TW573365B - Semiconductor integrated circuit device and manufacturing method of the same - Google Patents

Semiconductor integrated circuit device and manufacturing method of the same Download PDF

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Publication number
TW573365B
TW573365B TW90101161A TW90101161A TW573365B TW 573365 B TW573365 B TW 573365B TW 90101161 A TW90101161 A TW 90101161A TW 90101161 A TW90101161 A TW 90101161A TW 573365 B TW573365 B TW 573365B
Authority
TW
Taiwan
Prior art keywords
semiconductor
region
semiconductor region
integrated circuit
connection holes
Prior art date
Application number
TW90101161A
Other languages
English (en)
Chinese (zh)
Inventor
Shinichi Minami
Yoshiaki Kamigaki
Hideki Yasuoka
Fukuo Owada
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW573365B publication Critical patent/TW573365B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • H10B41/42—Simultaneous manufacture of periphery and memory cells
    • H10B41/49—Simultaneous manufacture of periphery and memory cells comprising different types of peripheral transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/811—Combinations of field-effect devices and one or more diodes, capacitors or resistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/983—Zener diodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
TW90101161A 2000-01-28 2001-01-18 Semiconductor integrated circuit device and manufacturing method of the same TW573365B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000020920A JP4149109B2 (ja) 2000-01-28 2000-01-28 半導体集積回路装置およびその製造方法

Publications (1)

Publication Number Publication Date
TW573365B true TW573365B (en) 2004-01-21

Family

ID=18547400

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90101161A TW573365B (en) 2000-01-28 2001-01-18 Semiconductor integrated circuit device and manufacturing method of the same

Country Status (4)

Country Link
US (2) US6803644B2 (enExample)
JP (1) JP4149109B2 (enExample)
KR (1) KR100738366B1 (enExample)
TW (1) TW573365B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101334A (ja) 2003-09-25 2005-04-14 Sanyo Electric Co Ltd 半導体装置およびその製造方法
US6977195B1 (en) * 2004-08-16 2005-12-20 Fasl, Llc Test structure for characterizing junction leakage current
KR100644895B1 (ko) 2004-12-15 2006-11-15 엘지전자 주식회사 자기정렬방식에 의한 양방향문턱전압 특성을 갖는제너다이오드의 제조방법
KR100861294B1 (ko) * 2006-02-24 2008-10-01 주식회사 하이닉스반도체 반도체 회로용 정전기 보호소자
JP2008218564A (ja) 2007-03-01 2008-09-18 Matsushita Electric Ind Co Ltd 半導体装置
US7698678B2 (en) * 2007-05-30 2010-04-13 International Business Machines Corporation Methodology for automated design of vertical parallel plate capacitors
US7876547B2 (en) * 2007-05-30 2011-01-25 International Business Machines Corporation Vertical parallel plate capacitor structures
US20090102016A1 (en) * 2007-10-22 2009-04-23 International Business Machines Corporation Design structure incorporating vertical parallel plate capacitor structures
JP5255305B2 (ja) 2008-03-27 2013-08-07 ルネサスエレクトロニクス株式会社 半導体集積回路装置および半導体集積回路装置の製造方法
US20130075747A1 (en) * 2011-09-23 2013-03-28 Robert J. Purtell Esd protection using low leakage zener diodes formed with microwave radiation
US12501632B2 (en) * 2022-12-15 2025-12-16 Nxp B.V. Semiconductor device with improved mechanical stress resistance

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3886579A (en) * 1972-07-28 1975-05-27 Hitachi Ltd Avalanche photodiode
US3881179A (en) * 1972-08-23 1975-04-29 Motorola Inc Zener diode structure having three terminals
JPS6048765B2 (ja) * 1977-12-19 1985-10-29 日本電気株式会社 定電圧半導体集積回路
US4441114A (en) * 1981-12-22 1984-04-03 International Business Machines Corporation CMOS Subsurface breakdown zener diode
JPS5988871A (ja) * 1982-11-12 1984-05-22 バ−・ブラウン・コ−ポレ−ション 高安定低電圧集積回路表面下降状ダイオ−ド構造体及びその製造方法
US4590664A (en) * 1983-07-29 1986-05-27 Harris Corporation Method of fabricating low noise reference diodes and transistors
US4646114A (en) * 1984-12-31 1987-02-24 Raytheon Company Integrated circuit Zener diode
JPS62110435A (ja) * 1985-11-04 1987-05-21 シ−メンス、アクチエンゲゼルシヤフト 加入者線の過電圧保護用集積回路装置
JPS6366974A (ja) * 1986-09-08 1988-03-25 Hitachi Ltd 半導体集積回路装置
JPS6459949A (en) 1987-08-31 1989-03-07 Hitachi Ltd Manufacture of semiconductor integrated circuit device
JPH03108376A (ja) * 1989-09-21 1991-05-08 New Japan Radio Co Ltd 埋込型ツェナーダイオードおよびその製法
US5027165A (en) * 1990-05-22 1991-06-25 Maxim Integrated Products Buried zener diode
US5929502A (en) * 1992-01-16 1999-07-27 Harris Corporation Level shifter stage with punch through diode
DE69316960T2 (de) * 1992-11-12 1998-07-30 Koninkl Philips Electronics Nv Elektronenröhre mit Halbleiterkathode
JP3353388B2 (ja) * 1993-06-23 2002-12-03 株式会社デンソー 電力用半導体装置
JP3148510B2 (ja) * 1994-05-18 2001-03-19 ローム株式会社 ツェナーダイオード
JPH0856002A (ja) * 1994-08-12 1996-02-27 Sony Corp ダイオード
JP4278721B2 (ja) * 1994-09-30 2009-06-17 テキサス インスツルメンツ インコーポレイテツド 高い逆降伏電圧を有するツェナーダイオード
US5756387A (en) * 1994-12-30 1998-05-26 Sgs-Thomson Microelectronics S.R.L. Method for forming zener diode with high time stability and low noise
EP0720237A1 (en) * 1994-12-30 1996-07-03 STMicroelectronics S.r.l. Zener diode for integrated circuits
US5691554A (en) * 1995-12-15 1997-11-25 Motorola, Inc. Protection circuit
US6114872A (en) * 1996-05-31 2000-09-05 Nippon Steel Corporation Differential input circuit
JP3108376B2 (ja) 1996-07-04 2000-11-13 沖電気工業株式会社 感熱記録媒体用のジアゾニウム塩

Also Published As

Publication number Publication date
KR100738366B1 (ko) 2007-07-12
US7064090B2 (en) 2006-06-20
US20010013611A1 (en) 2001-08-16
US6803644B2 (en) 2004-10-12
KR20010078051A (ko) 2001-08-20
US20050032298A1 (en) 2005-02-10
JP4149109B2 (ja) 2008-09-10
JP2001210839A (ja) 2001-08-03

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MM4A Annulment or lapse of patent due to non-payment of fees