TWI236040B - Simulation method and simulator of semiconductor circuit device - Google Patents

Simulation method and simulator of semiconductor circuit device Download PDF

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Publication number
TWI236040B
TWI236040B TW092135987A TW92135987A TWI236040B TW I236040 B TWI236040 B TW I236040B TW 092135987 A TW092135987 A TW 092135987A TW 92135987 A TW92135987 A TW 92135987A TW I236040 B TWI236040 B TW I236040B
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TW
Taiwan
Prior art keywords
transistor
degradation
exp
amount
voltage
Prior art date
Application number
TW092135987A
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English (en)
Chinese (zh)
Other versions
TW200416799A (en
Inventor
Hiroki Usui
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200416799A publication Critical patent/TW200416799A/zh
Application granted granted Critical
Publication of TWI236040B publication Critical patent/TWI236040B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/36—Circuit design at the analogue level
    • G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW092135987A 2002-12-19 2003-12-18 Simulation method and simulator of semiconductor circuit device TWI236040B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002368046A JP4214775B2 (ja) 2002-12-19 2002-12-19 半導体装置特性シミュレーション方法及び半導体装置特性シミュレータ

Publications (2)

Publication Number Publication Date
TW200416799A TW200416799A (en) 2004-09-01
TWI236040B true TWI236040B (en) 2005-07-11

Family

ID=32677106

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092135987A TWI236040B (en) 2002-12-19 2003-12-18 Simulation method and simulator of semiconductor circuit device

Country Status (6)

Country Link
US (2) US7240308B2 (enExample)
JP (1) JP4214775B2 (enExample)
KR (1) KR20050083556A (enExample)
CN (1) CN100401461C (enExample)
TW (1) TWI236040B (enExample)
WO (1) WO2004057652A1 (enExample)

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US7401304B2 (en) * 2004-01-28 2008-07-15 Gradient Design Automation Inc. Method and apparatus for thermal modeling and analysis of semiconductor chip designs
US7353471B1 (en) * 2004-08-05 2008-04-01 Gradient Design Automation Inc. Method and apparatus for using full-chip thermal analysis of semiconductor chip designs to compute thermal conductance
WO2007070879A1 (en) * 2005-12-17 2007-06-21 Gradient Design Automation, Inc. Simulation of ic temperature distributions using an adaptive 3d grid
US7472363B1 (en) * 2004-01-28 2008-12-30 Gradient Design Automation Inc. Semiconductor chip design having thermal awareness across multiple sub-system domains
US20090048801A1 (en) * 2004-01-28 2009-02-19 Rajit Chandra Method and apparatus for generating thermal test vectors
US7458052B1 (en) 2004-08-30 2008-11-25 Gradient Design Automation, Inc. Method and apparatus for normalizing thermal gradients over semiconductor chip designs
US20090224356A1 (en) * 2004-01-28 2009-09-10 Rajit Chandra Method and apparatus for thermally aware design improvement
US7203920B2 (en) * 2004-01-28 2007-04-10 Gradient Design Automation Inc. Method and apparatus for retrofitting semiconductor chip performance analysis tools with full-chip thermal analysis capabilities
US20090077508A1 (en) * 2004-01-28 2009-03-19 Rubin Daniel I Accelerated life testing of semiconductor chips
US7383520B2 (en) * 2004-08-05 2008-06-03 Gradient Design Automation Inc. Method and apparatus for optimizing thermal management system performance using full-chip thermal analysis of semiconductor chip designs
US8019580B1 (en) 2007-04-12 2011-09-13 Gradient Design Automation Inc. Transient thermal analysis
US8286111B2 (en) * 2004-03-11 2012-10-09 Gradient Design Automation Inc. Thermal simulation using adaptive 3D and hierarchical grid mechanisms
US7296247B1 (en) * 2004-08-17 2007-11-13 Xilinx, Inc. Method and apparatus to improve pass transistor performance
JP2006140284A (ja) * 2004-11-11 2006-06-01 Matsushita Electric Ind Co Ltd 半導体装置の信頼性シミュレーション方法及び信頼性シミュレータ
JP2008053692A (ja) * 2006-07-28 2008-03-06 Matsushita Electric Ind Co Ltd トランジスタのｂｔ劣化のシミュレーションモデルおよびシミュレーションモデル化方法
US7594210B2 (en) * 2006-11-16 2009-09-22 Clk Design Automation, Inc. Timing variation characterization
US7793243B1 (en) 2006-12-04 2010-09-07 Clk Design Automation, Inc. Multi-engine static analysis
US7600204B1 (en) * 2007-02-14 2009-10-06 Xilinx, Inc. Method for simulation of negative bias and temperature instability
US8935146B2 (en) * 2007-03-05 2015-01-13 Fujitsu Semiconductor Limited Computer aided design apparatus, computer aided design program, computer aided design method for a semiconductor device and method of manufacturing a semiconductor circuit based on characteristic value and simulation parameter
JP4563501B2 (ja) * 2007-06-20 2010-10-13 富士通株式会社 回路シミュレーションモデル生成装置、回路シミュレーションモデル生成プログラム、回路シミュレーションモデル生成方法及び回路シミュレーション装置
US7750400B2 (en) 2008-08-15 2010-07-06 Texas Instruments Incorporated Integrated circuit modeling, design, and fabrication based on degradation mechanisms
KR101478554B1 (ko) * 2008-10-02 2015-01-06 삼성전자 주식회사 오버 슈트 전압의 산출 방법 및 그를 이용한 게이트 절연막열화분석방법
CN101739471B (zh) * 2008-11-13 2011-09-28 上海华虹Nec电子有限公司 双极型晶体管工艺偏差模型参数的在线测试及提取方法
CN102054066B (zh) * 2009-10-30 2015-12-09 新思科技(上海)有限公司 集成电路的退化分析方法及装置
JP5394943B2 (ja) * 2010-01-15 2014-01-22 ラピスセミコンダクタ株式会社 試験結果記憶方法、試験結果表示方法、及び試験結果表示装置
CN102437025B (zh) * 2011-12-02 2013-04-24 南京大学 一种消除pmos中负偏压温度不稳定性影响的方法
US9323870B2 (en) 2012-05-01 2016-04-26 Advanced Micro Devices, Inc. Method and apparatus for improved integrated circuit temperature evaluation and IC design
US20140095126A1 (en) * 2012-10-03 2014-04-03 Lsi Corporation Hot-carrier injection reliability checks based on gate voltage dependency
US20140304445A1 (en) * 2013-04-09 2014-10-09 William Michael Gervasi Memory bus loading and conditioning module
CN103324813B (zh) * 2013-07-11 2016-01-20 深圳大学 Mos器件非均匀界面退化电荷的数值模拟方法及系统
US9857409B2 (en) 2013-08-27 2018-01-02 Synopsys, Inc. Negative bias thermal instability stress testing of transistors
CN104699880B (zh) * 2013-12-10 2018-06-01 中芯国际集成电路制造(上海)有限公司 一种半导体器件的评估方法和rc时序测试方法
CN103744008B (zh) * 2013-12-12 2016-02-03 华为技术有限公司 确定电路老化性能的方法和装置
KR102268591B1 (ko) * 2014-08-18 2021-06-25 삼성전자주식회사 회로의 자가 발열 특성을 예측하는 시뮬레이션 시스템 및 그것의 회로 설계 방법
US9996650B2 (en) 2015-03-17 2018-06-12 International Business Machines Corporation Modeling the performance of a field effect transistor having a dynamically depleted channel region
CN105067985B (zh) * 2015-07-22 2018-01-02 工业和信息化部电子第五研究所 基于nbti效应pmos管参数退化的失效预警装置
US10621494B2 (en) * 2017-11-08 2020-04-14 Samsung Electronics Co., Ltd. System and method for circuit simulation based on recurrent neural networks

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JP2000323709A (ja) * 1999-03-09 2000-11-24 Fujitsu Ltd ホットキャリア劣化シミュレーション方法、半導体装置の製造方法、およびコンピュータ可読記録媒体
US6795802B2 (en) * 2000-03-17 2004-09-21 Matsushita Electric Industrial Co., Ltd. Apparatus and method for calculating temporal deterioration margin amount of LSI, and LSI inspection method
JP2001267260A (ja) * 2000-03-22 2001-09-28 Oki Electric Ind Co Ltd 半導体モデリング方法
JP2001308317A (ja) * 2000-04-18 2001-11-02 Nec Corp 半導体装置の製造方法
JP2001352059A (ja) * 2000-06-09 2001-12-21 Nec Corp Ｐｍｏｓトランジスタの特性劣化シミュレーション方法
JP2003264292A (ja) * 2002-03-11 2003-09-19 Fujitsu Display Technologies Corp シミュレーション方法

Also Published As

Publication number Publication date
US20050138581A1 (en) 2005-06-23
US20070209027A1 (en) 2007-09-06
WO2004057652A1 (ja) 2004-07-08
JP2004200461A (ja) 2004-07-15
US7240308B2 (en) 2007-07-03
TW200416799A (en) 2004-09-01
JP4214775B2 (ja) 2009-01-28
KR20050083556A (ko) 2005-08-26
CN100401461C (zh) 2008-07-09
CN1692471A (zh) 2005-11-02

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