KR100848434B1 - 저열팽창성의 열경화성 수지 조성물 및 수지 필름 - Google Patents
저열팽창성의 열경화성 수지 조성물 및 수지 필름 Download PDFInfo
- Publication number
- KR100848434B1 KR100848434B1 KR1020047004264A KR20047004264A KR100848434B1 KR 100848434 B1 KR100848434 B1 KR 100848434B1 KR 1020047004264 A KR1020047004264 A KR 1020047004264A KR 20047004264 A KR20047004264 A KR 20047004264A KR 100848434 B1 KR100848434 B1 KR 100848434B1
- Authority
- KR
- South Korea
- Prior art keywords
- binder
- thermosetting
- silicone polymer
- weight
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
- C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2001-00291635 | 2001-09-25 | ||
| JP2001291635 | 2001-09-25 | ||
| PCT/JP2002/009819 WO2003029353A1 (en) | 2001-09-25 | 2002-09-25 | Thermosetting resin composition with low thermal expansion and resin film |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077002246A Division KR100850618B1 (ko) | 2001-09-25 | 2002-09-25 | 저열팽창성의 열경화성 수지 조성물 및 수지 필름 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20040039407A KR20040039407A (ko) | 2004-05-10 |
| KR100848434B1 true KR100848434B1 (ko) | 2008-07-28 |
Family
ID=19113743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020047004264A Expired - Fee Related KR100848434B1 (ko) | 2001-09-25 | 2002-09-25 | 저열팽창성의 열경화성 수지 조성물 및 수지 필름 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20050065275A1 (OSRAM) |
| EP (1) | EP1454962A4 (OSRAM) |
| JP (2) | JP3966279B2 (OSRAM) |
| KR (1) | KR100848434B1 (OSRAM) |
| CN (1) | CN100489037C (OSRAM) |
| TW (1) | TW593440B (OSRAM) |
| WO (1) | WO2003029353A1 (OSRAM) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IL153812A0 (en) * | 2003-01-06 | 2003-07-31 | Bromine Compounds Ltd | Improved wood-plastic composites |
| JP2006152261A (ja) * | 2004-10-25 | 2006-06-15 | Hitachi Chem Co Ltd | 複合体、プリプレグ、金属箔張積層板、多層プリント配線板及びその製造方法 |
| JP2006152260A (ja) * | 2004-10-26 | 2006-06-15 | Hitachi Chem Co Ltd | 複合体、これを用いたプリプレグ、金属箔張積層板及び多層印刷配線板並びに多層印刷配線板の製造方法 |
| EP1856206B1 (en) * | 2005-02-16 | 2011-10-12 | Dow Corning Corporation | Reinforced silicone resin film and method of preparing same |
| ATE551398T1 (de) | 2005-02-16 | 2012-04-15 | Dow Corning | Verstärkte silikonharzfolie und herstellungsverfahren dafür |
| US8092910B2 (en) | 2005-02-16 | 2012-01-10 | Dow Corning Toray Co., Ltd. | Reinforced silicone resin film and method of preparing same |
| WO2007018756A1 (en) | 2005-08-04 | 2007-02-15 | Dow Corning Corporation | Reinforced silicone resin film and method of preparing same |
| JP5362363B2 (ja) | 2005-12-21 | 2013-12-11 | ダウ・コーニング・コーポレイション | シリコーン樹脂フィルム、その調製方法、及びナノ材料充填シリコーン組成物 |
| KR101426316B1 (ko) | 2006-01-19 | 2014-08-06 | 다우 코닝 코포레이션 | 실리콘 수지 필름, 이의 제조방법, 및 나노물질로 충전된실리콘 조성물 |
| WO2007097835A2 (en) | 2006-02-20 | 2007-08-30 | Dow Corning Corporation | Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition |
| JP5377334B2 (ja) | 2007-02-22 | 2013-12-25 | ダウ コーニング コーポレーション | 強化シリコーン樹脂フィルム |
| JP5426402B2 (ja) | 2007-02-22 | 2014-02-26 | ダウ コーニング コーポレーション | 強化シリコーン樹脂フィルム |
| CN101627096B (zh) * | 2007-02-22 | 2012-11-07 | 道康宁公司 | 增强硅树脂膜及其制备方法 |
| JP5571568B2 (ja) | 2007-12-18 | 2014-08-13 | ダウ グローバル テクノロジーズ エルエルシー | シリコーンポリエーテルを含む熱硬化性組成物、それらの製造及び用途 |
| KR20100121670A (ko) * | 2008-02-15 | 2010-11-18 | 다우 글로벌 테크놀로지스 인크. | 실리콘 폴리에테르를 포함하는 열경화성 조성물, 그들의 제조 및 용도 |
| JP5343025B2 (ja) * | 2010-03-18 | 2013-11-13 | 新日鉄住金化学株式会社 | ガスバリア性積層体フィルム |
| TWI522423B (zh) | 2010-08-31 | 2016-02-21 | 道康寧東麗股份有限公司 | 聚矽氧烷組合物及其硬化物 |
| US10329439B2 (en) * | 2012-09-24 | 2019-06-25 | Chomarat North America | Plastisol compositions including organosilicon compound(s) |
| JP2016180088A (ja) * | 2014-07-24 | 2016-10-13 | 三菱化学株式会社 | 熱硬化性樹脂組成物及びその成形体 |
| WO2016017592A1 (ja) * | 2014-07-28 | 2016-02-04 | 住友化学株式会社 | シリコーン系封止材組成物及び半導体発光装置 |
| US9617373B2 (en) * | 2015-02-13 | 2017-04-11 | LCY Chemical Corp. | Curable resin composition, article, and method for fabricating the same |
| CN113527818B (zh) * | 2021-08-12 | 2022-11-29 | 广东生益科技股份有限公司 | 一种树脂组合物及其应用 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5691407A (en) * | 1995-03-24 | 1997-11-25 | Shin-Etsu Chemical Co., Ltd. | Silicone rubber compositions for high-voltage electrical insulators |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62243649A (ja) * | 1986-04-15 | 1987-10-24 | Nippon Retsuku Kk | 電気絶縁用樹脂組成物 |
| US4966922A (en) * | 1988-06-09 | 1990-10-30 | General Electric Company | Dual curable silicone compositions |
| JPH0670181B2 (ja) * | 1989-01-19 | 1994-09-07 | 信越化学工業株式会社 | 熱硬化性シリコーンゴム組成物 |
| JP2508390B2 (ja) * | 1989-09-11 | 1996-06-19 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
| CA2092457A1 (en) * | 1992-05-28 | 1993-11-29 | James E. Doin | Oil resistant heat cured elastomer compositions with mixed metal oxides |
| US5508323A (en) * | 1992-06-29 | 1996-04-16 | Dow Corning Corporation | Method for imparting fire retardancy to organic resins |
| JP3339910B2 (ja) * | 1993-04-15 | 2002-10-28 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
| US5952439A (en) * | 1993-04-15 | 1999-09-14 | Dow Corning Toray Silicone Co., Ltd. | Epoxy group-containing silicone resin and compositions based thereon |
| JP3464512B2 (ja) * | 1993-11-04 | 2003-11-10 | 東レ・ダウコーニング・シリコーン株式会社 | シリコーンゴム組成物 |
| GB2284214B (en) * | 1993-11-30 | 1998-03-04 | Gen Electric | Silicone and fluorosilicone heat cured filled rubber compositions |
| JPH08337680A (ja) * | 1995-06-09 | 1996-12-24 | Hitachi Ltd | 熱硬化性樹脂およびその樹脂を用いた半導体装置 |
| US5939491A (en) * | 1997-08-01 | 1999-08-17 | Ppg Industries Ohio, Inc. | Curable compositions based on functional polysiloxanes |
| JPH11147934A (ja) * | 1997-11-19 | 1999-06-02 | Hitachi Chem Co Ltd | エポキシ樹脂組成物及びそれを用いた高分子量エポキシフィルム |
| JPH11335565A (ja) * | 1998-04-13 | 1999-12-07 | Dow Corning Corp | 熱硬化性シリコ―ンゴム組成物 |
| DE69922577T2 (de) * | 1998-05-07 | 2005-12-01 | Shin-Etsu Chemical Co., Ltd. | Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen |
| JP2001139833A (ja) * | 1999-11-16 | 2001-05-22 | Jsr Corp | 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造 |
| JP2001214075A (ja) * | 2000-02-04 | 2001-08-07 | Jsr Corp | 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造 |
| WO2001074927A1 (en) * | 2000-03-31 | 2001-10-11 | Hitachi Chemical Co., Ltd. | Process for producing novel silicone polymer, silicone polymer produced by the process, thermosetting resin composition, resin film, metal foil with insulating material, insulating film with metal foil on each side, metal-clad laminate, multilayered metal-clad laminate, and multilayered printed circuit board |
-
2002
- 2002-09-25 EP EP02770210A patent/EP1454962A4/en not_active Withdrawn
- 2002-09-25 CN CNB028187032A patent/CN100489037C/zh not_active Expired - Fee Related
- 2002-09-25 JP JP2003532588A patent/JP3966279B2/ja not_active Expired - Fee Related
- 2002-09-25 WO PCT/JP2002/009819 patent/WO2003029353A1/ja not_active Ceased
- 2002-09-25 TW TW091122221A patent/TW593440B/zh not_active IP Right Cessation
- 2002-09-25 KR KR1020047004264A patent/KR100848434B1/ko not_active Expired - Fee Related
- 2002-09-25 US US10/490,646 patent/US20050065275A1/en not_active Abandoned
-
2010
- 2010-10-13 JP JP2010230488A patent/JP5370333B2/ja not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5691407A (en) * | 1995-03-24 | 1997-11-25 | Shin-Etsu Chemical Co., Ltd. | Silicone rubber compositions for high-voltage electrical insulators |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011006710A (ja) | 2011-01-13 |
| US20050065275A1 (en) | 2005-03-24 |
| TW593440B (en) | 2004-06-21 |
| CN100489037C (zh) | 2009-05-20 |
| EP1454962A4 (en) | 2005-01-05 |
| KR20040039407A (ko) | 2004-05-10 |
| CN1558931A (zh) | 2004-12-29 |
| EP1454962A1 (en) | 2004-09-08 |
| JPWO2003029353A1 (ja) | 2005-01-13 |
| JP5370333B2 (ja) | 2013-12-18 |
| WO2003029353A1 (en) | 2003-04-10 |
| JP3966279B2 (ja) | 2007-08-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100848434B1 (ko) | 저열팽창성의 열경화성 수지 조성물 및 수지 필름 | |
| JP5545194B2 (ja) | 新規なシリコーン重合体の製造法、その方法により製造されたシリコーン重合体、熱硬化性樹脂組成物、樹脂フィルム、絶縁材料付金属箔、両面金属箔付絶縁フィルム、金属張積層板、多層金属張積層板及び多層プリント配線板 | |
| JPWO2001074927A1 (ja) | 新規なシリコーン重合体の製造法、その方法により製造されたシリコーン重合体、熱硬化性樹脂組成物、樹脂フィルム、絶縁材料付金属箔、両面金属箔付絶縁フィルム、金属張積層板、多層金属張積層板及び多層プリント配線板 | |
| KR20090099060A (ko) | 경화성 실리콘 조성물 및 전자 부품 | |
| KR20080078877A (ko) | 전자 부품용 액상 수지 조성물 및 전자 부품 장치 | |
| KR102024067B1 (ko) | 목질 바닥재 부착용 친환경 물유리계 접착제 및 이의 제조방법 | |
| EP1253811B1 (en) | Thermosetting resin composition and process for producing the same | |
| KR100850618B1 (ko) | 저열팽창성의 열경화성 수지 조성물 및 수지 필름 | |
| JP4899280B2 (ja) | 配線板用複合材料とその製造方法 | |
| JP5251949B2 (ja) | 基板およびプリント回路板 | |
| JP2010258462A (ja) | 配線板用複合材料とその製造方法 | |
| JP2007126678A (ja) | 低熱膨張性の熱硬化性樹脂組成物および樹脂フィルム | |
| JP4734781B2 (ja) | 基板、プリント回路板及びそれらの製造方法 | |
| JP2003101175A (ja) | 半導体搭載用基板および半導体パッケージ | |
| US20220064381A1 (en) | Silicone potting composition and uses thereof | |
| JP2011144386A (ja) | 熱硬化性樹脂組成物及びその製造方法 | |
| JP2012031431A (ja) | 熱硬化性樹脂組成物及びその製造方法 | |
| JP2012084923A (ja) | 配線板用複合材料とその製造方法 | |
| JP2012191240A (ja) | 基板、プリント回路板及びそれらの製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| A107 | Divisional application of patent | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0104 | Divisional application for international application |
St.27 status event code: A-0-1-A10-A18-div-PA0104 St.27 status event code: A-0-1-A10-A16-div-PA0104 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-5-5-R10-R17-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20130705 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20140711 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20150710 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20160708 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20170707 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20180719 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20180719 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |