JP2003282391A5 - - Google Patents
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- Publication number
- JP2003282391A5 JP2003282391A5 JP2001381685A JP2001381685A JP2003282391A5 JP 2003282391 A5 JP2003282391 A5 JP 2003282391A5 JP 2001381685 A JP2001381685 A JP 2001381685A JP 2001381685 A JP2001381685 A JP 2001381685A JP 2003282391 A5 JP2003282391 A5 JP 2003282391A5
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- manufacturing
- circuit device
- photomask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 28
- 238000004519 manufacturing process Methods 0.000 claims 27
- 239000011347 resin Substances 0.000 claims 8
- 229920005989 resin Polymers 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 230000003287 optical effect Effects 0.000 claims 4
- 238000010894 electron beam technology Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011368 organic material Substances 0.000 claims 1
- 230000008707 rearrangement Effects 0.000 claims 1
- 230000007261 regionalization Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001381685A JP3827572B2 (ja) | 2001-12-14 | 2001-12-14 | マルチチップモジュールの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001381685A JP3827572B2 (ja) | 2001-12-14 | 2001-12-14 | マルチチップモジュールの製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002520281A Division JP3576156B2 (ja) | 2000-08-15 | 2001-08-15 | 半導体集積回路装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003282391A JP2003282391A (ja) | 2003-10-03 |
| JP2003282391A5 true JP2003282391A5 (https=) | 2005-06-16 |
| JP3827572B2 JP3827572B2 (ja) | 2006-09-27 |
Family
ID=29227637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001381685A Expired - Fee Related JP3827572B2 (ja) | 2001-12-14 | 2001-12-14 | マルチチップモジュールの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3827572B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5823805B2 (ja) * | 2011-10-05 | 2015-11-25 | 株式会社アルバック | タングステン遮光膜の製造方法、タングステン遮光膜 |
| JP6601173B2 (ja) * | 2015-11-12 | 2019-11-06 | ウシオ電機株式会社 | 露光装置、基板製造システム、露光方法、および基板製造方法 |
| CN113471061B (zh) * | 2021-06-30 | 2024-07-16 | 颀中科技（苏州）有限公司 | 晶圆表面介电层的制备方法、晶圆结构及凸块的成型方法 |
-
2001
- 2001-12-14 JP JP2001381685A patent/JP3827572B2/ja not_active Expired - Fee Related
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