CN102645852A - 光刻装置及器件制造方法 - Google Patents

光刻装置及器件制造方法 Download PDF

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Publication number
CN102645852A
CN102645852A CN2012101209250A CN201210120925A CN102645852A CN 102645852 A CN102645852 A CN 102645852A CN 2012101209250 A CN2012101209250 A CN 2012101209250A CN 201210120925 A CN201210120925 A CN 201210120925A CN 102645852 A CN102645852 A CN 102645852A
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CN
China
Prior art keywords
article
supports
articles
substrate
backfill gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101209250A
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English (en)
Chinese (zh)
Inventor
J·J·奥坦斯
H·A·J·尼尔霍夫
K·J·J·M·扎亚尔
M·勒克鲁塞
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ASML Netherlands BV
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ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of CN102645852A publication Critical patent/CN102645852A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2012101209250A 2003-12-15 2004-12-14 光刻装置及器件制造方法 Pending CN102645852A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/734,641 US6897945B1 (en) 2003-12-15 2003-12-15 Lithographic apparatus and device manufacturing method
US10/734,641 2003-12-15

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNA2004101007964A Division CN1629733A (zh) 2003-12-15 2004-12-14 光刻装置及器件制造方法

Publications (1)

Publication Number Publication Date
CN102645852A true CN102645852A (zh) 2012-08-22

Family

ID=34552774

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2012101209250A Pending CN102645852A (zh) 2003-12-15 2004-12-14 光刻装置及器件制造方法
CNA2004101007964A Pending CN1629733A (zh) 2003-12-15 2004-12-14 光刻装置及器件制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNA2004101007964A Pending CN1629733A (zh) 2003-12-15 2004-12-14 光刻装置及器件制造方法

Country Status (7)

Country Link
US (2) US6897945B1 (enExample)
EP (1) EP1548502A1 (enExample)
JP (2) JP4477480B2 (enExample)
KR (1) KR100644419B1 (enExample)
CN (2) CN102645852A (enExample)
SG (1) SG112968A1 (enExample)
TW (1) TWI248562B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112166383A (zh) * 2018-05-28 2021-01-01 Asml荷兰有限公司 粒子束设备

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US6897945B1 (en) * 2003-12-15 2005-05-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050223973A1 (en) * 2004-03-30 2005-10-13 Infineon Technologies Ag EUV lithography system and chuck for releasing reticle in a vacuum isolated environment
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US7196775B2 (en) * 2004-08-23 2007-03-27 Asml Holding N.V. Patterned mask holding device and method using two holding systems
US7041989B1 (en) 2004-10-22 2006-05-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7649611B2 (en) * 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20090006064A (ko) * 2006-04-05 2009-01-14 가부시키가이샤 니콘 스테이지 장치, 노광 장치, 스테이지 제어 방법, 노광 방법및 디바이스 제조 방법
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US20070292245A1 (en) * 2006-05-25 2007-12-20 Nikon Corporation Stage assembly with secure device holder
US7508494B2 (en) * 2006-12-22 2009-03-24 Asml Netherlands B.V. Lithographic apparatus and a subtrate table for exciting a shockwave in a substrate
US20080180873A1 (en) * 2007-01-31 2008-07-31 Applied Materials, Inc. Securing a substrate to an electrostatic chuck
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TWI541615B (zh) 2007-07-13 2016-07-11 瑪波微影Ｉｐ公司 在微影裝置中交換晶圓的方法
US8705010B2 (en) * 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI337154B (en) * 2008-04-17 2011-02-11 Gudeng Prec Industral Co Ltd Gas filling apparatus and gas filling port thereof
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
JP4786693B2 (ja) * 2008-09-30 2011-10-05 三菱重工業株式会社 ウェハ接合装置およびウェハ接合方法
JP5470601B2 (ja) * 2009-03-02 2014-04-16 新光電気工業株式会社 静電チャック
SG176059A1 (en) 2009-05-15 2011-12-29 Entegris Inc Electrostatic chuck with polymer protrusions
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
WO2011149918A2 (en) 2010-05-28 2011-12-01 Entegris, Inc. High surface resistivity electrostatic chuck
JP5960154B2 (ja) * 2010-12-08 2016-08-02 エーエスエムエル ホールディング エヌ．ブイ． 静電クランプ、リソグラフィ装置、および静電クランプの製造方法
NL2009689A (en) * 2011-12-01 2013-06-05 Asml Netherlands Bv Support, lithographic apparatus and device manufacturing method.
NL2009858A (en) 2011-12-27 2013-07-01 Asml Netherlands Bv Substrate holder, lithographic apparatus, and device manufacturing method.
CN103576464B (zh) * 2012-07-20 2016-03-09 上海微电子装备有限公司 一种推顶机构及具有该推顶机构的光刻装置
JP2014086701A (ja) * 2012-10-26 2014-05-12 Canon Inc 保持装置、リソグラフィ装置及び物品の製造方法
NL2011592A (en) 2012-10-31 2014-05-06 Asml Netherlands Bv Compensation for patterning device deformation.
CN108780773B (zh) * 2016-02-10 2022-10-21 恩特格里斯公司 具有改善粒子性能的晶片接触表面突部轮廓
CN107272351A (zh) * 2017-07-28 2017-10-20 武汉华星光电技术有限公司 承载装置及具有该承载装置的曝光设备
JP7104531B2 (ja) * 2018-03-19 2022-07-21 キヤノン株式会社 基板保持装置および基板処理装置
EP3921701A1 (en) * 2019-02-08 2021-12-15 ASML Netherlands B.V. Component for use in a lithographic apparatus, method of protecting a component and method of protecting tables in a lithographic apparatus
EP3832391A1 (en) * 2019-12-03 2021-06-09 ASML Netherlands B.V. Clamp assembly

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JPS60235423A (ja) * 1984-05-08 1985-11-22 Mitsubishi Electric Corp 半導体製造装置
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US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112166383A (zh) * 2018-05-28 2021-01-01 Asml荷兰有限公司 粒子束设备

Also Published As

Publication number Publication date
US7187433B2 (en) 2007-03-06
EP1548502A1 (en) 2005-06-29
TW200523686A (en) 2005-07-16
TWI248562B (en) 2006-02-01
JP2010109390A (ja) 2010-05-13
JP5118711B2 (ja) 2013-01-16
US20050174555A1 (en) 2005-08-11
KR100644419B1 (ko) 2006-11-10
JP4477480B2 (ja) 2010-06-09
US20050128463A1 (en) 2005-06-16
KR20050060006A (ko) 2005-06-21
SG112968A1 (en) 2005-07-28
JP2005183959A (ja) 2005-07-07
CN1629733A (zh) 2005-06-22
US6897945B1 (en) 2005-05-24

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Application publication date: 20120822