TWI271793B - System and method of cleaning and etching a substrate - Google Patents

System and method of cleaning and etching a substrate Download PDF

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Publication number
TWI271793B
TWI271793B TW094121622A TW94121622A TWI271793B TW I271793 B TWI271793 B TW I271793B TW 094121622 A TW094121622 A TW 094121622A TW 94121622 A TW94121622 A TW 94121622A TW I271793 B TWI271793 B TW I271793B
Authority
TW
Taiwan
Prior art keywords
substrate
solution
light
substrate processing
layer
Prior art date
Application number
TW094121622A
Other languages
English (en)
Chinese (zh)
Other versions
TW200608478A (en
Inventor
Mikhail Korolik
John M Boyd
Katrina Mikhaylich
Michael Ravkin
Fred C Redeker
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of TW200608478A publication Critical patent/TW200608478A/zh
Application granted granted Critical
Publication of TWI271793B publication Critical patent/TWI271793B/zh

Links

Classifications

    • H10P50/287—
    • H10P52/00—
    • H10P50/00—
    • H10P72/0424—

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
TW094121622A 2004-06-28 2005-06-28 System and method of cleaning and etching a substrate TWI271793B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US88000704A 2004-06-28 2004-06-28

Publications (2)

Publication Number Publication Date
TW200608478A TW200608478A (en) 2006-03-01
TWI271793B true TWI271793B (en) 2007-01-21

Family

ID=35786645

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121622A TWI271793B (en) 2004-06-28 2005-06-28 System and method of cleaning and etching a substrate

Country Status (6)

Country Link
EP (1) EP1782461A4 (enExample)
JP (1) JP2008504714A (enExample)
KR (1) KR20070026687A (enExample)
CN (1) CN101006571A (enExample)
TW (1) TWI271793B (enExample)
WO (1) WO2006012174A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI504449B (zh) * 2011-09-21 2015-10-21 南亞科技股份有限公司 晶圓洗滌器和晶圓洗滌程序

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010236088A (ja) * 2009-03-09 2010-10-21 Hitachi High-Technologies Corp マスク部材のクリーニング装置及びクリーニング方法並びに有機ｅｌディスプレイ
KR101992422B1 (ko) * 2012-08-14 2019-06-24 주식회사 동진쎄미켐 광분해 고도산화공정을 이용한 금속막의 연마 장치 및 방법
KR102095084B1 (ko) * 2013-11-11 2020-03-30 도쿄엘렉트론가부시키가이샤 자외선 처리를 이용하여 금속 하드마스크의 제거를 강화시키는 시스템 및 방법
KR102166974B1 (ko) * 2013-11-11 2020-10-16 도쿄엘렉트론가부시키가이샤 에칭 후 폴리머의 제거 및 하드마스크 제거의 향상을 위한 방법 및 하드웨어
US10896824B2 (en) * 2018-12-14 2021-01-19 Tokyo Electron Limited Roughness reduction methods for materials using illuminated etch solutions
US10867815B2 (en) * 2018-09-04 2020-12-15 Tokyo Electron Limited Photonically tuned etchant reactivity for wet etching
US12112959B2 (en) 2018-09-04 2024-10-08 Tokyo Electron Limited Processing systems and platforms for roughness reduction of materials using illuminated etch solutions
CN113302730B (zh) * 2018-12-14 2024-11-22 东京毅力科创株式会社 使用照射刻蚀溶液来降低材料粗糙度的加工系统和平台

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5512123A (en) * 1992-05-19 1996-04-30 Maxwell Laboratories Method for using pulsed optical energy to increase the bondability of a surface
US5782986A (en) * 1996-01-11 1998-07-21 Fsi International Process for metals removal using beta-diketone or beta-ketoimine ligand forming compounds
US6631726B1 (en) * 1999-08-05 2003-10-14 Hitachi Electronics Engineering Co., Ltd. Apparatus and method for processing a substrate
US6503464B1 (en) * 1999-08-12 2003-01-07 Sipec Corporation Ultraviolet processing apparatus and ultraviolet processing method
JP3961240B2 (ja) * 2001-06-28 2007-08-22 株式会社半導体エネルギー研究所 半導体装置の作製方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI504449B (zh) * 2011-09-21 2015-10-21 南亞科技股份有限公司 晶圓洗滌器和晶圓洗滌程序

Also Published As

Publication number Publication date
CN101006571A (zh) 2007-07-25
JP2008504714A (ja) 2008-02-14
KR20070026687A (ko) 2007-03-08
EP1782461A4 (en) 2008-05-28
WO2006012174A3 (en) 2006-09-14
WO2006012174A2 (en) 2006-02-02
EP1782461A2 (en) 2007-05-09
TW200608478A (en) 2006-03-01

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