JP4477480B2 - リソグラフィ装置およびデバイス製造方法 - Google Patents

リソグラフィ装置およびデバイス製造方法 Download PDF

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Publication number
JP4477480B2
JP4477480B2 JP2004361720A JP2004361720A JP4477480B2 JP 4477480 B2 JP4477480 B2 JP 4477480B2 JP 2004361720 A JP2004361720 A JP 2004361720A JP 2004361720 A JP2004361720 A JP 2004361720A JP 4477480 B2 JP4477480 B2 JP 4477480B2
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JP
Japan
Prior art keywords
article
substrate
backfill gas
lithographic apparatus
clamp
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2004361720A
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English (en)
Japanese (ja)
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JP2005183959A (ja
Inventor
ジェロエン オッテンス ヨーシュト
アントニー ヨハネス ネールホフ ヘンドリック
ヤコブス ヨハネス マリア ツァール コーエン
レ クリューゼ マルコ
Original Assignee
エーエスエムエル ネザーランズ ビー．ブイ．
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Public Health (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2004361720A 2003-12-15 2004-12-14 リソグラフィ装置およびデバイス製造方法 Expired - Fee Related JP4477480B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/734,641 US6897945B1 (en) 2003-12-15 2003-12-15 Lithographic apparatus and device manufacturing method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010022217A Division JP5118711B2 (ja) 2003-12-15 2010-02-03 リソグラフィ装置およびデバイス製造方法

Publications (2)

Publication Number Publication Date
JP2005183959A JP2005183959A (ja) 2005-07-07
JP4477480B2 true JP4477480B2 (ja) 2010-06-09

Family

ID=34552774

Family Applications (2)

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JP2004361720A Expired - Fee Related JP4477480B2 (ja) 2003-12-15 2004-12-14 リソグラフィ装置およびデバイス製造方法
JP2010022217A Expired - Fee Related JP5118711B2 (ja) 2003-12-15 2010-02-03 リソグラフィ装置およびデバイス製造方法

Family Applications After (1)

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JP2010022217A Expired - Fee Related JP5118711B2 (ja) 2003-12-15 2010-02-03 リソグラフィ装置およびデバイス製造方法

Country Status (7)

Country Link
US (2) US6897945B1 (enExample)
EP (1) EP1548502A1 (enExample)
JP (2) JP4477480B2 (enExample)
KR (1) KR100644419B1 (enExample)
CN (2) CN102645852A (enExample)
SG (1) SG112968A1 (enExample)
TW (1) TWI248562B (enExample)

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US20050223973A1 (en) * 2004-03-30 2005-10-13 Infineon Technologies Ag EUV lithography system and chuck for releasing reticle in a vacuum isolated environment
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US7649611B2 (en) * 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20090006064A (ko) * 2006-04-05 2009-01-14 가부시키가이샤 니콘 스테이지 장치, 노광 장치, 스테이지 제어 방법, 노광 방법및 디바이스 제조 방법
US20070268476A1 (en) * 2006-05-19 2007-11-22 Nikon Corporation Kinematic chucks for reticles and other planar bodies
US20070292245A1 (en) * 2006-05-25 2007-12-20 Nikon Corporation Stage assembly with secure device holder
US7508494B2 (en) * 2006-12-22 2009-03-24 Asml Netherlands B.V. Lithographic apparatus and a subtrate table for exciting a shockwave in a substrate
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US8705010B2 (en) * 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
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JP4786693B2 (ja) * 2008-09-30 2011-10-05 三菱重工業株式会社 ウェハ接合装置およびウェハ接合方法
JP5470601B2 (ja) * 2009-03-02 2014-04-16 新光電気工業株式会社 静電チャック
SG176059A1 (en) 2009-05-15 2011-12-29 Entegris Inc Electrostatic chuck with polymer protrusions
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
WO2011149918A2 (en) 2010-05-28 2011-12-01 Entegris, Inc. High surface resistivity electrostatic chuck
JP5960154B2 (ja) * 2010-12-08 2016-08-02 エーエスエムエル ホールディング エヌ．ブイ． 静電クランプ、リソグラフィ装置、および静電クランプの製造方法
NL2009689A (en) * 2011-12-01 2013-06-05 Asml Netherlands Bv Support, lithographic apparatus and device manufacturing method.
NL2009858A (en) 2011-12-27 2013-07-01 Asml Netherlands Bv Substrate holder, lithographic apparatus, and device manufacturing method.
CN103576464B (zh) * 2012-07-20 2016-03-09 上海微电子装备有限公司 一种推顶机构及具有该推顶机构的光刻装置
JP2014086701A (ja) * 2012-10-26 2014-05-12 Canon Inc 保持装置、リソグラフィ装置及び物品の製造方法
NL2011592A (en) 2012-10-31 2014-05-06 Asml Netherlands Bv Compensation for patterning device deformation.
CN108780773B (zh) * 2016-02-10 2022-10-21 恩特格里斯公司 具有改善粒子性能的晶片接触表面突部轮廓
CN107272351A (zh) * 2017-07-28 2017-10-20 武汉华星光电技术有限公司 承载装置及具有该承载装置的曝光设备
JP7104531B2 (ja) * 2018-03-19 2022-07-21 キヤノン株式会社 基板保持装置および基板処理装置
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EP3921701A1 (en) * 2019-02-08 2021-12-15 ASML Netherlands B.V. Component for use in a lithographic apparatus, method of protecting a component and method of protecting tables in a lithographic apparatus
EP3832391A1 (en) * 2019-12-03 2021-06-09 ASML Netherlands B.V. Clamp assembly

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Also Published As

Publication number Publication date
US7187433B2 (en) 2007-03-06
CN102645852A (zh) 2012-08-22
EP1548502A1 (en) 2005-06-29
TW200523686A (en) 2005-07-16
TWI248562B (en) 2006-02-01
JP2010109390A (ja) 2010-05-13
JP5118711B2 (ja) 2013-01-16
US20050174555A1 (en) 2005-08-11
KR100644419B1 (ko) 2006-11-10
US20050128463A1 (en) 2005-06-16
KR20050060006A (ko) 2005-06-21
SG112968A1 (en) 2005-07-28
JP2005183959A (ja) 2005-07-07
CN1629733A (zh) 2005-06-22
US6897945B1 (en) 2005-05-24

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