TWI284106B - Film carrier tape for mounting electronic parts - Google Patents

Film carrier tape for mounting electronic parts Download PDF

Info

Publication number
TWI284106B
TWI284106B TW092131060A TW92131060A TWI284106B TW I284106 B TWI284106 B TW I284106B TW 092131060 A TW092131060 A TW 092131060A TW 92131060 A TW92131060 A TW 92131060A TW I284106 B TWI284106 B TW I284106B
Authority
TW
Taiwan
Prior art keywords
film
electronic parts
divided
solder resist
mounting electronic
Prior art date
Application number
TW092131060A
Other languages
English (en)
Other versions
TW200407248A (en
Inventor
Shuichi Kawasaki
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200407248A publication Critical patent/TW200407248A/zh
Application granted granted Critical
Publication of TWI284106B publication Critical patent/TWI284106B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Description

1284106 如可依在加熱下使薄膜承載通過多數輥子之間的方法、與所產生變形" 反方向邊彎曲薄膜承載膠帶（邊給與逆彎曲）加熱的方法等加以改正。 這種取彎曲方法，特別是對由絕緣薄膜所成膠帶之橫向形成一個配線 圖型的薄膜承載膠帶之取彎曲方法有效。 可是於最近的電子零件之安裝技術中，乃變成大多數使用COF(薄 膜覆晶接合)、CSP(晶片尺寸封裝)或BGA(球格柵陣列)等電子零件與薄 膜承载為大致相等面積的薄膜承載。而因這樣的薄膜承載佔有面積 小，所以可在絕緣薄膜所成膠帶之橫向排列製造複數個(例如兩個或四l 個)薄膜承載。於如此的CSP、COF、BGA等，為了於各個薄膜承載中 形成軟焊抗姓劑層，形成有軟焊抗餘劑層的各個薄膜承載彎曲，對在 橫向形成有複數個薄膜承載的膠帶予以逆彎曲時，膠帶會在橫向鄰接 的薄膜承載之境界部分彎曲，無輯各鑛f曲變形的細承载部分 有效地加以逆彎。因此如CSP、BGA在膠帶橫向形成複數薄膜承載的 電子零件安裝㈣縣娜帶，其實情乃林在歧正料個薄 膜承載產生的彎曲變形之取彎曲方法。 $ 專利文獻1特願2001_249499號說明書。 【發明内容】 本發明在於提㈣子零件安裝料麻_，其為_帶橫向形 成複數薄膜承载的電子零件安裝用薄膜承載膠帶，減低了各個薄膜承 載之彎曲變形為目的。 本發明之奸树絲料縣娜帶，係在長尺权鱗薄膜 IP030054/SF-969f 6 1284106 10 ’係形成有多數溥膜承載12於長尺寸之絕緣薄膜η。 此長尺寸之絕緣薄膜11，在蝕刻之際會接觸酸等情況，其具有不 會被此種樂品所侵犯之耐藥品性，及在接合之際加熱亦不變質的耐熱 性。作為形成此絕緣性薄膜11之材料例，可列舉聚酯、聚醯胺及聚醯 亞胺等。尤其是本發明使用由聚醯亞胺所成薄膜為理想，此聚醯亞胺 與其他樹脂比較，具有卓越的耐熱性，同時兼具優異耐藥品性。 作為此聚醯亞胺樹脂之例，可列舉由苯均四酸二酐及芳族二胺合_ 成的全芳族聚酿亞胺，由聯苯四叛酸二酐及芳族二胺所合成具有聯苯鲁 骨架的全芳族聚醯亞胺。尤其在本發明使用具有聯苯骨架的全芳族聚 醯亞胺(例：商品名：猶畢列克斯S，曰本宇部興產(股)公司製)為理想。 具有聯苯骨架的全芳族聚醯亞胺之吸水率較其他全芳族聚醯亞胺低。 在本發明對可使用的絕緣薄膜厚度並無特別限制，但厚度75/zm以下 之絕緣薄膜之自己形態保持力變低，容易產生變形，故本發明使用絕 緣薄膜厚度(平均厚度)為75/zm以下，理想為在50〜12.5/zm範圍内的· 絕緣薄製造薄型薄膜承載之際有用性高。 ¥ 在此長尺寸絕緣薄膜11之橫向緣部，形成多數用以移動此絕緣薄 膜11並實行定位用之定位孔。又此絕緣薄膜U，亦可以再形成定位孔、 裝置孔、成為外部端子用來配置軟焊珠的軟焊珠孔、為了確保與電^ 零件連接用之開缝等。該等可由衝孔製程、使用雷射光的穿孔製程來 形成。 在如此之形成必要透孔的絕緣薄膜上形成配線圖型15。例如，係 BP030054/SF-969f 8 1284106 接著在此聚醯亞胺薄膜貼上平均厚度25ym的電解銅箔，塗覆•感 光性樹脂在此電解銅箔上，予以曝光、顯像。由這樣顯像感光性樹脂 所成之圖型作為遮蔽材’由於選擇性蝕刻該電解銅箔而形成由銅所構 成之配線圖型。 由於在以如此形成的配線圖型表面所塗覆之軟焊抗钱劑油墨加熱 硬化’形成軟焊抗钱劑層(硬化後平均厚度：l〇^m)。依此所形成的軟 焊抗姓劑層’由於形成屏蔽遮罩，如第1圖所示予以4分割，在各割 區之間存在有200/zm寬未塗覆軟焊抗钱劑的部分(劃區部分）。 形成為4分割的軟焊抗钱劑層後，由軟焊抗钱劑層未被覆的連接 端子及軟焊抗蝕劑層之劃區部，鍵鎳後作鍍金處理，再按照常法對薄 膜承載膠帶全體實行取彎。 將在所獲得之電子零件安裝用薄膜承載膠帶靠近長度方向中心部 分的薄膜承載，隨意地選擇6排12個，對該等之薄膜承載測定彎曲變 形 結果示於表1。又，於表1記載上層、下層係如第1圖所示配置之
際為了區別此薄膜承載膠帶在上侧的薄膜承載與在下側的薄膜承載 者，與本發明之電子零件安裝用薄膜承載膠帶製程的膠帶之朝向無關 係0 表1 第一塊 第二塊 第三塊 第四塊 第五塊 第六塊 平均值 上 層 0.35mm -0.005mm 0.015mm 0.023mm 〇*150miii 0.071mm 0.035mm n>030054/SF-969f 17 1284106 下 ❶.012mm ❶.051mm -0.019mm -0.016mm 0.017mm 0.180mm 4 , 4 層 比較例1 於實施例1中，除未分割軟焊抗姓劑層以外係同樣製造了電子零 件安裝用薄膜承載膠帶。 對獲得的電零件安裝用薄膜承載膠帶，與實施例同樣隨意地選擇 連續6排12個薄膜承載，測定該等薄膜承載之彎曲變形。 結果記載於表2。 表2 第一塊 第二塊 第三塊 第四塊 第五塊 第六塊 平均值 上 層 0.112mm 0.050mm ❶•❶74mm 0*078mm 0.084mm 0.061mm 0.085mm 下 層 0.098mm (K074mm 0.093mm 0*092mm 0.072mm 0.089mm 比較上述表1與表2可明白看出，由於4分割之軟焊抗姓劑層， 薄膜承載之彎曲變形量之平均值可降低一半以下。 【圖式簡單說明】 第1圖表示本發明電子零件安裝用薄膜承載膠帶之一例平視圖。 第2圖於第1圖的A-A剖面圖。 第3圖說明選出形成本發明電子零件安裝用薄膜承載膠帶的一個薄 膜承載說明圖。 第4圖於本發明中表示測定薄膜承載的彎曲變形方法圖。 第5圖表不除端子部以外，配線圖型之·以上形成軟焊抗钱劑層 BP030054/SF-969f 18 1284106 之電子零件安裝用薄膜承載膠帶例圖。 第6圖表示軟焊抗餘劑層之劃區部剖面例圖。 【元件符號簡單說明】 10 電子零件安裝用薄膜承載膠帶 11 絕緣膠帶 12 薄膜承載 14 定位孔 15 配線圖形 16 端子部分(連接端子） 17 焊珠球 20 軟焊抗蝕劑層 20a，20b，20c，20d A，B，C，D 劃區 W 劃區之間之距離 h0，hl 軟焊抗蚀劑層厚度 19 IP030054/SF-969f

Claims (1)

1284106 第092131060號專利申請案未劃線修正頁 拾、申請專利範圍： 1、 一種電子零件安裝用薄膜承載膠帶，係在長尺寸絕緣薄膜表面形成 由導電性金屬所形成、且該配線圖型在該長尺寸之絕緣薄膜橫向至 少併設2個所成，其特徵為： 該各個配線圖型除連接端子部分以外，各獨立地由軟抗蝕劑層 所被覆，且形成在各個配線圖型表面的軟焊抗姓劑層係分割及/或 劃分為複數個， 該絕緣薄膜上所形成之1個薄膜承載的佔有面積為與安裝在該 薄膜承載上之電子零件之面積大致相同， 且該經分割或經劃分之軟焊抗蝕劑層與該分割或劃分之軟焊抗 钱劑之劃區之鄰接軟焊抗钱劑層的劃區之間隙在2〇//m〜3mm之範 圍内。 2、 如申請專利範圍第1項之電子零件安裝用薄膜承載膠帶，其中在該 各個配線圖型表面，軟焊抗蝕劑層係分割及/或劃分為2〜16個而形 成者。 3、 如申請專利範圍第1項之電子零件安裝用薄膜承載膠帶，其中該長 尺寸之絕緣薄膜厚度為75//m以下。 4、 如申請專利範圍第1項之電子零件安裝用薄膜承載膠帶，其中與安 裝有該薄膜承載之電子零件該侧相反側的表面上可配置地形成用 以與外部電氣接觸之金屬球。 5、 >申請專利範圍第1項之電子零件安裝用薄膜承載膠帶，其中塗佈 IP030054/SF.969f 20 1284106
第092131060號專利申請案未劃線修正頁 (95_瓣換頁 在該配線圖型表面的軟焊抗蝕劑層於硬化後在配線圖型中的劃區 部分以外之平均厚度在3〜50範圍内。 6、 如申請專利範圍第1項之電子零件安裝用薄膜承載膠帶，其中除了 連接端子部分以外之配線圖型區域部之20%以上形成有該軟焊抗 钱劑層者。 IP030054/SF-969f 21
TW092131060A 2002-11-07 2003-11-06 Film carrier tape for mounting electronic parts TWI284106B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002324445A JP3914135B2 (ja) 2002-11-07 2002-11-07 電子部品実装用フィルムキャリアテープ

Publications (2)

Publication Number Publication Date
TW200407248A TW200407248A (en) 2004-05-16
TWI284106B true TWI284106B (en) 2007-07-21

Family

ID=32310448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092131060A TWI284106B (en) 2002-11-07 2003-11-06 Film carrier tape for mounting electronic parts

Country Status (6)

Country Link
US (1) US20060118457A1 (zh)
JP (1) JP3914135B2 (zh)
KR (1) KR100713509B1 (zh)
CN (1) CN100377325C (zh)
TW (1) TWI284106B (zh)
WO (1) WO2004042814A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9048272B2 (en) * 2008-09-25 2015-06-02 Illinois Tool Works Inc. Devices and method for handling microelectronics assemblies
TWI412818B (zh) * 2009-09-15 2013-10-21 Chunghwa Picture Tubes Ltd 液晶顯示面板及其走線結構
CN102543765B (zh) * 2012-01-13 2014-12-10 迈普通信技术股份有限公司 一种贴片元器件焊盘设计方法、焊盘结构及印刷电路板
CN105451458B (zh) * 2014-08-19 2018-10-30 宁波舜宇光电信息有限公司 一种控制软硬结合板微量变形的方法及pcb基板半成品
CN105552048A (zh) * 2016-01-28 2016-05-04 珠海格力节能环保制冷技术研究中心有限公司 导热焊盘及具有其的qfp芯片的封装结构
CN105611722A (zh) * 2016-03-21 2016-05-25 安捷利电子科技（苏州）有限公司 一种mems产品的印制电路板
CN109714896B (zh) * 2018-11-23 2021-03-19 广州广合科技股份有限公司 一种改善多层印制电路大拼板内套板局部形变的方法
CN110351959A (zh) * 2019-07-17 2019-10-18 高德(苏州)电子有限公司 改善不对称压合线路板板翘的方法以及控制结构

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60216573A (ja) * 1984-04-12 1985-10-30 Seiko Epson Corp フレキシブル印刷配線板の製造方法
JPH0529395A (ja) * 1991-07-22 1993-02-05 Mitsui Mining & Smelting Co Ltd Ｔａｂテープの製造方法
JP2737545B2 (ja) * 1992-06-17 1998-04-08 日立電線株式会社 半導体装置用フィルムキャリアテープ及びその製造方法
JP3339387B2 (ja) * 1997-11-07 2002-10-28 日立電線株式会社 Ｔａｂ用テープの製造方法
US6914196B2 (en) * 1998-01-09 2005-07-05 Samsung Electronics Co., Ltd. Reel-deployed printed circuit board
JPH11307594A (ja) * 1998-04-23 1999-11-05 Mitsui Mining & Smelting Co Ltd 電子部品実装用フィルムキャリアテープおよび半導体素子
KR100556240B1 (ko) * 1998-07-28 2006-03-03 세이코 엡슨 가부시키가이샤 반도체 장치 제조방법
JP3457547B2 (ja) * 1998-09-09 2003-10-20 松下電器産業株式会社 半導体装置およびその製造方法ならびにフィルムキャリア
US6320135B1 (en) * 1999-02-03 2001-11-20 Casio Computer Co., Ltd. Flexible wiring substrate and its manufacturing method
JP3827497B2 (ja) * 1999-11-29 2006-09-27 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2002190674A (ja) * 2000-12-21 2002-07-05 Sony Chem Corp 多層フレキシブル配線板の製造方法
JP4701563B2 (ja) * 2001-08-23 2011-06-15 日本テキサス・インスツルメンツ株式会社 半導体チップ搭載基板及びそれを用いた半導体装置

Also Published As

Publication number Publication date
JP2004158725A (ja) 2004-06-03
KR20050053790A (ko) 2005-06-08
JP3914135B2 (ja) 2007-05-16
CN100377325C (zh) 2008-03-26
TW200407248A (en) 2004-05-16
US20060118457A1 (en) 2006-06-08
KR100713509B1 (ko) 2007-04-30
CN1708841A (zh) 2005-12-14
WO2004042814A1 (ja) 2004-05-21

Similar Documents

Publication Publication Date Title
JP4308862B2 (ja) 配線回路基板およびその製造方法
TWI287418B (en) Printed wiring board and semiconductor device
US7271347B2 (en) Wired circuit board
US8092696B2 (en) Method for manufacturing printed circuit board
EP1592290A1 (en) Wired circuit board and production method thereof
CN1306605C (zh) 用于在其上安装电子器件的薄膜载带
CN1841686A (zh) 柔性印刷线路板的制造方法以及柔性印刷线路板
CN112074075A (zh) 柔性电路板
CN110402020B (zh) 一种柔性印刷线路板及其制造方法
JP2009094361A (ja) Ｃｏｆ基板
US20070023876A1 (en) Tab tape carrier
TWI284106B (en) Film carrier tape for mounting electronic parts
JP2005303172A (ja) 配線回路基板
JP3734481B2 (ja) Ｔａｂ用テープキャリアの製造方法
US7312145B2 (en) Electronic member, method for making the same, and semiconductor device
JP2000196205A (ja) フレキシブルプリント基板
KR100374075B1 (ko) 전자부품 실장용 필름캐리어 테이프 및 그 제조방법
JP2005244003A (ja) 配線回路基板
KR100599549B1 (ko) 전자부품 실장용 필름 캐리어 테이프
JP3584996B2 (ja) エレクトリカルテスト用配線基板及びその製造方法
JP3536983B2 (ja) エレクトリカルテスト用配線基板の製造方法
JP3879259B2 (ja) Ｔａｂ用フィルムキャリアテープ
JP2004179485A (ja) プリント配線板の製造方法及びプリント配線板
JP4359992B2 (ja) フィルムキャリアの製造方法
JPH0555306A (ja) 電極付フイルム

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees