TWI255790B - Handler for testing semiconductor device - Google Patents
Handler for testing semiconductor deviceInfo
- Publication number
- TWI255790B TWI255790B TW093101230A TW93101230A TWI255790B TW I255790 B TWI255790 B TW I255790B TW 093101230 A TW093101230 A TW 093101230A TW 93101230 A TW93101230 A TW 93101230A TW I255790 B TWI255790 B TW I255790B
- Authority
- TW
- Taiwan
- Prior art keywords
- unit
- devices
- carrier unit
- contact
- low temperature
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030027100A KR100542126B1 (ko) | 2003-04-29 | 2003-04-29 | 반도체 소자 테스트 핸들러 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200422242A TW200422242A (en) | 2004-11-01 |
TWI255790B true TWI255790B (en) | 2006-06-01 |
Family
ID=36205646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093101230A TWI255790B (en) | 2003-04-29 | 2004-01-16 | Handler for testing semiconductor device |
Country Status (5)
Country | Link |
---|---|
US (2) | US6972557B2 (zh) |
KR (1) | KR100542126B1 (zh) |
CN (1) | CN100341131C (zh) |
DE (1) | DE102004002707B4 (zh) |
TW (1) | TWI255790B (zh) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7360044B2 (en) * | 2004-07-20 | 2008-04-15 | Hewlett-Packard Development Company, L.P. | Storage system with primary mirror shadow |
US7101817B2 (en) * | 2004-11-05 | 2006-09-05 | International Business Machines Corporation | System and method for determining line widths of free-standing structures resulting from a semiconductor manufacturing process |
DE102006015365B4 (de) * | 2006-04-03 | 2009-11-19 | Multitest Elektronische Systeme Gmbh | Verfahren und Vorrichtung zum Temperieren von elektronischen Bauelementen |
US7498831B2 (en) * | 2006-04-05 | 2009-03-03 | Raytheon Company | Conduction-cooled accelerated test fixture |
DE102006038457B4 (de) * | 2006-08-16 | 2014-05-22 | Cascade Microtech, Inc. | Verfahren und Vorrichtung zum Temperieren elektronischer Bauelemente |
KR101324208B1 (ko) * | 2007-02-23 | 2013-11-06 | 주성엔지니어링(주) | 기판 처리 장치 |
KR20090062384A (ko) * | 2007-12-13 | 2009-06-17 | 삼성전자주식회사 | 테스트 장치 |
US20090195264A1 (en) * | 2008-02-04 | 2009-08-06 | Universal Scientific Industrial Co., Ltd. | High temperature test system |
KR20100055236A (ko) * | 2008-11-17 | 2010-05-26 | 삼성전자주식회사 | 반도체 소자 테스트 장치 및 이를 사용한 반도체 소자 테스트 방법 |
KR101556710B1 (ko) * | 2010-11-24 | 2015-09-30 | (주)테크윙 | 테스트핸들러 |
KR101559421B1 (ko) * | 2011-02-21 | 2015-10-13 | (주)테크윙 | 테스트핸들러 |
SI24004A (sl) | 2012-02-17 | 2013-08-30 | Univerza V Ljubljani Fakulteta Za Elektrotehniko | Postopek in naprava za testiranje in uravnavanje temperaturnega koeficienta integriranih vezij |
KR101936348B1 (ko) | 2012-09-17 | 2019-01-08 | 삼성전자주식회사 | 급속 온도 변환이 가능한 테스트 핸들러 및 그를 이용한 반도체 소자의 테스트 방법 |
KR102065601B1 (ko) * | 2013-04-30 | 2020-01-13 | 세메스 주식회사 | 테스트 핸들러의 접속 장치 및 방법 |
TWI534437B (zh) * | 2013-10-08 | 2016-05-21 | Chroma Ate Inc | Electronic device testing equipment for integrated high and low temperature test and its detection method |
JP6536096B2 (ja) * | 2015-03-16 | 2019-07-03 | セイコーエプソン株式会社 | 電子部品搬送装置、電子部品検査装置および結露あるいは着霜の検査方法 |
CN106290991A (zh) * | 2015-06-10 | 2017-01-04 | 鸿劲科技股份有限公司 | 电子元件测试设备 |
NO341784B1 (en) * | 2016-04-13 | 2018-01-22 | Adigo As | Valve nozzle and valve nozzle assembly |
US10126352B1 (en) * | 2016-07-06 | 2018-11-13 | Ambarella, Inc. | Method for enhancing stability, robustness and throughput of semiconductor device test machines in low temperature conditions |
KR101878322B1 (ko) * | 2017-03-29 | 2018-07-13 | 주식회사 유니세트 | 반도체 메모리 모듈 고온 테스트 장치 |
CN109709463A (zh) * | 2017-10-25 | 2019-05-03 | 泰克元有限公司 | 机械手 |
TW202043787A (zh) | 2018-07-10 | 2020-12-01 | 美商塞雷特有限責任公司 | 用於長熱煉時間測試期間之連續測試器操作的方法 |
JP6719784B2 (ja) | 2018-12-21 | 2020-07-08 | 株式会社 Synax | ハンドラ |
JP6770758B2 (ja) * | 2019-01-15 | 2020-10-21 | 株式会社 Synax | コンタクタおよびハンドラ |
CN110133469A (zh) * | 2019-05-31 | 2019-08-16 | 德淮半导体有限公司 | 半导体测试设备及其工作方法 |
CN110118909A (zh) * | 2019-06-11 | 2019-08-13 | 北京清大天达光电科技股份有限公司 | 一种快速切换温度和压力的测试装置 |
US11573266B2 (en) * | 2019-12-30 | 2023-02-07 | Texas Instruments Incorporated | Electronic device temperature test on strip film frames |
CN111289877B (zh) * | 2020-03-03 | 2022-07-19 | 武汉精鸿电子技术有限公司 | 一种老化测试设备 |
KR20210128739A (ko) | 2020-04-17 | 2021-10-27 | 삼성전자주식회사 | 반도체 소자 검사장치 및 이를 구비하는 자동 검사장비 |
KR102324030B1 (ko) * | 2020-05-06 | 2021-11-09 | 주식회사 유니세트 | 반도체 메모리 모듈 고온 테스트 장치 |
KR20220009667A (ko) | 2020-07-16 | 2022-01-25 | 삼성전자주식회사 | 로봇이 구비된 반도체 모듈 검사장치 |
TWI779650B (zh) * | 2021-06-08 | 2022-10-01 | 南亞科技股份有限公司 | 測試分類機及其操作方法 |
CN113433359B (zh) * | 2021-08-25 | 2021-11-26 | 邳州众鑫机械有限公司 | 一种半导体低温电学性能测试夹紧工装及方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5515910A (en) * | 1993-05-03 | 1996-05-14 | Micro Control System | Apparatus for burn-in of high power semiconductor devices |
JP2586999B2 (ja) * | 1994-03-25 | 1997-03-05 | 株式会社超伝導センサ研究所 | デバイス温度サイクル試験装置 |
JPH08304509A (ja) * | 1995-04-28 | 1996-11-22 | Advantest Corp | 半導体試験装置 |
JP3412114B2 (ja) * | 1995-07-26 | 2003-06-03 | 株式会社アドバンテスト | Ic試験装置 |
JP2898586B2 (ja) | 1995-09-25 | 1999-06-02 | 大和ハウス工業株式会社 | 鋼管柱・柱梁接合構造およびその鋼管柱の製造方法 |
JPH09120937A (ja) | 1995-10-24 | 1997-05-06 | Elna Co Ltd | アルミニウム電解コンデンサおよびその駆動用電解液 |
US6249132B1 (en) * | 1997-02-12 | 2001-06-19 | Tokyo Electron Limited | Inspection methods and apparatuses |
TW389950B (en) | 1997-04-07 | 2000-05-11 | Komatsu Mfg Co Ltd | Temperature control device |
NL1005780C2 (nl) | 1997-04-09 | 1998-10-12 | Fico Bv | Werkwijze en afdekelement voor het omhullen van electronische componenten. |
US6091062A (en) * | 1998-01-27 | 2000-07-18 | Kinetrix, Inc. | Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly |
TW533316B (en) | 1998-12-08 | 2003-05-21 | Advantest Corp | Testing device for electronic device |
JP4202498B2 (ja) * | 1998-12-15 | 2008-12-24 | 株式会社アドバンテスト | 部品ハンドリング装置 |
JP3698596B2 (ja) | 1999-08-12 | 2005-09-21 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
JP3334689B2 (ja) * | 1999-08-16 | 2002-10-15 | 日本電気株式会社 | 半導体装置測定用ソケット及びそれを用いた測定方法 |
US6205799B1 (en) * | 1999-09-13 | 2001-03-27 | Hewlett-Packard Company | Spray cooling system |
JP4789125B2 (ja) * | 2000-12-07 | 2011-10-12 | 株式会社アドバンテスト | 電子部品試験用ソケットおよびこれを用いた電子部品試験装置 |
DE10144705B4 (de) * | 2001-09-11 | 2007-05-10 | Infineon Technologies Ag | Vorrichtung zum Einstellen der Temperatur von Halbleiterbausteinen auf Testsystemen |
US6857283B2 (en) * | 2002-09-13 | 2005-02-22 | Isothermal Systems Research, Inc. | Semiconductor burn-in thermal management system |
-
2003
- 2003-04-29 KR KR1020030027100A patent/KR100542126B1/ko active IP Right Grant
-
2004
- 2004-01-09 US US10/753,553 patent/US6972557B2/en not_active Expired - Fee Related
- 2004-01-16 TW TW093101230A patent/TWI255790B/zh not_active IP Right Cessation
- 2004-01-19 DE DE102004002707A patent/DE102004002707B4/de not_active Expired - Fee Related
- 2004-01-19 CN CNB2004100393435A patent/CN100341131C/zh not_active Expired - Fee Related
-
2005
- 2005-11-04 US US11/266,192 patent/US7242207B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100341131C (zh) | 2007-10-03 |
US7242207B2 (en) | 2007-07-10 |
DE102004002707B4 (de) | 2009-08-27 |
DE102004002707A1 (de) | 2004-11-18 |
KR100542126B1 (ko) | 2006-01-11 |
CN1542938A (zh) | 2004-11-03 |
KR20040092785A (ko) | 2004-11-04 |
US20040216536A1 (en) | 2004-11-04 |
TW200422242A (en) | 2004-11-01 |
US20060087312A1 (en) | 2006-04-27 |
US6972557B2 (en) | 2005-12-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |