TW593440B - Thermosetting resin composition having low coefficient of thermal expansion and film using thereof - Google Patents

Thermosetting resin composition having low coefficient of thermal expansion and film using thereof Download PDF

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Publication number
TW593440B
TW593440B TW091122221A TW91122221A TW593440B TW 593440 B TW593440 B TW 593440B TW 091122221 A TW091122221 A TW 091122221A TW 91122221 A TW91122221 A TW 91122221A TW 593440 B TW593440 B TW 593440B
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TW
Taiwan
Prior art keywords
thermosetting
weight
parts
thermosetting resin
resin composition
Prior art date
Application number
TW091122221A
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English (en)
Chinese (zh)
Inventor
Atsushi Takahashi
Hideo Baba
Ken Madarame
Hideo Nakako
Nozomu Takano
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of TW593440B publication Critical patent/TW593440B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Silicon Polymers (AREA)
TW091122221A 2001-09-25 2002-09-25 Thermosetting resin composition having low coefficient of thermal expansion and film using thereof TW593440B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001291635 2001-09-25

Publications (1)

Publication Number Publication Date
TW593440B true TW593440B (en) 2004-06-21

Family

ID=19113743

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091122221A TW593440B (en) 2001-09-25 2002-09-25 Thermosetting resin composition having low coefficient of thermal expansion and film using thereof

Country Status (7)

Country Link
US (1) US20050065275A1 (OSRAM)
EP (1) EP1454962A4 (OSRAM)
JP (2) JP3966279B2 (OSRAM)
KR (1) KR100848434B1 (OSRAM)
CN (1) CN100489037C (OSRAM)
TW (1) TW593440B (OSRAM)
WO (1) WO2003029353A1 (OSRAM)

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JP2006152260A (ja) * 2004-10-26 2006-06-15 Hitachi Chem Co Ltd 複合体、これを用いたプリプレグ、金属箔張積層板及び多層印刷配線板並びに多層印刷配線板の製造方法
KR101272208B1 (ko) * 2005-02-16 2013-06-07 다우 코닝 도레이 캄파니 리미티드 강화 실리콘 수지 필름 및 이의 제조방법
US8092910B2 (en) 2005-02-16 2012-01-10 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
CN101120054B (zh) 2005-02-16 2013-01-09 陶氏康宁公司 增强的有机硅树脂膜及其制备方法
CN101238181B (zh) 2005-08-04 2011-10-05 陶氏康宁公司 增强的有机硅树脂膜及其制备方法
US8912268B2 (en) 2005-12-21 2014-12-16 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
CN101346417B (zh) 2006-01-19 2012-01-25 陶氏康宁公司 有机硅树脂膜、其制备方法和纳米材料填充的有机硅组合物
US8084097B2 (en) 2006-02-20 2011-12-27 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
CN101626893B (zh) 2007-02-22 2013-07-03 道康宁公司 增强硅树脂膜
CN101627096B (zh) * 2007-02-22 2012-11-07 道康宁公司 增强硅树脂膜及其制备方法
EP2117835A1 (en) 2007-02-22 2009-11-18 Dow Corning Corporation Reinforced silicone resin films
KR101513005B1 (ko) * 2007-12-18 2015-04-17 다우 글로벌 테크놀로지스 엘엘씨 실리콘 폴리에테르를 포함하는 열경화성 조성물, 이들의 제조 방법 및 용도
WO2009102566A1 (en) * 2008-02-15 2009-08-20 Dow Global Technologies Inc. Thermosetting compositions comprising silicone polyethers, their manufacture, and uses
JP5343025B2 (ja) * 2010-03-18 2013-11-13 新日鉄住金化学株式会社 ガスバリア性積層体フィルム
TWI522423B (zh) 2010-08-31 2016-02-21 道康寧東麗股份有限公司 聚矽氧烷組合物及其硬化物
US10329439B2 (en) * 2012-09-24 2019-06-25 Chomarat North America Plastisol compositions including organosilicon compound(s)
JP2016180088A (ja) * 2014-07-24 2016-10-13 三菱化学株式会社 熱硬化性樹脂組成物及びその成形体
KR20170037954A (ko) * 2014-07-28 2017-04-05 스미또모 가가꾸 가부시키가이샤 실리콘계 밀봉재 조성물 및 반도체 발광 장치
US9617373B2 (en) * 2015-02-13 2017-04-11 LCY Chemical Corp. Curable resin composition, article, and method for fabricating the same
CN113527818B (zh) * 2021-08-12 2022-11-29 广东生益科技股份有限公司 一种树脂组合物及其应用

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Also Published As

Publication number Publication date
JP5370333B2 (ja) 2013-12-18
EP1454962A4 (en) 2005-01-05
JP2011006710A (ja) 2011-01-13
JP3966279B2 (ja) 2007-08-29
US20050065275A1 (en) 2005-03-24
KR20040039407A (ko) 2004-05-10
CN1558931A (zh) 2004-12-29
KR100848434B1 (ko) 2008-07-28
JPWO2003029353A1 (ja) 2005-01-13
WO2003029353A1 (en) 2003-04-10
CN100489037C (zh) 2009-05-20
EP1454962A1 (en) 2004-09-08

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