TWI255790B - Handler for testing semiconductor device - Google Patents

Handler for testing semiconductor device

Info

Publication number
TWI255790B
TWI255790B TW093101230A TW93101230A TWI255790B TW I255790 B TWI255790 B TW I255790B TW 093101230 A TW093101230 A TW 093101230A TW 93101230 A TW93101230 A TW 93101230A TW I255790 B TWI255790 B TW I255790B
Authority
TW
Taiwan
Prior art keywords
unit
devices
carrier unit
contact
low temperature
Prior art date
Application number
TW093101230A
Other languages
English (en)
Other versions
TW200422242A (en
Inventor
Chan-Ho Park
Original Assignee
Mirae Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mirae Corp filed Critical Mirae Corp
Publication of TW200422242A publication Critical patent/TW200422242A/zh
Application granted granted Critical
Publication of TWI255790B publication Critical patent/TWI255790B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
TW093101230A 2003-04-29 2004-01-16 Handler for testing semiconductor device TWI255790B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030027100A KR100542126B1 (ko) 2003-04-29 2003-04-29 반도체 소자 테스트 핸들러

Publications (2)

Publication Number Publication Date
TW200422242A TW200422242A (en) 2004-11-01
TWI255790B true TWI255790B (en) 2006-06-01

Family

ID=36205646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093101230A TWI255790B (en) 2003-04-29 2004-01-16 Handler for testing semiconductor device

Country Status (5)

Country Link
US (2) US6972557B2 (zh)
KR (1) KR100542126B1 (zh)
CN (1) CN100341131C (zh)
DE (1) DE102004002707B4 (zh)
TW (1) TWI255790B (zh)

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US7360044B2 (en) * 2004-07-20 2008-04-15 Hewlett-Packard Development Company, L.P. Storage system with primary mirror shadow
US7101817B2 (en) * 2004-11-05 2006-09-05 International Business Machines Corporation System and method for determining line widths of free-standing structures resulting from a semiconductor manufacturing process
DE102006015365B4 (de) * 2006-04-03 2009-11-19 Multitest Elektronische Systeme Gmbh Verfahren und Vorrichtung zum Temperieren von elektronischen Bauelementen
US7498831B2 (en) * 2006-04-05 2009-03-03 Raytheon Company Conduction-cooled accelerated test fixture
DE102006038457B4 (de) * 2006-08-16 2014-05-22 Cascade Microtech, Inc. Verfahren und Vorrichtung zum Temperieren elektronischer Bauelemente
KR101324208B1 (ko) * 2007-02-23 2013-11-06 주성엔지니어링(주) 기판 처리 장치
KR20090062384A (ko) * 2007-12-13 2009-06-17 삼성전자주식회사 테스트 장치
US20090195264A1 (en) * 2008-02-04 2009-08-06 Universal Scientific Industrial Co., Ltd. High temperature test system
KR20100055236A (ko) * 2008-11-17 2010-05-26 삼성전자주식회사 반도체 소자 테스트 장치 및 이를 사용한 반도체 소자 테스트 방법
KR101556710B1 (ko) * 2010-11-24 2015-09-30 (주)테크윙 테스트핸들러
KR101559421B1 (ko) * 2011-02-21 2015-10-13 (주)테크윙 테스트핸들러
SI24004A (sl) 2012-02-17 2013-08-30 Univerza V Ljubljani Fakulteta Za Elektrotehniko Postopek in naprava za testiranje in uravnavanje temperaturnega koeficienta integriranih vezij
KR101936348B1 (ko) 2012-09-17 2019-01-08 삼성전자주식회사 급속 온도 변환이 가능한 테스트 핸들러 및 그를 이용한 반도체 소자의 테스트 방법
KR102065601B1 (ko) * 2013-04-30 2020-01-13 세메스 주식회사 테스트 핸들러의 접속 장치 및 방법
TWI534437B (zh) * 2013-10-08 2016-05-21 Chroma Ate Inc Electronic device testing equipment for integrated high and low temperature test and its detection method
JP6536096B2 (ja) * 2015-03-16 2019-07-03 セイコーエプソン株式会社 電子部品搬送装置、電子部品検査装置および結露あるいは着霜の検査方法
CN106290991A (zh) * 2015-06-10 2017-01-04 鸿劲科技股份有限公司 电子元件测试设备
NO341784B1 (en) * 2016-04-13 2018-01-22 Adigo As Valve nozzle and valve nozzle assembly
US10126352B1 (en) * 2016-07-06 2018-11-13 Ambarella, Inc. Method for enhancing stability, robustness and throughput of semiconductor device test machines in low temperature conditions
KR101878322B1 (ko) * 2017-03-29 2018-07-13 주식회사 유니세트 반도체 메모리 모듈 고온 테스트 장치
CN109709463A (zh) * 2017-10-25 2019-05-03 泰克元有限公司 机械手
TW202043787A (zh) 2018-07-10 2020-12-01 美商塞雷特有限責任公司 用於長熱煉時間測試期間之連續測試器操作的方法
JP6719784B2 (ja) 2018-12-21 2020-07-08 株式会社 Ｓｙｎａｘ ハンドラ
JP6770758B2 (ja) * 2019-01-15 2020-10-21 株式会社 Ｓｙｎａｘ コンタクタおよびハンドラ
CN110133469A (zh) * 2019-05-31 2019-08-16 德淮半导体有限公司 半导体测试设备及其工作方法
CN110118909A (zh) * 2019-06-11 2019-08-13 北京清大天达光电科技股份有限公司 一种快速切换温度和压力的测试装置
US11573266B2 (en) * 2019-12-30 2023-02-07 Texas Instruments Incorporated Electronic device temperature test on strip film frames
CN111289877B (zh) * 2020-03-03 2022-07-19 武汉精鸿电子技术有限公司 一种老化测试设备
KR20210128739A (ko) 2020-04-17 2021-10-27 삼성전자주식회사 반도체 소자 검사장치 및 이를 구비하는 자동 검사장비
KR102324030B1 (ko) * 2020-05-06 2021-11-09 주식회사 유니세트 반도체 메모리 모듈 고온 테스트 장치
KR20220009667A (ko) 2020-07-16 2022-01-25 삼성전자주식회사 로봇이 구비된 반도체 모듈 검사장치
TWI779650B (zh) * 2021-06-08 2022-10-01 南亞科技股份有限公司 測試分類機及其操作方法
CN113433359B (zh) * 2021-08-25 2021-11-26 邳州众鑫机械有限公司 一种半导体低温电学性能测试夹紧工装及方法

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US5515910A (en) * 1993-05-03 1996-05-14 Micro Control System Apparatus for burn-in of high power semiconductor devices
JP2586999B2 (ja) * 1994-03-25 1997-03-05 株式会社超伝導センサ研究所 デバイス温度サイクル試験装置
JPH08304509A (ja) * 1995-04-28 1996-11-22 Advantest Corp 半導体試験装置
JP3412114B2 (ja) * 1995-07-26 2003-06-03 株式会社アドバンテスト Ｉｃ試験装置
JP2898586B2 (ja) 1995-09-25 1999-06-02 大和ハウス工業株式会社 鋼管柱・柱梁接合構造およびその鋼管柱の製造方法
JPH09120937A (ja) 1995-10-24 1997-05-06 Elna Co Ltd アルミニウム電解コンデンサおよびその駆動用電解液
US6249132B1 (en) * 1997-02-12 2001-06-19 Tokyo Electron Limited Inspection methods and apparatuses
TW389950B (en) 1997-04-07 2000-05-11 Komatsu Mfg Co Ltd Temperature control device
NL1005780C2 (nl) 1997-04-09 1998-10-12 Fico Bv Werkwijze en afdekelement voor het omhullen van electronische componenten.
US6091062A (en) * 1998-01-27 2000-07-18 Kinetrix, Inc. Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly
TW533316B (en) 1998-12-08 2003-05-21 Advantest Corp Testing device for electronic device
JP4202498B2 (ja) * 1998-12-15 2008-12-24 株式会社アドバンテスト 部品ハンドリング装置
JP3698596B2 (ja) 1999-08-12 2005-09-21 株式会社荏原製作所 めっき装置及びめっき方法
JP3334689B2 (ja) * 1999-08-16 2002-10-15 日本電気株式会社 半導体装置測定用ソケット及びそれを用いた測定方法
US6205799B1 (en) * 1999-09-13 2001-03-27 Hewlett-Packard Company Spray cooling system
JP4789125B2 (ja) * 2000-12-07 2011-10-12 株式会社アドバンテスト 電子部品試験用ソケットおよびこれを用いた電子部品試験装置
DE10144705B4 (de) * 2001-09-11 2007-05-10 Infineon Technologies Ag Vorrichtung zum Einstellen der Temperatur von Halbleiterbausteinen auf Testsystemen
US6857283B2 (en) * 2002-09-13 2005-02-22 Isothermal Systems Research, Inc. Semiconductor burn-in thermal management system

Also Published As

Publication number Publication date
CN100341131C (zh) 2007-10-03
US7242207B2 (en) 2007-07-10
DE102004002707B4 (de) 2009-08-27
DE102004002707A1 (de) 2004-11-18
KR100542126B1 (ko) 2006-01-11
CN1542938A (zh) 2004-11-03
KR20040092785A (ko) 2004-11-04
US20040216536A1 (en) 2004-11-04
TW200422242A (en) 2004-11-01
US20060087312A1 (en) 2006-04-27
US6972557B2 (en) 2005-12-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees