TWI264766B - Method for fabricating recessed gate structure - Google Patents
Method for fabricating recessed gate structureInfo
- Publication number
- TWI264766B TWI264766B TW093137119A TW93137119A TWI264766B TW I264766 B TWI264766 B TW I264766B TW 093137119 A TW093137119 A TW 093137119A TW 93137119 A TW93137119 A TW 93137119A TW I264766 B TWI264766 B TW I264766B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- silicon layer
- conductive silicon
- recessed gate
- conductive
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 4
- 229910052710 silicon Inorganic materials 0.000 abstract 4
- 239000010703 silicon Substances 0.000 abstract 4
- 238000005530 etching Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 230000007261 regionalization Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
- H01L29/66621—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation using etching to form a recess at the gate location
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030091113A KR100566303B1 (ko) | 2003-12-15 | 2003-12-15 | 리세스된 게이트 전극 형성 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200520071A TW200520071A (en) | 2005-06-16 |
TWI264766B true TWI264766B (en) | 2006-10-21 |
Family
ID=36584542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093137119A TWI264766B (en) | 2003-12-15 | 2004-12-02 | Method for fabricating recessed gate structure |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060128130A1 (zh) |
JP (1) | JP2005183954A (zh) |
KR (1) | KR100566303B1 (zh) |
CN (1) | CN100555575C (zh) |
TW (1) | TWI264766B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100668851B1 (ko) | 2005-06-30 | 2007-01-16 | 주식회사 하이닉스반도체 | 모스펫 소자 제조방법 |
KR100625795B1 (ko) | 2005-08-25 | 2006-09-18 | 주식회사 하이닉스반도체 | 반도체 소자의 게이트 및 그 형성방법 |
JP4773169B2 (ja) * | 2005-09-14 | 2011-09-14 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
US7435673B2 (en) * | 2005-09-28 | 2008-10-14 | Samsung Electronics Co., Ltd. | Methods of forming integrated circuit devices having metal interconnect structures therein |
KR100697292B1 (ko) * | 2005-10-04 | 2007-03-20 | 삼성전자주식회사 | 반도체 장치 및 그 형성 방법 |
KR100689840B1 (ko) * | 2005-10-04 | 2007-03-08 | 삼성전자주식회사 | 리세스된 게이트 전극을 갖는 반도체소자 및 그의 제조방법 |
KR100673109B1 (ko) * | 2005-11-17 | 2007-01-22 | 주식회사 하이닉스반도체 | 반도체소자의 리세스 게이트 형성방법 |
KR100702132B1 (ko) * | 2005-12-22 | 2007-03-30 | 주식회사 하이닉스반도체 | 화학기계적연마를 이용한 리세스 게이트 형성 방법 |
KR100869359B1 (ko) | 2006-09-28 | 2008-11-19 | 주식회사 하이닉스반도체 | 반도체 소자의 리세스 게이트 제조 방법 |
KR100780629B1 (ko) * | 2006-11-15 | 2007-11-30 | 주식회사 하이닉스반도체 | 리세스 게이트를 갖는 반도체 소자의 제조 방법 |
KR100825796B1 (ko) | 2006-12-14 | 2008-04-28 | 삼성전자주식회사 | 매몰 게이트를 구비한 반도체 소자의 제조 방법 |
KR101128886B1 (ko) * | 2009-03-11 | 2012-03-26 | 주식회사 하이닉스반도체 | 반도체 소자의 게이트 및 그 형성방법 |
KR101886382B1 (ko) * | 2011-12-14 | 2018-08-09 | 삼성전자주식회사 | 정보 저장 소자 및 그 제조 방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6855593B2 (en) * | 2002-07-11 | 2005-02-15 | International Rectifier Corporation | Trench Schottky barrier diode |
KR100498476B1 (ko) * | 2003-01-11 | 2005-07-01 | 삼성전자주식회사 | 리세스 채널 mosfet 및 그 제조방법 |
KR100471001B1 (ko) * | 2003-07-02 | 2005-03-14 | 삼성전자주식회사 | 리세스형 트랜지스터 및 그의 제조방법 |
-
2003
- 2003-12-15 KR KR1020030091113A patent/KR100566303B1/ko not_active IP Right Cessation
-
2004
- 2004-12-02 US US11/003,755 patent/US20060128130A1/en not_active Abandoned
- 2004-12-02 TW TW093137119A patent/TWI264766B/zh not_active IP Right Cessation
- 2004-12-09 JP JP2004356520A patent/JP2005183954A/ja active Pending
- 2004-12-15 CN CNB2004101012036A patent/CN100555575C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100555575C (zh) | 2009-10-28 |
TW200520071A (en) | 2005-06-16 |
US20060128130A1 (en) | 2006-06-15 |
KR100566303B1 (ko) | 2006-03-30 |
KR20050059488A (ko) | 2005-06-21 |
CN1630040A (zh) | 2005-06-22 |
JP2005183954A (ja) | 2005-07-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |