JP2002221801A5 - - Google Patents

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Publication number
JP2002221801A5
JP2002221801A5 JP2001019774A JP2001019774A JP2002221801A5 JP 2002221801 A5 JP2002221801 A5 JP 2002221801A5 JP 2001019774 A JP2001019774 A JP 2001019774A JP 2001019774 A JP2001019774 A JP 2001019774A JP 2002221801 A5 JP2002221801 A5 JP 2002221801A5
Authority
JP
Japan
Prior art keywords
manufacturing
wiring
substrate
wiring board
multilayer wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001019774A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002221801A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001019774A priority Critical patent/JP2002221801A/ja
Priority claimed from JP2001019774A external-priority patent/JP2002221801A/ja
Priority to KR1020010070636A priority patent/KR20020063489A/ko
Priority to TW090129059A priority patent/TW514998B/zh
Priority to US10/045,036 priority patent/US7040011B2/en
Publication of JP2002221801A publication Critical patent/JP2002221801A/ja
Publication of JP2002221801A5 publication Critical patent/JP2002221801A5/ja
Pending legal-status Critical Current

Links

JP2001019774A 2001-01-29 2001-01-29 配線基板の製造方法 Pending JP2002221801A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001019774A JP2002221801A (ja) 2001-01-29 2001-01-29 配線基板の製造方法
KR1020010070636A KR20020063489A (ko) 2001-01-29 2001-11-14 배선기판의 제조방법
TW090129059A TW514998B (en) 2001-01-29 2001-11-23 Wiring substrate manufacturing method
US10/045,036 US7040011B2 (en) 2001-01-29 2002-01-15 Wiring substrate manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001019774A JP2002221801A (ja) 2001-01-29 2001-01-29 配線基板の製造方法

Publications (2)

Publication Number Publication Date
JP2002221801A JP2002221801A (ja) 2002-08-09
JP2002221801A5 true JP2002221801A5 (https=) 2005-06-16

Family

ID=18885591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001019774A Pending JP2002221801A (ja) 2001-01-29 2001-01-29 配線基板の製造方法

Country Status (4)

Country Link
US (1) US7040011B2 (https=)
JP (1) JP2002221801A (https=)
KR (1) KR20020063489A (https=)
TW (1) TW514998B (https=)

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Publication number Priority date Publication date Assignee Title
US6933331B2 (en) 1998-05-22 2005-08-23 Nanoproducts Corporation Nanotechnology for drug delivery, contrast agents and biomedical implants
US6855426B2 (en) 2001-08-08 2005-02-15 Nanoproducts Corporation Methods for producing composite nanoparticles
US8003513B2 (en) 2002-09-27 2011-08-23 Medtronic Minimed, Inc. Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures
US20040061232A1 (en) * 2002-09-27 2004-04-01 Medtronic Minimed, Inc. Multilayer substrate
US7708974B2 (en) 2002-12-10 2010-05-04 Ppg Industries Ohio, Inc. Tungsten comprising nanomaterials and related nanotechnology
JP3683891B2 (ja) 2003-01-31 2005-08-17 Ｔｄｋ株式会社 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
EP1649322A4 (en) 2003-07-17 2007-09-19 Honeywell Int Inc PLANARIZATION FILMS FOR ADVANCED MICRO-ELECTRONIC APPLICATIONS AND EQUIPMENT AND METHOD FOR THE PRODUCTION THEREOF
JP4372493B2 (ja) 2003-08-28 2009-11-25 Ｔｄｋ株式会社 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP2005072539A (ja) 2003-08-28 2005-03-17 Tdk Corp セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP4865197B2 (ja) * 2004-06-30 2012-02-01 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US8541797B2 (en) * 2004-11-18 2013-09-24 Koninklijke Philips N.V. Illuminator and method for producing such illuminator
DE602006021102D1 (de) * 2005-07-21 2011-05-19 Shinetsu Chemical Co Photomaskenrohling, Photomaske und deren Herstellungsverfahren
JP4933753B2 (ja) * 2005-07-21 2012-05-16 信越化学工業株式会社 位相シフトマスクブランクおよび位相シフトマスクならびにこれらの製造方法
JP4933754B2 (ja) * 2005-07-21 2012-05-16 信越化学工業株式会社 フォトマスクブランクおよびフォトマスクならびにこれらの製造方法
KR100755436B1 (ko) * 2006-04-28 2007-09-05 전자부품연구원 반도체 기판 관통형 전극 제조방법
JP5035244B2 (ja) * 2006-07-20 2012-09-26 日立化成工業株式会社 光電気混載基板
JP2008151916A (ja) * 2006-12-15 2008-07-03 Shin Etsu Chem Co Ltd 大型フォトマスク基板のリサイクル方法
KR100810491B1 (ko) * 2007-03-02 2008-03-07 삼성전기주식회사 전자소자 패키지 및 그 제조방법
US7932170B1 (en) * 2008-06-23 2011-04-26 Amkor Technology, Inc. Flip chip bump structure and fabrication method
TWI416204B (zh) * 2009-04-30 2013-11-21 Innolux Corp 電容式觸控螢幕的製作方法
JP6027319B2 (ja) * 2012-03-02 2016-11-16 旭化成株式会社 塗装材及びペリクル
WO2014052759A1 (en) * 2012-09-28 2014-04-03 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Calibrating single plasmonic nanostructures for quantitative biosensing
WO2015029887A1 (ja) * 2013-08-29 2015-03-05 東洋アルミニウム株式会社 発光部品実装用フレキシブルプリント基板、及び発光部品実装フレキシブルプリント基板
CN103969941A (zh) * 2014-05-26 2014-08-06 苏州大学 掩膜版及其制备方法和图形化方法
JP6455036B2 (ja) * 2014-09-10 2019-01-23 日立化成株式会社 半導体装置の製造方法
US11158540B2 (en) 2017-05-26 2021-10-26 Applied Materials, Inc. Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4465749A (en) * 1983-06-20 1984-08-14 Eastman Kodak Company Electrostatic charge differential amplification (CDA) in imaging process
JPH05289307A (ja) 1992-04-13 1993-11-05 Matsushita Electric Ind Co Ltd レチクルおよびレチクル製造方法
KR960014963B1 (ko) * 1993-10-15 1996-10-23 현대전자산업 주식회사 반도체 장치의 제조 방법
EP0731490A3 (en) * 1995-03-02 1998-03-11 Ebara Corporation Ultra-fine microfabrication method using an energy beam
JPH08255981A (ja) 1995-03-16 1996-10-01 Fujitsu Ltd 回路基板形成方法及び回路基板
US5666177A (en) * 1996-02-26 1997-09-09 Industrial Technology Research Institute Black matrix for liquid crystal display
JP3004931B2 (ja) 1996-03-28 2000-01-31 ホーヤ株式会社 半導体接続基板の製造方法、及びベアチップ搭載ボード
US5676853A (en) * 1996-05-21 1997-10-14 Micron Display Technology, Inc. Mask for forming features on a semiconductor substrate and a method for forming the mask
US5718991A (en) * 1996-12-27 1998-02-17 Industrial Technology Research Institute Method for making photomasks having regions of different light transmissivities
JPH10282635A (ja) * 1997-04-09 1998-10-23 Sony Corp パターンデータ補正方法、電子線描画方法、フォトマスク及びその作製方法、露光方法、半導体装置及びその製造方法、並びにパターンデータ補正装置

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