TWI270956B - Substrate processing apparatus and substrate processing method - Google Patents
Substrate processing apparatus and substrate processing method Download PDFInfo
- Publication number
- TWI270956B TWI270956B TW092112464A TW92112464A TWI270956B TW I270956 B TWI270956 B TW I270956B TW 092112464 A TW092112464 A TW 092112464A TW 92112464 A TW92112464 A TW 92112464A TW I270956 B TWI270956 B TW I270956B
- Authority
- TW
- Taiwan
- Prior art keywords
- processing
- substrate
- processed
- accumulated
- processing unit
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 401
- 239000000758 substrate Substances 0.000 title claims description 158
- 238000003672 processing method Methods 0.000 title claims description 31
- 238000002955 isolation Methods 0.000 claims description 37
- 230000032258 transport Effects 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 22
- 230000007723 transport mechanism Effects 0.000 claims description 17
- 230000001186 cumulative effect Effects 0.000 claims description 11
- 230000015654 memory Effects 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 98
- 238000012423 maintenance Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 108
- 239000013078 crystal Substances 0.000 description 9
- 238000012546 transfer Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000004092 self-diagnosis Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32315—Machine with least work
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002139775A JP4334817B2 (ja) | 2002-05-15 | 2002-05-15 | 基板処理装置及び基板処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200400584A TW200400584A (en) | 2004-01-01 |
| TWI270956B true TWI270956B (en) | 2007-01-11 |
Family
ID=29544905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092112464A TWI270956B (en) | 2002-05-15 | 2003-05-07 | Substrate processing apparatus and substrate processing method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4334817B2 (enExample) |
| KR (1) | KR100949013B1 (enExample) |
| CN (1) | CN1321448C (enExample) |
| TW (1) | TWI270956B (enExample) |
| WO (1) | WO2003098684A1 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005112108A1 (ja) * | 2004-05-17 | 2005-11-24 | Hitachi Kokusai Electric Inc. | 基板処理装置及び半導体デバイス製造方法 |
| JP4566035B2 (ja) * | 2005-03-11 | 2010-10-20 | 東京エレクトロン株式会社 | 塗布、現像装置及びその方法 |
| KR100929944B1 (ko) * | 2006-02-07 | 2009-12-04 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치의 제어 장치 및 기판 처리 장치의 제어 프로그램을 기록한 기억 매체 |
| JP5091413B2 (ja) * | 2006-03-08 | 2012-12-05 | 東京エレクトロン株式会社 | 基板処理装置および基板処理装置の制御方法 |
| JP5128080B2 (ja) * | 2006-03-29 | 2013-01-23 | 東京エレクトロン株式会社 | 基板処理装置の制御装置およびその制御方法 |
| JP2008135517A (ja) * | 2006-11-28 | 2008-06-12 | Tokyo Electron Ltd | 基板処理装置の制御装置、制御方法および制御プログラムを記憶した記憶媒体 |
| JP2008311365A (ja) * | 2007-06-13 | 2008-12-25 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP5115727B2 (ja) * | 2008-06-11 | 2013-01-09 | Ｎｅｃアクセステクニカ株式会社 | 検査システム、検査方法および検査結果情報格納装置ならびに制御端末 |
| JP5571122B2 (ja) * | 2012-06-06 | 2014-08-13 | 東京エレクトロン株式会社 | 基板処理装置および基板処理装置の制御方法 |
| JP6045946B2 (ja) * | 2012-07-13 | 2016-12-14 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置、プログラムおよび記録媒体 |
| KR101883804B1 (ko) * | 2014-03-25 | 2018-07-31 | 카와사키 주코교 카부시키 카이샤 | 기판 각도정렬 장치, 기판 각도정렬 방법 및 기판 이송 방법 |
| JP6089082B1 (ja) * | 2015-09-29 | 2017-03-01 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体 |
| JP6704008B2 (ja) * | 2018-03-26 | 2020-06-03 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、半導体装置の製造方法および記録媒体 |
| JP7170438B2 (ja) * | 2018-07-03 | 2022-11-14 | 東京エレクトロン株式会社 | 基板処理装置及び判定方法 |
| JP6719523B2 (ja) | 2018-09-18 | 2020-07-08 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、半導体装置の製造方法および記録媒体 |
| JP7582289B2 (ja) * | 2022-12-23 | 2024-11-13 | 株式会社Sumco | 半導体製造装置、半導体製造工場及び半導体製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0624595A (ja) * | 1992-07-08 | 1994-02-01 | Fuji Xerox Co Ltd | 記録装置 |
| TW442891B (en) | 1998-11-17 | 2001-06-23 | Tokyo Electron Ltd | Vacuum processing system |
| JP2001093791A (ja) * | 1999-09-20 | 2001-04-06 | Hitachi Ltd | 真空処理装置の運転方法及びウエハの処理方法 |
-
2002
- 2002-05-15 JP JP2002139775A patent/JP4334817B2/ja not_active Expired - Fee Related
-
2003
- 2003-05-02 KR KR1020047018263A patent/KR100949013B1/ko not_active Expired - Fee Related
- 2003-05-02 WO PCT/JP2003/005597 patent/WO2003098684A1/ja not_active Ceased
- 2003-05-02 CN CNB038110636A patent/CN1321448C/zh not_active Expired - Lifetime
- 2003-05-07 TW TW092112464A patent/TWI270956B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003098684A1 (en) | 2003-11-27 |
| CN1653606A (zh) | 2005-08-10 |
| KR100949013B1 (ko) | 2010-03-23 |
| TW200400584A (en) | 2004-01-01 |
| JP2003332405A (ja) | 2003-11-21 |
| JP4334817B2 (ja) | 2009-09-30 |
| KR20040104734A (ko) | 2004-12-10 |
| CN1321448C (zh) | 2007-06-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |