TW539778B - Method and apparatus for controlling thickness uniformity of electroplated layer - Google Patents

Method and apparatus for controlling thickness uniformity of electroplated layer Download PDF

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Publication number
TW539778B
TW539778B TW090131629A TW90131629A TW539778B TW 539778 B TW539778 B TW 539778B TW 090131629 A TW090131629 A TW 090131629A TW 90131629 A TW90131629 A TW 90131629A TW 539778 B TW539778 B TW 539778B
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TW
Taiwan
Prior art keywords
scope
patent application
conductive
conductive element
electrolyte
Prior art date
Application number
TW090131629A
Other languages
English (en)
Chinese (zh)
Inventor
Bulent M Basol
Paul Lindquist
Original Assignee
Nu Tool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nu Tool Inc filed Critical Nu Tool Inc
Application granted granted Critical
Publication of TW539778B publication Critical patent/TW539778B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
TW090131629A 2000-12-21 2001-12-20 Method and apparatus for controlling thickness uniformity of electroplated layer TW539778B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25692400P 2000-12-21 2000-12-21
US09/855,059 US6802946B2 (en) 2000-12-21 2001-05-15 Apparatus for controlling thickness uniformity of electroplated and electroetched layers

Publications (1)

Publication Number Publication Date
TW539778B true TW539778B (en) 2003-07-01

Family

ID=26945682

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090131629A TW539778B (en) 2000-12-21 2001-12-20 Method and apparatus for controlling thickness uniformity of electroplated layer

Country Status (7)

Country Link
US (2) US6802946B2 (https=)
EP (1) EP1360348A4 (https=)
JP (1) JP2004518817A (https=)
KR (1) KR20040005866A (https=)
CN (1) CN1551931A (https=)
TW (1) TW539778B (https=)
WO (1) WO2002063072A1 (https=)

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Also Published As

Publication number Publication date
JP2004518817A (ja) 2004-06-24
EP1360348A4 (en) 2006-09-27
CN1551931A (zh) 2004-12-01
WO2002063072A1 (en) 2002-08-15
EP1360348A1 (en) 2003-11-12
US20020079230A1 (en) 2002-06-27
US6802946B2 (en) 2004-10-12
US20040231994A1 (en) 2004-11-25
US7435323B2 (en) 2008-10-14
KR20040005866A (ko) 2004-01-16

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