TWD187001S - 基板處理裝置用頂置式加熱器 - Google Patents
基板處理裝置用頂置式加熱器Info
- Publication number
- TWD187001S TWD187001S TW106301242F TW106301242F TWD187001S TW D187001 S TWD187001 S TW D187001S TW 106301242 F TW106301242 F TW 106301242F TW 106301242 F TW106301242 F TW 106301242F TW D187001 S TWD187001 S TW D187001S
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate processing
- article
- mounted heater
- processing equipment
- ceiling
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000010438 heat treatment Methods 0.000 abstract 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2016-22413F JP1581406S (cs) | 2016-10-14 | 2016-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD187001S true TWD187001S (zh) | 2017-12-01 |
Family
ID=59309850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106301242F TWD187001S (zh) | 2016-10-14 | 2017-03-13 | 基板處理裝置用頂置式加熱器 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD826185S1 (cs) |
| JP (1) | JP1581406S (cs) |
| TW (1) | TWD187001S (cs) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1590181S (cs) * | 2017-02-14 | 2017-11-06 | ||
| USD887358S1 (en) * | 2018-12-06 | 2020-06-16 | Lofelt Gmbh | Motor membrane |
| USD921431S1 (en) | 2019-04-01 | 2021-06-08 | Veeco Instruments, Inc. | Multi-filament heater assembly |
| JP1651618S (cs) * | 2019-07-11 | 2020-01-27 | ||
| JP1651619S (cs) * | 2019-07-11 | 2020-01-27 | ||
| JP1651623S (cs) | 2019-07-18 | 2020-01-27 | ||
| USD913256S1 (en) * | 2019-07-31 | 2021-03-16 | Eryn Smith | Antenna pattern for a semiconductive substrate carrier |
| USD926716S1 (en) * | 2019-07-31 | 2021-08-03 | Eryn Smith | Antenna pattern for a semiconductive substrate carrier |
| USD895587S1 (en) * | 2019-10-22 | 2020-09-08 | Avery Dennison Retail Information Services, Llc | Antenna |
| USD954691S1 (en) | 2019-10-22 | 2022-06-14 | Avery Dennison Retail Information Services, Llc | Antenna |
| USD922339S1 (en) * | 2019-11-11 | 2021-06-15 | Asia Vital Components Co., Ltd. | Radiating fin |
| USD922340S1 (en) * | 2019-11-11 | 2021-06-15 | Asia Vita Components Co., Ltd. | Radiating fin |
| USD922341S1 (en) * | 2019-11-11 | 2021-06-15 | Asia Vital Components Co., Ltd. | Radiating fin |
| USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
| JP1684469S (ja) | 2020-09-24 | 2021-05-10 | 基板処理装置用天井ヒータ | |
| JP1684468S (ja) | 2020-09-24 | 2021-05-10 | 基板処理装置用天井ヒータ | |
| USD980199S1 (en) * | 2020-12-17 | 2023-03-07 | Megabyte Limited | Antenna for radio frequency tag reader |
| USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
| USD1051530S1 (en) * | 2023-03-29 | 2024-11-12 | Irobot Corporation | Drip tray for use with a mobile cleaning robot |
| JP1770111S (ja) | 2023-03-09 | 2024-05-10 | 移動型掃除ロボット用ドリップトレイ | |
| JP1783361S (ja) * | 2024-02-19 | 2024-10-29 | 無線通信用タグ | |
| USD1094344S1 (en) * | 2024-05-17 | 2025-09-23 | Avery Dennison Retail Information Services Llc | Antenna |
| USD1096704S1 (en) * | 2024-06-25 | 2025-10-07 | Avery Dennison Retail Information Services Llc | Antenna |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4328009B2 (ja) * | 2000-11-30 | 2009-09-09 | 日本碍子株式会社 | 加熱装置 |
| WO2003009346A2 (en) * | 2001-07-15 | 2003-01-30 | Applied Materials,Inc. | Processing system |
| JP4276813B2 (ja) * | 2002-03-26 | 2009-06-10 | 株式会社日立国際電気 | 熱処理装置および半導体製造方法 |
| JP2004200619A (ja) * | 2002-12-20 | 2004-07-15 | Kyocera Corp | ウエハ支持部材 |
| JP4380236B2 (ja) * | 2003-06-23 | 2009-12-09 | 東京エレクトロン株式会社 | 載置台及び熱処理装置 |
| WO2006060134A2 (en) * | 2004-11-15 | 2006-06-08 | Cree, Inc. | Restricted radiated heating assembly for high temperature processing |
| TWD125599S1 (zh) * | 2006-09-28 | 2008-10-21 | 東京威力科創股份有限公司 | 半導體製造用加熱器 |
| USD649126S1 (en) * | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
| JP5814005B2 (ja) * | 2011-06-21 | 2015-11-17 | 芝浦メカトロニクス株式会社 | ヒータユニット、ファンフィルタユニット及び基板処理装置 |
| US9267739B2 (en) * | 2012-07-18 | 2016-02-23 | Applied Materials, Inc. | Pedestal with multi-zone temperature control and multiple purge capabilities |
| US9719629B2 (en) * | 2014-04-08 | 2017-08-01 | Plansee Se | Supporting system for a heating element and heating system |
| JP1541874S (cs) * | 2015-03-16 | 2016-01-18 | ||
| JP1560719S (cs) * | 2015-12-01 | 2016-10-11 |
-
2016
- 2016-10-14 JP JPD2016-22413F patent/JP1581406S/ja active Active
-
2017
- 2017-03-13 TW TW106301242F patent/TWD187001S/zh unknown
- 2017-03-13 US US29/596,974 patent/USD826185S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP1581406S (cs) | 2017-07-18 |
| USD826185S1 (en) | 2018-08-21 |
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