JP2002221801A - 配線基板の製造方法 - Google Patents

配線基板の製造方法

Info

Publication number
JP2002221801A
JP2002221801A JP2001019774A JP2001019774A JP2002221801A JP 2002221801 A JP2002221801 A JP 2002221801A JP 2001019774 A JP2001019774 A JP 2001019774A JP 2001019774 A JP2001019774 A JP 2001019774A JP 2002221801 A JP2002221801 A JP 2002221801A
Authority
JP
Japan
Prior art keywords
wiring board
wiring
manufacturing
light
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001019774A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002221801A5 (https=
Inventor
Toshihiko Tanaka
稔彦 田中
Seiji Kubo
征治 久保
Koji Hattori
孝司 服部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2001019774A priority Critical patent/JP2002221801A/ja
Priority to KR1020010070636A priority patent/KR20020063489A/ko
Priority to TW090129059A priority patent/TW514998B/zh
Priority to US10/045,036 priority patent/US7040011B2/en
Publication of JP2002221801A publication Critical patent/JP2002221801A/ja
Publication of JP2002221801A5 publication Critical patent/JP2002221801A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54—Absorbers, e.g. of opaque materials
    • G03F1/56—Organic absorbers, e.g. of photo-resists
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
JP2001019774A 2001-01-29 2001-01-29 配線基板の製造方法 Pending JP2002221801A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001019774A JP2002221801A (ja) 2001-01-29 2001-01-29 配線基板の製造方法
KR1020010070636A KR20020063489A (ko) 2001-01-29 2001-11-14 배선기판의 제조방법
TW090129059A TW514998B (en) 2001-01-29 2001-11-23 Wiring substrate manufacturing method
US10/045,036 US7040011B2 (en) 2001-01-29 2002-01-15 Wiring substrate manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001019774A JP2002221801A (ja) 2001-01-29 2001-01-29 配線基板の製造方法

Publications (2)

Publication Number Publication Date
JP2002221801A true JP2002221801A (ja) 2002-08-09
JP2002221801A5 JP2002221801A5 (https=) 2005-06-16

Family

ID=18885591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001019774A Pending JP2002221801A (ja) 2001-01-29 2001-01-29 配線基板の製造方法

Country Status (4)

Country Link
US (1) US7040011B2 (https=)
JP (1) JP2002221801A (https=)
KR (1) KR20020063489A (https=)
TW (1) TW514998B (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006500783A (ja) * 2002-09-27 2006-01-05 メドトロニック ミニメド インコーポレイテッド 多層基板
JP2007033469A (ja) * 2005-07-21 2007-02-08 Shin Etsu Chem Co Ltd 位相シフトマスクブランクおよび位相シフトマスクならびにこれらの製造方法
JP2007033470A (ja) * 2005-07-21 2007-02-08 Shin Etsu Chem Co Ltd フォトマスクブランクおよびフォトマスクならびにこれらの製造方法
US7326310B2 (en) 2003-08-28 2008-02-05 Tdk Corporation Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
US7387870B2 (en) 2003-08-28 2008-06-17 Tdk Corporation Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
US7540931B2 (en) 2003-01-31 2009-06-02 Tdk Corporation Method of producing ceramic green sheet and method of producing electronic component using this ceramic green sheet
US7771893B2 (en) 2005-07-21 2010-08-10 Shin-Etsu Chemical Co., Ltd. Photomask blank, photomask and fabrication method thereof
US8003513B2 (en) 2002-09-27 2011-08-23 Medtronic Minimed, Inc. Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures
JP2013182205A (ja) * 2012-03-02 2013-09-12 Asahi Kasei E-Materials Corp 塗装材及びペリクル
WO2015029887A1 (ja) * 2013-08-29 2015-03-05 東洋アルミニウム株式会社 発光部品実装用フレキシブルプリント基板、及び発光部品実装フレキシブルプリント基板
JP2016058581A (ja) * 2014-09-10 2016-04-21 日立化成株式会社 半導体装置の製造方法
WO2018217481A1 (en) * 2017-05-26 2018-11-29 Applied Materials, Inc. Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6933331B2 (en) 1998-05-22 2005-08-23 Nanoproducts Corporation Nanotechnology for drug delivery, contrast agents and biomedical implants
US6855426B2 (en) 2001-08-08 2005-02-15 Nanoproducts Corporation Methods for producing composite nanoparticles
US7708974B2 (en) 2002-12-10 2010-05-04 Ppg Industries Ohio, Inc. Tungsten comprising nanomaterials and related nanotechnology
EP1649322A4 (en) 2003-07-17 2007-09-19 Honeywell Int Inc PLANARIZATION FILMS FOR ADVANCED MICRO-ELECTRONIC APPLICATIONS AND EQUIPMENT AND METHOD FOR THE PRODUCTION THEREOF
JP4865197B2 (ja) * 2004-06-30 2012-02-01 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US8541797B2 (en) * 2004-11-18 2013-09-24 Koninklijke Philips N.V. Illuminator and method for producing such illuminator
KR100755436B1 (ko) * 2006-04-28 2007-09-05 전자부품연구원 반도체 기판 관통형 전극 제조방법
JP5035244B2 (ja) * 2006-07-20 2012-09-26 日立化成工業株式会社 光電気混載基板
JP2008151916A (ja) * 2006-12-15 2008-07-03 Shin Etsu Chem Co Ltd 大型フォトマスク基板のリサイクル方法
KR100810491B1 (ko) * 2007-03-02 2008-03-07 삼성전기주식회사 전자소자 패키지 및 그 제조방법
US7932170B1 (en) * 2008-06-23 2011-04-26 Amkor Technology, Inc. Flip chip bump structure and fabrication method
TWI416204B (zh) * 2009-04-30 2013-11-21 Innolux Corp 電容式觸控螢幕的製作方法
WO2014052759A1 (en) * 2012-09-28 2014-04-03 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Calibrating single plasmonic nanostructures for quantitative biosensing
CN103969941A (zh) * 2014-05-26 2014-08-06 苏州大学 掩膜版及其制备方法和图形化方法

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US4465749A (en) * 1983-06-20 1984-08-14 Eastman Kodak Company Electrostatic charge differential amplification (CDA) in imaging process
JPH05289307A (ja) 1992-04-13 1993-11-05 Matsushita Electric Ind Co Ltd レチクルおよびレチクル製造方法
KR960014963B1 (ko) * 1993-10-15 1996-10-23 현대전자산업 주식회사 반도체 장치의 제조 방법
EP0731490A3 (en) * 1995-03-02 1998-03-11 Ebara Corporation Ultra-fine microfabrication method using an energy beam
JPH08255981A (ja) 1995-03-16 1996-10-01 Fujitsu Ltd 回路基板形成方法及び回路基板
US5666177A (en) * 1996-02-26 1997-09-09 Industrial Technology Research Institute Black matrix for liquid crystal display
JP3004931B2 (ja) 1996-03-28 2000-01-31 ホーヤ株式会社 半導体接続基板の製造方法、及びベアチップ搭載ボード
US5676853A (en) * 1996-05-21 1997-10-14 Micron Display Technology, Inc. Mask for forming features on a semiconductor substrate and a method for forming the mask
US5718991A (en) * 1996-12-27 1998-02-17 Industrial Technology Research Institute Method for making photomasks having regions of different light transmissivities
JPH10282635A (ja) * 1997-04-09 1998-10-23 Sony Corp パターンデータ補正方法、電子線描画方法、フォトマスク及びその作製方法、露光方法、半導体装置及びその製造方法、並びにパターンデータ補正装置

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006500783A (ja) * 2002-09-27 2006-01-05 メドトロニック ミニメド インコーポレイテッド 多層基板
US8003513B2 (en) 2002-09-27 2011-08-23 Medtronic Minimed, Inc. Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures
US7781328B2 (en) 2002-09-27 2010-08-24 Medtronic Minimed, Inc. Multilayer substrate
US7540931B2 (en) 2003-01-31 2009-06-02 Tdk Corporation Method of producing ceramic green sheet and method of producing electronic component using this ceramic green sheet
US7387870B2 (en) 2003-08-28 2008-06-17 Tdk Corporation Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
US7326310B2 (en) 2003-08-28 2008-02-05 Tdk Corporation Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
US7771893B2 (en) 2005-07-21 2010-08-10 Shin-Etsu Chemical Co., Ltd. Photomask blank, photomask and fabrication method thereof
JP2007033470A (ja) * 2005-07-21 2007-02-08 Shin Etsu Chem Co Ltd フォトマスクブランクおよびフォトマスクならびにこれらの製造方法
JP2007033469A (ja) * 2005-07-21 2007-02-08 Shin Etsu Chem Co Ltd 位相シフトマスクブランクおよび位相シフトマスクならびにこれらの製造方法
TWI480678B (zh) * 2005-07-21 2015-04-11 信越化學工業股份有限公司 光罩空白基板、光罩及其製造方法
JP2013182205A (ja) * 2012-03-02 2013-09-12 Asahi Kasei E-Materials Corp 塗装材及びペリクル
WO2015029887A1 (ja) * 2013-08-29 2015-03-05 東洋アルミニウム株式会社 発光部品実装用フレキシブルプリント基板、及び発光部品実装フレキシブルプリント基板
JPWO2015029887A1 (ja) * 2013-08-29 2017-03-02 東洋アルミニウム株式会社 発光部品実装用フレキシブルプリント基板、及び発光部品実装フレキシブルプリント基板
TWI633629B (zh) * 2013-08-29 2018-08-21 東洋鋁股份有限公司 Flexible printed circuit board for mounting light-emitting parts and flexible printed circuit board for light-emitting parts
JP2016058581A (ja) * 2014-09-10 2016-04-21 日立化成株式会社 半導体装置の製造方法
WO2018217481A1 (en) * 2017-05-26 2018-11-29 Applied Materials, Inc. Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process
US11158540B2 (en) 2017-05-26 2021-10-26 Applied Materials, Inc. Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process

Also Published As

Publication number Publication date
TW514998B (en) 2002-12-21
US7040011B2 (en) 2006-05-09
US20020100164A1 (en) 2002-08-01
KR20020063489A (ko) 2002-08-03

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