TWI248562B - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method Download PDF

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Publication number
TWI248562B
TWI248562B TW093137213A TW93137213A TWI248562B TW I248562 B TWI248562 B TW I248562B TW 093137213 A TW093137213 A TW 093137213A TW 93137213 A TW93137213 A TW 93137213A TW I248562 B TWI248562 B TW I248562B
Authority
TW
Taiwan
Prior art keywords
article
filling gas
substrate
pressure
support
Prior art date
Application number
TW093137213A
Other languages
English (en)
Chinese (zh)
Other versions
TW200523686A (en
Inventor
Joost Jeroen Ottens
Hendrik Antony Johanne Neerhof
Koen Jacobus Maria Johann Zaal
Kluse Marco Le
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW200523686A publication Critical patent/TW200523686A/zh
Application granted granted Critical
Publication of TWI248562B publication Critical patent/TWI248562B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Public Health (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW093137213A 2003-12-15 2004-12-02 Lithographic apparatus and device manufacturing method TWI248562B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/734,641 US6897945B1 (en) 2003-12-15 2003-12-15 Lithographic apparatus and device manufacturing method

Publications (2)

Publication Number Publication Date
TW200523686A TW200523686A (en) 2005-07-16
TWI248562B true TWI248562B (en) 2006-02-01

Family

ID=34552774

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093137213A TWI248562B (en) 2003-12-15 2004-12-02 Lithographic apparatus and device manufacturing method

Country Status (7)

Country Link
US (2) US6897945B1 (enExample)
EP (1) EP1548502A1 (enExample)
JP (2) JP4477480B2 (enExample)
KR (1) KR100644419B1 (enExample)
CN (2) CN102645852A (enExample)
SG (1) SG112968A1 (enExample)
TW (1) TWI248562B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407498B (zh) * 2008-09-30 2013-09-01 Mitsubishi Heavy Ind Ltd 晶圓接合裝置及晶圓接合方法

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JP2004351527A (ja) * 2003-05-27 2004-12-16 Koganei Corp 吸着検出方法および吸着検出装置
EP2267535A1 (en) * 2003-11-05 2010-12-29 ASML Netherlands BV Lithographic apparatus and device manufacturing method
US6897945B1 (en) * 2003-12-15 2005-05-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050223973A1 (en) * 2004-03-30 2005-10-13 Infineon Technologies Ag EUV lithography system and chuck for releasing reticle in a vacuum isolated environment
KR101378688B1 (ko) 2004-06-21 2014-03-27 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7196775B2 (en) * 2004-08-23 2007-03-27 Asml Holding N.V. Patterned mask holding device and method using two holding systems
US7041989B1 (en) 2004-10-22 2006-05-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7649611B2 (en) * 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20090006064A (ko) * 2006-04-05 2009-01-14 가부시키가이샤 니콘 스테이지 장치, 노광 장치, 스테이지 제어 방법, 노광 방법및 디바이스 제조 방법
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US7508494B2 (en) * 2006-12-22 2009-03-24 Asml Netherlands B.V. Lithographic apparatus and a subtrate table for exciting a shockwave in a substrate
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FR2912375B1 (fr) * 2007-02-14 2009-12-18 Eurocopter France Verin electrique de commande de vol pour aeronef
TWI541615B (zh) 2007-07-13 2016-07-11 瑪波微影Ｉｐ公司 在微影裝置中交換晶圓的方法
US8705010B2 (en) * 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI337154B (en) * 2008-04-17 2011-02-11 Gudeng Prec Industral Co Ltd Gas filling apparatus and gas filling port thereof
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
JP5470601B2 (ja) * 2009-03-02 2014-04-16 新光電気工業株式会社 静電チャック
SG176059A1 (en) 2009-05-15 2011-12-29 Entegris Inc Electrostatic chuck with polymer protrusions
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
WO2011149918A2 (en) 2010-05-28 2011-12-01 Entegris, Inc. High surface resistivity electrostatic chuck
JP5960154B2 (ja) * 2010-12-08 2016-08-02 エーエスエムエル ホールディング エヌ．ブイ． 静電クランプ、リソグラフィ装置、および静電クランプの製造方法
NL2009689A (en) * 2011-12-01 2013-06-05 Asml Netherlands Bv Support, lithographic apparatus and device manufacturing method.
NL2009858A (en) 2011-12-27 2013-07-01 Asml Netherlands Bv Substrate holder, lithographic apparatus, and device manufacturing method.
CN103576464B (zh) * 2012-07-20 2016-03-09 上海微电子装备有限公司 一种推顶机构及具有该推顶机构的光刻装置
JP2014086701A (ja) * 2012-10-26 2014-05-12 Canon Inc 保持装置、リソグラフィ装置及び物品の製造方法
NL2011592A (en) 2012-10-31 2014-05-06 Asml Netherlands Bv Compensation for patterning device deformation.
CN108780773B (zh) * 2016-02-10 2022-10-21 恩特格里斯公司 具有改善粒子性能的晶片接触表面突部轮廓
CN107272351A (zh) * 2017-07-28 2017-10-20 武汉华星光电技术有限公司 承载装置及具有该承载装置的曝光设备
JP7104531B2 (ja) * 2018-03-19 2022-07-21 キヤノン株式会社 基板保持装置および基板処理装置
EP3575873A1 (en) 2018-05-28 2019-12-04 ASML Netherlands B.V. Particle beam apparatus
EP3921701A1 (en) * 2019-02-08 2021-12-15 ASML Netherlands B.V. Component for use in a lithographic apparatus, method of protecting a component and method of protecting tables in a lithographic apparatus
EP3832391A1 (en) * 2019-12-03 2021-06-09 ASML Netherlands B.V. Clamp assembly

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407498B (zh) * 2008-09-30 2013-09-01 Mitsubishi Heavy Ind Ltd 晶圓接合裝置及晶圓接合方法
US9130000B2 (en) 2008-09-30 2015-09-08 Mitsubishi Heavy Industries Wafer bonding device and wafer bonding method

Also Published As

Publication number Publication date
US7187433B2 (en) 2007-03-06
CN102645852A (zh) 2012-08-22
EP1548502A1 (en) 2005-06-29
TW200523686A (en) 2005-07-16
JP2010109390A (ja) 2010-05-13
JP5118711B2 (ja) 2013-01-16
US20050174555A1 (en) 2005-08-11
KR100644419B1 (ko) 2006-11-10
JP4477480B2 (ja) 2010-06-09
US20050128463A1 (en) 2005-06-16
KR20050060006A (ko) 2005-06-21
SG112968A1 (en) 2005-07-28
JP2005183959A (ja) 2005-07-07
CN1629733A (zh) 2005-06-22
US6897945B1 (en) 2005-05-24

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