TWI266962B - Radiation source, lithographic apparatus, and device manufacturing method - Google Patents
Radiation source, lithographic apparatus, and device manufacturing methodInfo
- Publication number
- TWI266962B TWI266962B TW092125623A TW92125623A TWI266962B TW I266962 B TWI266962 B TW I266962B TW 092125623 A TW092125623 A TW 092125623A TW 92125623 A TW92125623 A TW 92125623A TW I266962 B TWI266962 B TW I266962B
- Authority
- TW
- Taiwan
- Prior art keywords
- radiation source
- source comprises
- improve
- radiation
- anode
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 230000005670 electromagnetic radiation Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- 229910052744 lithium Inorganic materials 0.000 abstract 1
- 229910052724 xenon Inorganic materials 0.000 abstract 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/003—Production of X-ray radiation generated from plasma the plasma being generated from a material in a liquid or gas state
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70166—Capillary or channel elements, e.g. nested extreme ultraviolet [EUV] mirrors or shells, optical fibers or light guides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/003—Production of X-ray radiation generated from plasma the plasma being generated from a material in a liquid or gas state
- H05G2/005—Production of X-ray radiation generated from plasma the plasma being generated from a material in a liquid or gas state containing a metal as principal radiation generating component
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Plasma & Fusion (AREA)
- Epidemiology (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Public Health (AREA)
- Atmospheric Sciences (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Sustainable Development (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thermal Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- X-Ray Techniques (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02256486 | 2002-09-19 | ||
EP02256907 | 2002-10-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200413860A TW200413860A (en) | 2004-08-01 |
TWI266962B true TWI266962B (en) | 2006-11-21 |
Family
ID=32395460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092125623A TWI266962B (en) | 2002-09-19 | 2003-09-17 | Radiation source, lithographic apparatus, and device manufacturing method |
Country Status (6)
Country | Link |
---|---|
US (1) | US7528395B2 (zh) |
JP (2) | JP4381094B2 (zh) |
KR (1) | KR100598639B1 (zh) |
CN (2) | CN101795527B (zh) |
SG (1) | SG153664A1 (zh) |
TW (1) | TWI266962B (zh) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5098126B2 (ja) * | 2001-08-07 | 2012-12-12 | 株式会社ニコン | X線発生装置、露光装置、露光方法及びデバイス製造方法 |
US7154109B2 (en) * | 2004-09-30 | 2006-12-26 | Intel Corporation | Method and apparatus for producing electromagnetic radiation |
CN101065999B (zh) * | 2004-11-29 | 2011-04-06 | 皇家飞利浦电子股份有限公司 | 用于产生波长范围从大约1nm至大约30nm的辐射并在光刻装置或计量学中使用的方法和设备 |
DE102005007884A1 (de) * | 2005-02-15 | 2006-08-24 | Xtreme Technologies Gmbh | Vorrichtung und Verfahren zur Erzeugung von extrem ultravioletter (EUV-) Strahlung |
KR101177707B1 (ko) * | 2005-02-25 | 2012-08-29 | 사이머 인코포레이티드 | Euv 광원의 타겟 물질 핸들링을 위한 방법 및 장치 |
DE102005023060B4 (de) * | 2005-05-19 | 2011-01-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Gasentladungs-Strahlungsquelle, insbesondere für EUV-Strahlung |
DE102005039849B4 (de) * | 2005-08-19 | 2011-01-27 | Xtreme Technologies Gmbh | Vorrichtung zur Strahlungserzeugung mittels einer Gasentladung |
DE102005044141B4 (de) * | 2005-09-15 | 2008-08-14 | Qimonda Ag | Belichtungsgerät und Verfahren zum Betrieb eines Belichtungsgeräts |
US7462851B2 (en) * | 2005-09-23 | 2008-12-09 | Asml Netherlands B.V. | Electromagnetic radiation source, lithographic apparatus, device manufacturing method and device manufactured thereby |
DE102006003683B3 (de) * | 2006-01-24 | 2007-09-13 | Xtreme Technologies Gmbh | Anordnung und Verfahren zur Erzeugung von EUV-Strahlung hoher Durchschnittsleistung |
EP2020165B1 (en) * | 2006-05-16 | 2010-11-24 | Philips Intellectual Property & Standards GmbH | A method of increasing the conversion efficiency of an euv and/or soft x-ray lamp and a corresponding apparatus |
US8766212B2 (en) * | 2006-07-19 | 2014-07-01 | Asml Netherlands B.V. | Correction of spatial instability of an EUV source by laser beam steering |
US7518134B2 (en) * | 2006-12-06 | 2009-04-14 | Asml Netherlands B.V. | Plasma radiation source for a lithographic apparatus |
US7759663B1 (en) * | 2006-12-06 | 2010-07-20 | Asml Netherlands B.V. | Self-shading electrodes for debris suppression in an EUV source |
US7838853B2 (en) | 2006-12-14 | 2010-11-23 | Asml Netherlands B.V. | Plasma radiation source, method of forming plasma radiation, apparatus for projecting a pattern from a patterning device onto a substrate and device manufacturing method |
US7518135B2 (en) | 2006-12-20 | 2009-04-14 | Asml Netherlands B.V. | Reducing fast ions in a plasma radiation source |
US20080239262A1 (en) * | 2007-03-29 | 2008-10-02 | Asml Netherlands B.V. | Radiation source for generating electromagnetic radiation and method for generating electromagnetic radiation |
JP2008311465A (ja) * | 2007-06-15 | 2008-12-25 | Nikon Corp | Euv光源、euv露光装置および半導体デバイスの製造方法 |
US8227771B2 (en) * | 2007-07-23 | 2012-07-24 | Asml Netherlands B.V. | Debris prevention system and lithographic apparatus |
US8493548B2 (en) * | 2007-08-06 | 2013-07-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8901521B2 (en) | 2007-08-23 | 2014-12-02 | Asml Netherlands B.V. | Module and method for producing extreme ultraviolet radiation |
US7763871B2 (en) | 2008-04-02 | 2010-07-27 | Asml Netherlands B.V. | Radiation source |
JP5191541B2 (ja) * | 2007-08-23 | 2013-05-08 | エーエスエムエル ネザーランズ ビー.ブイ. | 極端紫外線を生成するモジュールおよび方法、並びにリソグラフィ投影装置 |
NL2002890A1 (nl) * | 2008-06-16 | 2009-12-17 | Asml Netherlands Bv | Lithographic apparatus. |
EP2308272B1 (en) * | 2008-07-28 | 2012-09-19 | Philips Intellectual Property & Standards GmbH | Method and device for generating euv radiation or soft x-rays |
DE102010055889B4 (de) * | 2010-12-21 | 2014-04-30 | Ushio Denki Kabushiki Kaisha | Verfahren und Vorrichtung zur Erzeugung kurzwelliger Strahlung mittels einer gasentladungsbasierten Hochfrequenzhochstromentladung |
CN105573060B (zh) * | 2014-10-16 | 2017-12-01 | 中芯国际集成电路制造(上海)有限公司 | Euv光源和曝光装置、校准装置和校准方法 |
CN111585152B (zh) * | 2020-04-08 | 2022-02-08 | 中国科学院微电子研究所 | 用于激光器腔室的电极、激光器系统及曝光设备 |
CN112164484B (zh) * | 2020-08-21 | 2024-08-30 | 唐亚军 | 带电粒子加压器 |
Family Cites Families (31)
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DE2412869C3 (de) | 1974-03-18 | 1980-10-30 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Anzeigevorrichtung mit einem Gasentladungsraum als Elektronenquelle, mit einem Elektronennachbeschleunigungsraum und mit einem Leuchtschirm und Verfahren zum Betrieb dieser Anzeigevorrichtung |
CA1048182A (en) | 1976-10-26 | 1979-02-06 | Her Majesty The Queen, In Right Of Canada, As Represented By The Minister Of National Defence | Laser driven plasma display |
GB2101638B (en) | 1981-07-16 | 1985-07-24 | Ampex | Moveable cathodes/targets for high rate sputtering system |
FR2551615A1 (fr) * | 1983-09-02 | 1985-03-08 | Centre Nat Rech Scient | Source de rayons x mous utilisant un microcanal de plasma obtenu par photo-ionisation d'un gaz |
DE3332711A1 (de) * | 1983-09-10 | 1985-03-28 | Fa. Carl Zeiss, 7920 Heidenheim | Vorrichtung zur erzeugung einer plasmaquelle mit hoher strahlungsintensitaet im roentgenbereich |
JPS6348799A (ja) * | 1986-08-14 | 1988-03-01 | Nippon Telegr & Teleph Corp <Ntt> | X線発生装置 |
JPH06101317B2 (ja) * | 1987-08-28 | 1994-12-12 | 株式会社日立製作所 | X線発生装置 |
US4928296A (en) * | 1988-04-04 | 1990-05-22 | General Electric Company | Apparatus for cooling an X-ray device |
JPH0278199A (ja) * | 1988-09-13 | 1990-03-19 | Toshiba Corp | パルスx線源駆動装置 |
JPH03283398A (ja) * | 1990-03-30 | 1991-12-13 | Shimadzu Corp | X線発生装置 |
JPH04110800A (ja) | 1990-08-31 | 1992-04-13 | Shimadzu Corp | 標的物質の供給装置 |
JPH05190955A (ja) | 1992-01-17 | 1993-07-30 | Toshiba Corp | ガスレーザ装置 |
US5317574A (en) * | 1992-12-31 | 1994-05-31 | Hui Wang | Method and apparatus for generating x-ray and/or extreme ultraviolet laser |
JP2794154B2 (ja) * | 1993-06-04 | 1998-09-03 | ダイヤモンド電機 株式会社 | ヒートシンク |
US5499282A (en) * | 1994-05-02 | 1996-03-12 | University Of Central Florida | Efficient narrow spectral width soft-X-ray discharge sources |
JPH09133485A (ja) * | 1995-11-06 | 1997-05-20 | Mitsubishi Materials Corp | ヒートパイプ |
JPH10185468A (ja) * | 1996-12-20 | 1998-07-14 | Akutoronikusu Kk | 極大面積比の面間熱拡散接続用プレートヒートパイプ |
US6815700B2 (en) * | 1997-05-12 | 2004-11-09 | Cymer, Inc. | Plasma focus light source with improved pulse power system |
JP2000298200A (ja) | 1999-04-13 | 2000-10-24 | Agency Of Ind Science & Technol | レーザー励起型x線源 |
DE19962160C2 (de) | 1999-06-29 | 2003-11-13 | Fraunhofer Ges Forschung | Vorrichtungen zur Erzeugung von Extrem-Ultraviolett- und weicher Röntgenstrahlung aus einer Gasentladung |
JP2001023796A (ja) * | 1999-07-08 | 2001-01-26 | Shimadzu Corp | レーザープラズマx線源 |
JP2001155897A (ja) * | 1999-11-25 | 2001-06-08 | Japan Atom Energy Res Inst | 短パルス硬x線発生装置 |
JP2001160499A (ja) | 1999-12-03 | 2001-06-12 | Japan Atom Energy Res Inst | 金属プラズマ放電型x線発生装置 |
CN1300179A (zh) * | 1999-12-16 | 2001-06-20 | 中国科学院长春光学精密机械研究所 | 喷气靶激光等离子体软x射线源 |
TWI246872B (en) * | 1999-12-17 | 2006-01-01 | Asml Netherlands Bv | Radiation source for use in lithographic projection apparatus |
JP2001221583A (ja) * | 2000-02-03 | 2001-08-17 | Furukawa Electric Co Ltd:The | 冷熱拡散用ヒートパイプおよびその設置方法 |
RU2206186C2 (ru) * | 2000-07-04 | 2003-06-10 | Государственный научный центр Российской Федерации Троицкий институт инновационных и термоядерных исследований | Способ получения коротковолнового излучения из газоразрядной плазмы и устройство для его реализации |
JP5098126B2 (ja) * | 2001-08-07 | 2012-12-12 | 株式会社ニコン | X線発生装置、露光装置、露光方法及びデバイス製造方法 |
US7012989B2 (en) | 2002-09-03 | 2006-03-14 | Parker Medical, Inc. | Multiple grooved x-ray generator |
SG129259A1 (en) * | 2002-10-03 | 2007-02-26 | Asml Netherlands Bv | Radiation source lithographic apparatus, and device manufacturing method |
US7208746B2 (en) * | 2004-07-14 | 2007-04-24 | Asml Netherlands B.V. | Radiation generating device, lithographic apparatus, device manufacturing method and device manufactured thereby |
-
2003
- 2003-09-17 CN CN2010100035055A patent/CN101795527B/zh not_active Expired - Fee Related
- 2003-09-17 TW TW092125623A patent/TWI266962B/zh not_active IP Right Cessation
- 2003-09-17 CN CN03164836A patent/CN100594428C/zh not_active Expired - Lifetime
- 2003-09-17 US US10/664,065 patent/US7528395B2/en not_active Expired - Lifetime
- 2003-09-17 SG SG200701617-3A patent/SG153664A1/en unknown
- 2003-09-17 JP JP2003363845A patent/JP4381094B2/ja not_active Expired - Fee Related
- 2003-09-18 KR KR1020030064886A patent/KR100598639B1/ko not_active IP Right Cessation
-
2007
- 2007-05-01 JP JP2007120962A patent/JP4580959B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100594428C (zh) | 2010-03-17 |
JP4580959B2 (ja) | 2010-11-17 |
KR100598639B1 (ko) | 2006-07-07 |
SG153664A1 (en) | 2009-07-29 |
KR20040025632A (ko) | 2004-03-24 |
US7528395B2 (en) | 2009-05-05 |
JP2004165155A (ja) | 2004-06-10 |
JP2007305992A (ja) | 2007-11-22 |
CN101795527B (zh) | 2013-02-20 |
US20040105082A1 (en) | 2004-06-03 |
CN101795527A (zh) | 2010-08-04 |
CN1497349A (zh) | 2004-05-19 |
TW200413860A (en) | 2004-08-01 |
JP4381094B2 (ja) | 2009-12-09 |
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Legal Events
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MK4A | Expiration of patent term of an invention patent |