (ja) | 1986-05-20 | 1995-11-13 | 三井東圧化学株式会社 | ウエハ加工用フイルムの貼付け方法 |
| JPS6469013A (en) * | 1987-09-10 | 1989-03-15 | Fujitsu Ltd | Grinding method |
| US5203143A (en) * | 1992-03-28 | 1993-04-20 | Tempo G | Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system |
| KR19990028523A (ko) * | 1995-08-31 | 1999-04-15 | 야마모토 히데키 | 반도체웨이퍼의 보호점착테이프의 박리방법 및 그 장치 |
| US6342434B1 (en) * | 1995-12-04 | 2002-01-29 | Hitachi, Ltd. | Methods of processing semiconductor wafer, and producing IC card, and carrier |
| JP3535318B2 (ja) * | 1996-09-30 | 2004-06-07 | 富士通株式会社 | 半導体装置およびその製造方法 |
| JP2000331968A (ja) | 1999-05-21 | 2000-11-30 | Tokyo Seimitsu Co Ltd | ウェーハ保護テープ |
-
2001
- 2001-12-27 JP JP2001396919A patent/JP3880397B2/ja not_active Expired - Fee Related
-
2002
- 2002-12-03 SG SG200207338A patent/SG103375A1/en unknown
- 2002-12-04 DE DE60218417T patent/DE60218417T2/de not_active Expired - Fee Related
- 2002-12-04 EP EP02027130A patent/EP1326266B1/de not_active Expired - Lifetime
- 2002-12-04 AT AT02027130T patent/ATE355613T1/de not_active IP Right Cessation
- 2002-12-09 US US10/314,276 patent/US6716295B2/en not_active Expired - Fee Related
- 2002-12-25 TW TW091137247A patent/TWI291723B/zh not_active IP Right Cessation
- 2002-12-26 KR KR1020020083959A patent/KR100917084B1/ko not_active IP Right Cessation
- 2002-12-27 CN CNB021604916A patent/CN1287426C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20030121599A1 (en) | 2003-07-03 |
| DE60218417D1 (de) | 2007-04-12 |
| JP3880397B2 (ja) | 2007-02-14 |
| KR100917084B1 (ko) | 2009-09-15 |
| EP1326266B1 (de) | 2007-02-28 |
| EP1326266A3 (de) | 2004-05-12 |
| EP1326266A2 (de) | 2003-07-09 |
| CN1287426C (zh) | 2006-11-29 |
| TW200402784A (en) | 2004-02-16 |
| KR20030057379A (ko) | 2003-07-04 |
| SG103375A1 (en) | 2004-04-29 |
| CN1428822A (zh) | 2003-07-09 |
| JP2003197583A (ja) | 2003-07-11 |
| DE60218417T2 (de) | 2007-11-15 |
| ATE355613T1 (de) | 2006-03-15 |
| US6716295B2 (en) | 2004-04-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |