CN1551931A - 用于控制电镀层厚度均匀性的方法和装置 - Google Patents

用于控制电镀层厚度均匀性的方法和装置 Download PDF

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Publication number
CN1551931A
CN1551931A CNA018225640A CN01822564A CN1551931A CN 1551931 A CN1551931 A CN 1551931A CN A018225640 A CNA018225640 A CN A018225640A CN 01822564 A CN01822564 A CN 01822564A CN 1551931 A CN1551931 A CN 1551931A
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China
Prior art keywords
conductive
conductive element
mask
anode
deposition
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Pending
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CNA018225640A
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English (en)
Chinese (zh)
Inventor
˹���ء�M������
布伦特·M·贝斯
�ֵ¿�˹��
保罗·林德奎斯特
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ASM Nutool Inc
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ASM Nutool Inc
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Publication of CN1551931A publication Critical patent/CN1551931A/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
CNA018225640A 2000-12-21 2001-12-11 用于控制电镀层厚度均匀性的方法和装置 Pending CN1551931A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US25692400P 2000-12-21 2000-12-21
US60/256,924 2000-12-21
US09/855,059 2001-05-15
US09/855,059 US6802946B2 (en) 2000-12-21 2001-05-15 Apparatus for controlling thickness uniformity of electroplated and electroetched layers

Publications (1)

Publication Number Publication Date
CN1551931A true CN1551931A (zh) 2004-12-01

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CNA018225640A Pending CN1551931A (zh) 2000-12-21 2001-12-11 用于控制电镀层厚度均匀性的方法和装置

Country Status (7)

Country Link
US (2) US6802946B2 (https=)
EP (1) EP1360348A4 (https=)
JP (1) JP2004518817A (https=)
KR (1) KR20040005866A (https=)
CN (1) CN1551931A (https=)
TW (1) TW539778B (https=)
WO (1) WO2002063072A1 (https=)

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CN103026506A (zh) * 2010-05-25 2013-04-03 瑞而索乐公司 用于制造太阳能电池的快速化学电沉积的设备及方法
CN104313657A (zh) * 2014-11-10 2015-01-28 临安振有电子有限公司 Hdi印制线路板通孔的电沉积装置
CN105671603A (zh) * 2014-12-03 2016-06-15 丰田自动车株式会社 表面处理方法和表面处理装置
CN106637363A (zh) * 2010-07-02 2017-05-10 诺发系统有限公司 用于电镀期间的有效质量传递的电解液流体动力学的控制
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US10190230B2 (en) 2010-07-02 2019-01-29 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
CN109652826A (zh) * 2019-02-22 2019-04-19 圣达电气有限公司 阴极辊的电解铜箔厚度均匀性控制方法
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
CN110846698A (zh) * 2018-08-21 2020-02-28 财团法人工业技术研究院 待电镀的面板、使用其的电镀制作工艺及以其制造的晶片
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CN103026506A (zh) * 2010-05-25 2013-04-03 瑞而索乐公司 用于制造太阳能电池的快速化学电沉积的设备及方法
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CN110846698A (zh) * 2018-08-21 2020-02-28 财团法人工业技术研究院 待电镀的面板、使用其的电镀制作工艺及以其制造的晶片
CN109652826A (zh) * 2019-02-22 2019-04-19 圣达电气有限公司 阴极辊的电解铜箔厚度均匀性控制方法
CN113265695A (zh) * 2021-05-18 2021-08-17 南京萨特科技发展有限公司 合金箔电阻器挂镀治具及方法
TWI801144B (zh) * 2021-10-14 2023-05-01 欣興電子股份有限公司 電鍍設備與電鍍方法

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EP1360348A1 (en) 2003-11-12
US20020079230A1 (en) 2002-06-27
US6802946B2 (en) 2004-10-12
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US7435323B2 (en) 2008-10-14
KR20040005866A (ko) 2004-01-16

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