TW514998B - Wiring substrate manufacturing method - Google Patents

Wiring substrate manufacturing method Download PDF

Info

Publication number
TW514998B
TW514998B TW090129059A TW90129059A TW514998B TW 514998 B TW514998 B TW 514998B TW 090129059 A TW090129059 A TW 090129059A TW 90129059 A TW90129059 A TW 90129059A TW 514998 B TW514998 B TW 514998B
Authority
TW
Taiwan
Prior art keywords
wiring
light
manufacturing
substrate
wiring board
Prior art date
Application number
TW090129059A
Other languages
English (en)
Chinese (zh)
Inventor
Toshihiko Tanaka
Masaharu Kubo
Takashi Hattori
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW514998B publication Critical patent/TW514998B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54—Absorbers, e.g. of opaque materials
    • G03F1/56—Organic absorbers, e.g. of photo-resists
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
TW090129059A 2001-01-29 2001-11-23 Wiring substrate manufacturing method TW514998B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001019774A JP2002221801A (ja) 2001-01-29 2001-01-29 配線基板の製造方法

Publications (1)

Publication Number Publication Date
TW514998B true TW514998B (en) 2002-12-21

Family

ID=18885591

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090129059A TW514998B (en) 2001-01-29 2001-11-23 Wiring substrate manufacturing method

Country Status (4)

Country Link
US (1) US7040011B2 (https=)
JP (1) JP2002221801A (https=)
KR (1) KR20020063489A (https=)
TW (1) TW514998B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416204B (zh) * 2009-04-30 2013-11-21 Innolux Corp 電容式觸控螢幕的製作方法
CN105453706A (zh) * 2013-08-29 2016-03-30 东洋铝株式会社 安装发光部件用挠性印刷基板和安装发光部件的挠性印刷基板

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US6933331B2 (en) 1998-05-22 2005-08-23 Nanoproducts Corporation Nanotechnology for drug delivery, contrast agents and biomedical implants
US6855426B2 (en) 2001-08-08 2005-02-15 Nanoproducts Corporation Methods for producing composite nanoparticles
US8003513B2 (en) 2002-09-27 2011-08-23 Medtronic Minimed, Inc. Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures
US20040061232A1 (en) * 2002-09-27 2004-04-01 Medtronic Minimed, Inc. Multilayer substrate
US7708974B2 (en) 2002-12-10 2010-05-04 Ppg Industries Ohio, Inc. Tungsten comprising nanomaterials and related nanotechnology
JP3683891B2 (ja) 2003-01-31 2005-08-17 Ｔｄｋ株式会社 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
EP1649322A4 (en) 2003-07-17 2007-09-19 Honeywell Int Inc PLANARIZATION FILMS FOR ADVANCED MICRO-ELECTRONIC APPLICATIONS AND EQUIPMENT AND METHOD FOR THE PRODUCTION THEREOF
JP4372493B2 (ja) 2003-08-28 2009-11-25 Ｔｄｋ株式会社 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP2005072539A (ja) 2003-08-28 2005-03-17 Tdk Corp セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP4865197B2 (ja) * 2004-06-30 2012-02-01 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US8541797B2 (en) * 2004-11-18 2013-09-24 Koninklijke Philips N.V. Illuminator and method for producing such illuminator
DE602006021102D1 (de) * 2005-07-21 2011-05-19 Shinetsu Chemical Co Photomaskenrohling, Photomaske und deren Herstellungsverfahren
JP4933753B2 (ja) * 2005-07-21 2012-05-16 信越化学工業株式会社 位相シフトマスクブランクおよび位相シフトマスクならびにこれらの製造方法
JP4933754B2 (ja) * 2005-07-21 2012-05-16 信越化学工業株式会社 フォトマスクブランクおよびフォトマスクならびにこれらの製造方法
KR100755436B1 (ko) * 2006-04-28 2007-09-05 전자부품연구원 반도체 기판 관통형 전극 제조방법
JP5035244B2 (ja) * 2006-07-20 2012-09-26 日立化成工業株式会社 光電気混載基板
JP2008151916A (ja) * 2006-12-15 2008-07-03 Shin Etsu Chem Co Ltd 大型フォトマスク基板のリサイクル方法
KR100810491B1 (ko) * 2007-03-02 2008-03-07 삼성전기주식회사 전자소자 패키지 및 그 제조방법
US7932170B1 (en) * 2008-06-23 2011-04-26 Amkor Technology, Inc. Flip chip bump structure and fabrication method
JP6027319B2 (ja) * 2012-03-02 2016-11-16 旭化成株式会社 塗装材及びペリクル
WO2014052759A1 (en) * 2012-09-28 2014-04-03 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Calibrating single plasmonic nanostructures for quantitative biosensing
CN103969941A (zh) * 2014-05-26 2014-08-06 苏州大学 掩膜版及其制备方法和图形化方法
JP6455036B2 (ja) * 2014-09-10 2019-01-23 日立化成株式会社 半導体装置の製造方法
US11158540B2 (en) 2017-05-26 2021-10-26 Applied Materials, Inc. Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process

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US4465749A (en) * 1983-06-20 1984-08-14 Eastman Kodak Company Electrostatic charge differential amplification (CDA) in imaging process
JPH05289307A (ja) 1992-04-13 1993-11-05 Matsushita Electric Ind Co Ltd レチクルおよびレチクル製造方法
KR960014963B1 (ko) * 1993-10-15 1996-10-23 현대전자산업 주식회사 반도체 장치의 제조 방법
EP0731490A3 (en) * 1995-03-02 1998-03-11 Ebara Corporation Ultra-fine microfabrication method using an energy beam
JPH08255981A (ja) 1995-03-16 1996-10-01 Fujitsu Ltd 回路基板形成方法及び回路基板
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JP3004931B2 (ja) 1996-03-28 2000-01-31 ホーヤ株式会社 半導体接続基板の製造方法、及びベアチップ搭載ボード
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416204B (zh) * 2009-04-30 2013-11-21 Innolux Corp 電容式觸控螢幕的製作方法
CN105453706A (zh) * 2013-08-29 2016-03-30 东洋铝株式会社 安装发光部件用挠性印刷基板和安装发光部件的挠性印刷基板

Also Published As

Publication number Publication date
US7040011B2 (en) 2006-05-09
US20020100164A1 (en) 2002-08-01
KR20020063489A (ko) 2002-08-03
JP2002221801A (ja) 2002-08-09

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees