SG112968A1 - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method

Info

Publication number
SG112968A1
SG112968A1 SG200407386A SG200407386A SG112968A1 SG 112968 A1 SG112968 A1 SG 112968A1 SG 200407386 A SG200407386 A SG 200407386A SG 200407386 A SG200407386 A SG 200407386A SG 112968 A1 SG112968 A1 SG 112968A1
Authority
SG
Singapore
Prior art keywords
device manufacturing
lithographic apparatus
lithographic
manufacturing
Prior art date
Application number
SG200407386A
Other languages
English (en)
Inventor
Joost Jeroen Ottens
Hendrik Antony Johanne Neerhof
Koen Jacobus Johannes Mar Zaal
Kluse Marco Le
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG112968A1 publication Critical patent/SG112968A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Public Health (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200407386A 2003-12-15 2004-11-18 Lithographic apparatus and device manufacturing method SG112968A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/734,641 US6897945B1 (en) 2003-12-15 2003-12-15 Lithographic apparatus and device manufacturing method

Publications (1)

Publication Number Publication Date
SG112968A1 true SG112968A1 (en) 2005-07-28

Family

ID=34552774

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200407386A SG112968A1 (en) 2003-12-15 2004-11-18 Lithographic apparatus and device manufacturing method

Country Status (7)

Country Link
US (2) US6897945B1 (enExample)
EP (1) EP1548502A1 (enExample)
JP (2) JP4477480B2 (enExample)
KR (1) KR100644419B1 (enExample)
CN (2) CN102645852A (enExample)
SG (1) SG112968A1 (enExample)
TW (1) TWI248562B (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004351527A (ja) * 2003-05-27 2004-12-16 Koganei Corp 吸着検出方法および吸着検出装置
EP2267535A1 (en) * 2003-11-05 2010-12-29 ASML Netherlands BV Lithographic apparatus and device manufacturing method
US6897945B1 (en) * 2003-12-15 2005-05-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050223973A1 (en) * 2004-03-30 2005-10-13 Infineon Technologies Ag EUV lithography system and chuck for releasing reticle in a vacuum isolated environment
KR101378688B1 (ko) 2004-06-21 2014-03-27 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7196775B2 (en) * 2004-08-23 2007-03-27 Asml Holding N.V. Patterned mask holding device and method using two holding systems
US7041989B1 (en) 2004-10-22 2006-05-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7649611B2 (en) * 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20090006064A (ko) * 2006-04-05 2009-01-14 가부시키가이샤 니콘 스테이지 장치, 노광 장치, 스테이지 제어 방법, 노광 방법및 디바이스 제조 방법
US20070268476A1 (en) * 2006-05-19 2007-11-22 Nikon Corporation Kinematic chucks for reticles and other planar bodies
US20070292245A1 (en) * 2006-05-25 2007-12-20 Nikon Corporation Stage assembly with secure device holder
US7508494B2 (en) * 2006-12-22 2009-03-24 Asml Netherlands B.V. Lithographic apparatus and a subtrate table for exciting a shockwave in a substrate
US20080180873A1 (en) * 2007-01-31 2008-07-31 Applied Materials, Inc. Securing a substrate to an electrostatic chuck
FR2912375B1 (fr) * 2007-02-14 2009-12-18 Eurocopter France Verin electrique de commande de vol pour aeronef
TWI541615B (zh) 2007-07-13 2016-07-11 瑪波微影Ｉｐ公司 在微影裝置中交換晶圓的方法
US8705010B2 (en) * 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI337154B (en) * 2008-04-17 2011-02-11 Gudeng Prec Industral Co Ltd Gas filling apparatus and gas filling port thereof
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
JP4786693B2 (ja) * 2008-09-30 2011-10-05 三菱重工業株式会社 ウェハ接合装置およびウェハ接合方法
JP5470601B2 (ja) * 2009-03-02 2014-04-16 新光電気工業株式会社 静電チャック
SG176059A1 (en) 2009-05-15 2011-12-29 Entegris Inc Electrostatic chuck with polymer protrusions
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
WO2011149918A2 (en) 2010-05-28 2011-12-01 Entegris, Inc. High surface resistivity electrostatic chuck
JP5960154B2 (ja) * 2010-12-08 2016-08-02 エーエスエムエル ホールディング エヌ．ブイ． 静電クランプ、リソグラフィ装置、および静電クランプの製造方法
NL2009689A (en) * 2011-12-01 2013-06-05 Asml Netherlands Bv Support, lithographic apparatus and device manufacturing method.
NL2009858A (en) 2011-12-27 2013-07-01 Asml Netherlands Bv Substrate holder, lithographic apparatus, and device manufacturing method.
CN103576464B (zh) * 2012-07-20 2016-03-09 上海微电子装备有限公司 一种推顶机构及具有该推顶机构的光刻装置
JP2014086701A (ja) * 2012-10-26 2014-05-12 Canon Inc 保持装置、リソグラフィ装置及び物品の製造方法
NL2011592A (en) 2012-10-31 2014-05-06 Asml Netherlands Bv Compensation for patterning device deformation.
CN108780773B (zh) * 2016-02-10 2022-10-21 恩特格里斯公司 具有改善粒子性能的晶片接触表面突部轮廓
CN107272351A (zh) * 2017-07-28 2017-10-20 武汉华星光电技术有限公司 承载装置及具有该承载装置的曝光设备
JP7104531B2 (ja) * 2018-03-19 2022-07-21 キヤノン株式会社 基板保持装置および基板処理装置
EP3575873A1 (en) 2018-05-28 2019-12-04 ASML Netherlands B.V. Particle beam apparatus
EP3921701A1 (en) * 2019-02-08 2021-12-15 ASML Netherlands B.V. Component for use in a lithographic apparatus, method of protecting a component and method of protecting tables in a lithographic apparatus
EP3832391A1 (en) * 2019-12-03 2021-06-09 ASML Netherlands B.V. Clamp assembly

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4384918A (en) 1980-09-30 1983-05-24 Fujitsu Limited Method and apparatus for dry etching and electrostatic chucking device used therein
GB2106325A (en) 1981-09-14 1983-04-07 Philips Electronic Associated Electrostatic chuck
US4551192A (en) 1983-06-30 1985-11-05 International Business Machines Corporation Electrostatic or vacuum pinchuck formed with microcircuit lithography
GB2147459A (en) * 1983-09-30 1985-05-09 Philips Electronic Associated Electrostatic chuck for semiconductor wafers
DE3471827D1 (en) * 1983-09-30 1988-07-07 Philips Electronic Associated Electrostatic chuck and loading method
JPS60235423A (ja) * 1984-05-08 1985-11-22 Mitsubishi Electric Corp 半導体製造装置
JPS6272139A (ja) * 1985-09-26 1987-04-02 Hitachi Electronics Eng Co Ltd ウエハ吸着装置
FR2661039B1 (fr) * 1990-04-12 1997-04-30 Commissariat Energie Atomique Porte-substrat electrostatique.
JP3238925B2 (ja) 1990-11-17 2001-12-17 株式会社東芝 静電チャック
US5350479A (en) 1992-12-02 1994-09-27 Applied Materials, Inc. Electrostatic chuck for high power plasma processing
EP0635870A1 (en) 1993-07-20 1995-01-25 Applied Materials, Inc. An electrostatic chuck having a grooved surface
KR100430643B1 (ko) 1994-01-31 2004-05-12 어플라이드 머티어리얼스, 인코포레이티드 두께가 균일한 절연체 막을 갖는 정전기 척
TW288253B (enExample) * 1994-02-03 1996-10-11 Aneruba Kk
JP3671379B2 (ja) * 1994-02-03 2005-07-13 アネルバ株式会社 静電吸着された被処理基板の離脱機構を持つプラズマ処理装置および静電吸着された被処理基板の離脱方法
JPH0878512A (ja) * 1994-09-09 1996-03-22 Hitachi Ltd 静電吸着装置及び方法
JPH09172055A (ja) * 1995-12-19 1997-06-30 Fujitsu Ltd 静電チャック及びウエハの吸着方法
JP3639686B2 (ja) * 1996-01-31 2005-04-20 キヤノン株式会社 基板の保持装置とこれを用いた露光装置、及びデバイスの製造方法
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
US5761023A (en) * 1996-04-25 1998-06-02 Applied Materials, Inc. Substrate support with pressure zones having reduced contact area and temperature feedback
JP2000100895A (ja) * 1998-09-18 2000-04-07 Nikon Corp 基板の搬送装置、基板の保持装置、及び基板処理装置
JP2000156400A (ja) * 1998-11-19 2000-06-06 Matsushita Electric Ind Co Ltd 基板の分離方法および分離装置
JP4064557B2 (ja) * 1999-01-07 2008-03-19 松下電器産業株式会社 真空処理装置の基板取り外し制御方法
US6215642B1 (en) * 1999-03-11 2001-04-10 Nikon Corporation Of Japan Vacuum compatible, deformable electrostatic chuck with high thermal conductivity
JP2001196290A (ja) * 2000-01-13 2001-07-19 Nikon Corp 静電チャック、ステージ、基板処理装置、荷電粒子線露光装置及びデバイス製造方法
JP2001267400A (ja) * 2000-03-16 2001-09-28 Kyocera Corp ウエハ支持部材
JP2002009139A (ja) * 2000-06-20 2002-01-11 Nikon Corp 静電チャック
JP2002082445A (ja) * 2000-07-07 2002-03-22 Nikon Corp ステージ装置及び露光装置
JP4312394B2 (ja) * 2001-01-29 2009-08-12 日本碍子株式会社 静電チャックおよび基板処理装置
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
JP2002313902A (ja) * 2001-04-18 2002-10-25 Canon Inc 静電チャック、該静電チャックから基板を離脱する方法
US7105836B2 (en) 2002-10-18 2006-09-12 Asml Holding N.V. Method and apparatus for cooling a reticle during lithographic exposure
US6897945B1 (en) * 2003-12-15 2005-05-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
US7187433B2 (en) 2007-03-06
CN102645852A (zh) 2012-08-22
EP1548502A1 (en) 2005-06-29
TW200523686A (en) 2005-07-16
TWI248562B (en) 2006-02-01
JP2010109390A (ja) 2010-05-13
JP5118711B2 (ja) 2013-01-16
US20050174555A1 (en) 2005-08-11
KR100644419B1 (ko) 2006-11-10
JP4477480B2 (ja) 2010-06-09
US20050128463A1 (en) 2005-06-16
KR20050060006A (ko) 2005-06-21
JP2005183959A (ja) 2005-07-07
CN1629733A (zh) 2005-06-22
US6897945B1 (en) 2005-05-24

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