JP3827572B2 - マルチチップモジュールの製造方法 - Google Patents

マルチチップモジュールの製造方法 Download PDF

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Publication number
JP3827572B2
JP3827572B2 JP2001381685A JP2001381685A JP3827572B2 JP 3827572 B2 JP3827572 B2 JP 3827572B2 JP 2001381685 A JP2001381685 A JP 2001381685A JP 2001381685 A JP2001381685 A JP 2001381685A JP 3827572 B2 JP3827572 B2 JP 3827572B2
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Japan
Prior art keywords
mask
light
photomask
pattern
integrated circuit
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Expired - Fee Related
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JP2001381685A
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English (en)
Japanese (ja)
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JP2003282391A5 (https=
JP2003282391A (ja
Inventor
恒男 寺澤
稔彦 田中
浩 宮崎
昇雄 長谷川
和孝 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
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Renesas Technology Corp
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Priority to JP2001381685A priority Critical patent/JP3827572B2/ja
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  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Semiconductor Memories (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2001381685A 2001-12-14 2001-12-14 マルチチップモジュールの製造方法 Expired - Fee Related JP3827572B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001381685A JP3827572B2 (ja) 2001-12-14 2001-12-14 マルチチップモジュールの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001381685A JP3827572B2 (ja) 2001-12-14 2001-12-14 マルチチップモジュールの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002520281A Division JP3576156B2 (ja) 2000-08-15 2001-08-15 半導体集積回路装置の製造方法

Publications (3)

Publication Number Publication Date
JP2003282391A JP2003282391A (ja) 2003-10-03
JP2003282391A5 JP2003282391A5 (https=) 2005-06-16
JP3827572B2 true JP3827572B2 (ja) 2006-09-27

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ID=29227637

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JP2001381685A Expired - Fee Related JP3827572B2 (ja) 2001-12-14 2001-12-14 マルチチップモジュールの製造方法

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JP (1) JP3827572B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5823805B2 (ja) * 2011-10-05 2015-11-25 株式会社アルバック タングステン遮光膜の製造方法、タングステン遮光膜
JP6601173B2 (ja) * 2015-11-12 2019-11-06 ウシオ電機株式会社 露光装置、基板製造システム、露光方法、および基板製造方法
CN113471061B (zh) * 2021-06-30 2024-07-16 颀中科技（苏州）有限公司 晶圆表面介电层的制备方法、晶圆结构及凸块的成型方法

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Publication number Publication date
JP2003282391A (ja) 2003-10-03

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