KR100949013B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR100949013B1
KR100949013B1 KR1020047018263A KR20047018263A KR100949013B1 KR 100949013 B1 KR100949013 B1 KR 100949013B1 KR 1020047018263 A KR1020047018263 A KR 1020047018263A KR 20047018263 A KR20047018263 A KR 20047018263A KR 100949013 B1 KR100949013 B1 KR 100949013B1
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South Korea
Prior art keywords
processing
substrate
processed
conveyance
load lock
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Expired - Fee Related
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KR1020047018263A
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English (en)
Korean (ko)
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KR20040104734A (ko
Inventor
누마쿠라마사히로
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32315—Machine with least work
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020047018263A 2002-05-15 2003-05-02 기판 처리 장치 및 기판 처리 방법 Expired - Fee Related KR100949013B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002139775A JP4334817B2 (ja) 2002-05-15 2002-05-15 基板処理装置及び基板処理方法
JPJP-P-2002-00139775 2002-05-15
PCT/JP2003/005597 WO2003098684A1 (en) 2002-05-15 2003-05-02 Substrate processing device and substrate processing method

Publications (2)

Publication Number Publication Date
KR20040104734A KR20040104734A (ko) 2004-12-10
KR100949013B1 true KR100949013B1 (ko) 2010-03-23

Family

ID=29544905

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047018263A Expired - Fee Related KR100949013B1 (ko) 2002-05-15 2003-05-02 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
JP (1) JP4334817B2 (enExample)
KR (1) KR100949013B1 (enExample)
CN (1) CN1321448C (enExample)
TW (1) TWI270956B (enExample)
WO (1) WO2003098684A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150036040A (ko) * 2012-07-13 2015-04-07 가부시키가이샤 스크린 홀딩스 기판 처리 장치, 프로그램 및 기판 처리 방법
KR20160132065A (ko) * 2014-03-25 2016-11-16 카와사키 주코교 카부시키 카이샤 기판 각도정렬 장치, 기판 각도정렬 방법 및 기판 이송 방법

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100468683C (zh) * 2004-05-17 2009-03-11 株式会社日立国际电气 衬底处理装置
JP4566035B2 (ja) * 2005-03-11 2010-10-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
KR100929944B1 (ko) * 2006-02-07 2009-12-04 도쿄엘렉트론가부시키가이샤 기판 처리 장치의 제어 장치 및 기판 처리 장치의 제어 프로그램을 기록한 기억 매체
JP5091413B2 (ja) * 2006-03-08 2012-12-05 東京エレクトロン株式会社 基板処理装置および基板処理装置の制御方法
JP5128080B2 (ja) * 2006-03-29 2013-01-23 東京エレクトロン株式会社 基板処理装置の制御装置およびその制御方法
JP2008135517A (ja) * 2006-11-28 2008-06-12 Tokyo Electron Ltd 基板処理装置の制御装置、制御方法および制御プログラムを記憶した記憶媒体
JP2008311365A (ja) * 2007-06-13 2008-12-25 Hitachi Kokusai Electric Inc 基板処理装置
JP5115727B2 (ja) * 2008-06-11 2013-01-09 Ｎｅｃアクセステクニカ株式会社 検査システム、検査方法および検査結果情報格納装置ならびに制御端末
JP5571122B2 (ja) * 2012-06-06 2014-08-13 東京エレクトロン株式会社 基板処理装置および基板処理装置の制御方法
JP6089082B1 (ja) * 2015-09-29 2017-03-01 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
JP6704008B2 (ja) * 2018-03-26 2020-06-03 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法および記録媒体
JP7170438B2 (ja) * 2018-07-03 2022-11-14 東京エレクトロン株式会社 基板処理装置及び判定方法
JP6719523B2 (ja) 2018-09-18 2020-07-08 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法および記録媒体
JP7582289B2 (ja) 2022-12-23 2024-11-13 株式会社Sumco 半導体製造装置、半導体製造工場及び半導体製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001093791A (ja) 1999-09-20 2001-04-06 Hitachi Ltd 真空処理装置の運転方法及びウエハの処理方法
EP1146548A1 (en) 1998-11-17 2001-10-17 Tokyo Electron Limited Vacuum processing system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0624595A (ja) * 1992-07-08 1994-02-01 Fuji Xerox Co Ltd 記録装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1146548A1 (en) 1998-11-17 2001-10-17 Tokyo Electron Limited Vacuum processing system
JP2001093791A (ja) 1999-09-20 2001-04-06 Hitachi Ltd 真空処理装置の運転方法及びウエハの処理方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150036040A (ko) * 2012-07-13 2015-04-07 가부시키가이샤 스크린 홀딩스 기판 처리 장치, 프로그램 및 기판 처리 방법
KR102067852B1 (ko) * 2012-07-13 2020-01-17 가부시키가이샤 스크린 홀딩스 기판 처리 장치, 프로그램 및 기판 처리 방법
KR20200006195A (ko) * 2012-07-13 2020-01-17 가부시키가이샤 스크린 홀딩스 기판 처리 장치, 프로그램 및 기판 처리 방법
KR102201973B1 (ko) * 2012-07-13 2021-01-12 가부시키가이샤 스크린 홀딩스 기판 처리 장치, 프로그램 및 기판 처리 방법
KR20160132065A (ko) * 2014-03-25 2016-11-16 카와사키 주코교 카부시키 카이샤 기판 각도정렬 장치, 기판 각도정렬 방법 및 기판 이송 방법
KR101883804B1 (ko) * 2014-03-25 2018-07-31 카와사키 주코교 카부시키 카이샤 기판 각도정렬 장치, 기판 각도정렬 방법 및 기판 이송 방법

Also Published As

Publication number Publication date
JP2003332405A (ja) 2003-11-21
TWI270956B (en) 2007-01-11
CN1653606A (zh) 2005-08-10
JP4334817B2 (ja) 2009-09-30
CN1321448C (zh) 2007-06-13
WO2003098684A1 (en) 2003-11-27
KR20040104734A (ko) 2004-12-10
TW200400584A (en) 2004-01-01

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