TWD198069S - 基板處理裝置用氣體供給噴嘴 - Google Patents

基板處理裝置用氣體供給噴嘴

Info

Publication number
TWD198069S
TWD198069S TW107306662F TW107306662F TWD198069S TW D198069 S TWD198069 S TW D198069S TW 107306662 F TW107306662 F TW 107306662F TW 107306662 F TW107306662 F TW 107306662F TW D198069 S TWD198069 S TW D198069S
Authority
TW
Taiwan
Prior art keywords
gas supply
substrate processing
supply nozzle
nozzle
processing equipment
Prior art date
Application number
TW107306662F
Other languages
English (en)
Inventor
Koji Saiki
Makoto Tsuri
Original Assignee
日商國際電氣股份有限公司
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司, Kokusai Electric Corp filed Critical 日商國際電氣股份有限公司
Publication of TWD198069S publication Critical patent/TWD198069S/zh

Links

Abstract

【物品用途】;本設計的物品是基板處理裝置用氣體供給噴嘴,為一種應用在處理晶圓的基板處理裝置的氣體供給噴嘴;本物品是連接於配置在基板處理裝置的處理室內的氣體供給噴嘴,用以將氣體導入到氣體供給噴嘴。另外,在本設計中,如「B-B部分放大圖」所示,形成階梯狀部分是用以插入噴嘴的部分。;【設計說明】;除了「俯視圖」、「仰視圖」及「A-A剖面圖」外,繪製在其他圖示中的細線,皆為用來表現立體表面的形狀。
TW107306662F 2018-07-19 2018-11-12 基板處理裝置用氣體供給噴嘴 TWD198069S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-15810F JP1624354S (zh) 2018-07-19 2018-07-19

Publications (1)

Publication Number Publication Date
TWD198069S true TWD198069S (zh) 2019-06-11

Family

ID=65269366

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107306662F TWD198069S (zh) 2018-07-19 2018-11-12 基板處理裝置用氣體供給噴嘴

Country Status (3)

Country Link
US (1) USD890572S1 (zh)
JP (1) JP1624354S (zh)
TW (1) TWD198069S (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1624352S (zh) * 2018-07-19 2019-02-12
JP1644261S (zh) * 2019-03-20 2019-10-28
USD967941S1 (en) * 2020-04-28 2022-10-25 Hypertherm, Inc. Intensifier cylinder
JP1684258S (zh) * 2020-07-27 2021-04-26
JP1685215S (ja) * 2020-08-18 2024-05-10 基板処理装置用ガス導入管
USD1003409S1 (en) * 2021-04-07 2023-10-31 No Limit Enterprises, Inc. Coolant line

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US45556A (en) * 1864-12-20 Petee oockee
US3484122A (en) * 1968-01-12 1969-12-16 Herman J Schellstede Drill pipe protector and method of constructing the same
USD620085S1 (en) * 2007-05-08 2010-07-20 Tokyo Electron Limited Gas supply pipe for manufacturing semiconductor wafers
US20100264646A1 (en) * 2009-04-16 2010-10-21 Jean-Marc Follini Structures for wire routing in wired drill pipe
CA142623S (en) * 2011-01-20 2012-01-25 Victaulic Co Of America Fitting
US20130252213A1 (en) * 2012-03-26 2013-09-26 Clayton Anthony Gridley Water pipe assembly for pump training
US10156312B2 (en) * 2015-11-30 2018-12-18 Victaulic Company Sprinkler adapter and pipe plug
JP1563647S (zh) * 2016-01-29 2016-11-21
JP1573205S (zh) * 2016-08-29 2020-03-23
JP1586728S (zh) * 2017-02-10 2017-09-25
USD873392S1 (en) * 2017-08-31 2020-01-21 Rotary Connections International Ltd. Drill pipe
USD872843S1 (en) * 2017-12-06 2020-01-14 Michael Stoffa, Sr. Valve attachment for a pipe

Also Published As

Publication number Publication date
USD890572S1 (en) 2020-07-21
JP1624354S (zh) 2019-02-12

Similar Documents

Publication Publication Date Title
TWD198069S (zh) 基板處理裝置用氣體供給噴嘴
TWD184277S (zh) 用於半導體處理腔室之噴淋頭(一)
TWD193612S (zh) Protective ring for plasma processing equipment
TWD175852S (zh) 電漿處理裝置用上腔室
TWD175855S (zh) 電漿處理裝置用下腔室
TWD181481S (zh) 反應管
TWD181302S (zh) 晶圓載具
TWD203444S (zh) 基板處理裝置用氣體導入管
TWD169066S (zh) 硏磨墊
TWD215215S (zh) 基板處理裝置用氣體供給噴嘴
TWD212726S (zh) 基板處理裝置用晶舟之部分
TWD197462S (zh) 半導體製造裝置用密封材
TWD204223S (zh) 電漿處理裝置用接地電極
TWD187175S (zh) 圖案化石英晶圓
TWD153321S (zh) 上部襯墊
TWD183002S (zh) 圖案化石英晶圓
TWD197467S (zh) 基板處理裝置用氣體導入管
TWD171078S (zh) 基板處理裝置用氣體供給噴嘴之部分
TWD186397S (zh) 電漿處理裝置用放電腔室
TWD200243S (zh) 半導體製造裝置用密封材
TWD164163S (zh) 半導體晶圓硏磨裝置用彈性膜之部分
TWD167113S (zh) 半導體晶圓硏磨裝置用彈性膜
TWD164162S (zh) 半導體晶圓硏磨裝置用彈性膜之部分
TWD208352S (zh) 容器
TWD199840S (zh) 功率半導體裝置