TW488191B - Device assembly device - Google Patents
Device assembly device Download PDFInfo
- Publication number
- TW488191B TW488191B TW090101773A TW90101773A TW488191B TW 488191 B TW488191 B TW 488191B TW 090101773 A TW090101773 A TW 090101773A TW 90101773 A TW90101773 A TW 90101773A TW 488191 B TW488191 B TW 488191B
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- assembly
- head
- section
- axis direction
- Prior art date
Links
- 230000007246 mechanism Effects 0.000 claims description 42
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 9
- 230000002079 cooperative effect Effects 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 abstract description 6
- 238000012546 transfer Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000012937 correction Methods 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012805 post-processing Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000004886 head movement Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000075828A JP2001267798A (ja) | 2000-03-17 | 2000-03-17 | 部品装着装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW488191B true TW488191B (en) | 2002-05-21 |
Family
ID=18593659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090101773A TW488191B (en) | 2000-03-17 | 2001-01-30 | Device assembly device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2001267798A (enExample) |
| KR (1) | KR20010090483A (enExample) |
| CN (2) | CN1183818C (enExample) |
| TW (1) | TW488191B (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003067757A1 (en) * | 2002-02-06 | 2003-08-14 | Mirim Intellectual Robot Technology Co., Ltd | Blank mounting apparatus for fabrication of quartz oscillator |
| JP4203303B2 (ja) * | 2002-03-28 | 2008-12-24 | Juki株式会社 | 電子部品実装装置 |
| DE10236004B4 (de) * | 2002-08-06 | 2007-08-23 | Siemens Ag | Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen |
| JP2004103923A (ja) | 2002-09-11 | 2004-04-02 | Tdk Corp | 電子部品の実装装置および実装方法 |
| JP4147963B2 (ja) * | 2003-02-10 | 2008-09-10 | 松下電器産業株式会社 | 電子部品搭載装置および電子部品搭載方法 |
| JP3879679B2 (ja) * | 2003-02-25 | 2007-02-14 | 松下電器産業株式会社 | 電子部品搭載装置および電子部品搭載方法 |
| CN1592574B (zh) * | 2003-09-01 | 2010-06-09 | 重机公司 | 电子器件安装机中的电子器件的吸附位置修正装置 |
| KR100552884B1 (ko) * | 2003-11-04 | 2006-02-20 | 티디케이가부시기가이샤 | 전자 부품을 장착하기 위한 장치 및 방법 |
| KR101009670B1 (ko) * | 2004-03-30 | 2011-01-19 | 엘지디스플레이 주식회사 | 검사 장비 |
| US20060075631A1 (en) * | 2004-10-05 | 2006-04-13 | Case Steven K | Pick and place machine with improved component pick up inspection |
| CN100359770C (zh) * | 2004-12-31 | 2008-01-02 | 技嘉科技股份有限公司 | 一种针脚座送料装置 |
| DE102005013283B4 (de) * | 2005-03-22 | 2008-05-08 | Siemens Ag | Bestückautomat zum Bestücken von Substraten mit elektrischen Bauelementen |
| KR101308467B1 (ko) * | 2009-08-04 | 2013-09-16 | 엘지디스플레이 주식회사 | 전자 부품 실장 장치 및 방법 |
| CN101662928B (zh) * | 2009-09-14 | 2011-07-06 | 邓智军 | 一种具有影像定位的电路板校位装置和钻铣装置 |
| CN102641821A (zh) * | 2011-02-17 | 2012-08-22 | 一诠精密工业股份有限公司 | 用于黏着光学透镜的点胶机 |
| JP6166278B2 (ja) * | 2012-11-27 | 2017-07-26 | 富士機械製造株式会社 | 部品実装機 |
| CN104062073A (zh) * | 2013-03-20 | 2014-09-24 | 鸿富锦精密工业(深圳)有限公司 | 动平衡检测装置 |
| CN103220900B (zh) * | 2013-04-09 | 2016-10-05 | 深圳市东旭发自动化有限公司 | 一种自动贴片机 |
| JP6135598B2 (ja) * | 2013-08-20 | 2017-05-31 | 株式会社村田製作所 | チップの振込装置 |
| CN103841764B (zh) * | 2014-03-15 | 2017-06-06 | 深圳市鹰眼在线电子科技有限公司 | Fpc补强片智能贴装机 |
| KR101465125B1 (ko) * | 2014-04-25 | 2014-11-26 | 안재은 | 오링 자동 조립 장치 |
| CN104105356B (zh) * | 2014-07-30 | 2017-04-05 | 东莞市新泽谷机械制造股份有限公司 | 双叉片定位送料机构 |
| CN105149924A (zh) * | 2015-09-09 | 2015-12-16 | 舒建文 | 一种贴件机 |
| CN105722382A (zh) * | 2016-03-23 | 2016-06-29 | 广东工业大学 | 一种设有横置式同步供料机构的贴片机及供料方法 |
| JP7018709B2 (ja) * | 2017-01-24 | 2022-02-14 | Thk株式会社 | 加工制御システム、及び運動案内装置 |
| CN107454820A (zh) * | 2017-08-03 | 2017-12-08 | 江门市高翔电气智能化有限公司 | 一种插件机 |
| KR20190091018A (ko) * | 2018-01-26 | 2019-08-05 | 한화정밀기계 주식회사 | 부품 실장 장치 |
| CN109287112B (zh) * | 2018-09-21 | 2020-12-29 | 创维电子器件(宜春)有限公司 | 一种pcba自动组装设备 |
| CN109247008A (zh) * | 2018-10-30 | 2019-01-18 | 重庆隆成电子设备有限公司 | 一种软硬贴合机及贴片方法 |
| CN109348701B (zh) * | 2018-12-04 | 2023-12-15 | 东莞市南部佳永电子有限公司 | 振动型管式飞达 |
| CN113035745B (zh) * | 2021-02-25 | 2022-03-18 | 东莞普莱信智能技术有限公司 | 一种芯片贴装装置 |
| CN114496848A (zh) * | 2022-01-06 | 2022-05-13 | 浙江鼎炬电子科技股份有限公司 | 一种半导体元件组装方法 |
| IT202300025071A1 (it) * | 2023-11-24 | 2025-05-24 | Gd Spa | Una stazione operativa per alimentare dei componenti elettronici, in particolare dei microprocessori, in una macchina confezionatrice di articoli |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4765993A (en) * | 1987-01-20 | 1988-08-23 | Owades Joseph L | Preparation of alcohol-free barley malt-based beverage |
| JPH0780108B2 (ja) * | 1988-10-08 | 1995-08-30 | ティーディーケイ株式会社 | 部品搭載機におけるランダム搭載方法 |
| JPH03257896A (ja) * | 1990-03-07 | 1991-11-18 | Sanyo Electric Co Ltd | 部品供給装置 |
| JP3165289B2 (ja) * | 1993-07-12 | 2001-05-14 | ヤマハ発動機株式会社 | 表面実装機 |
| JP3336774B2 (ja) * | 1994-11-15 | 2002-10-21 | 松下電器産業株式会社 | 電子部品実装装置 |
| JPH11330799A (ja) * | 1998-05-21 | 1999-11-30 | Sony Corp | 部品装着装置 |
| JPH11340686A (ja) * | 1998-05-28 | 1999-12-10 | Sony Corp | チップ部品供給方法及び装置 |
| JP3562325B2 (ja) * | 1998-07-16 | 2004-09-08 | 松下電器産業株式会社 | 電子部品の実装方法 |
-
2000
- 2000-03-17 JP JP2000075828A patent/JP2001267798A/ja active Pending
-
2001
- 2001-01-30 TW TW090101773A patent/TW488191B/zh not_active IP Right Cessation
- 2001-03-16 CN CNB011120088A patent/CN1183818C/zh not_active Expired - Fee Related
- 2001-03-16 KR KR1020010013728A patent/KR20010090483A/ko not_active Ceased
- 2001-03-16 CN CNB200410083513XA patent/CN1323574C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001267798A (ja) | 2001-09-28 |
| KR20010090483A (ko) | 2001-10-18 |
| CN1183818C (zh) | 2005-01-05 |
| CN1592575A (zh) | 2005-03-09 |
| CN1317926A (zh) | 2001-10-17 |
| CN1323574C (zh) | 2007-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW488191B (en) | Device assembly device | |
| CN101740418B (zh) | 元件安装设备和元件安装方法 | |
| JPH09246789A (ja) | 電子部品実装装置 | |
| CN105393652B (zh) | 元件安装机 | |
| JPH09307288A (ja) | 電子部品実装装置 | |
| CN1819416A (zh) | 线性电动机装置 | |
| JP5199947B2 (ja) | 部品実装装置 | |
| JP2008251771A (ja) | 部品実装装置 | |
| CN107615903B (zh) | 元件安装装置、元件安装方法 | |
| JP3245409B2 (ja) | 半導体装置 | |
| JP2011249646A (ja) | 動作時間調整方法 | |
| JP6990309B2 (ja) | 表面実装機 | |
| CN114271043A (zh) | 元件安装机 | |
| JP2000091796A (ja) | 部品装着装置 | |
| JP2002057497A (ja) | 部品装着装置 | |
| JP3165289B2 (ja) | 表面実装機 | |
| JP6242478B2 (ja) | 部品装着装置 | |
| JP2000174158A (ja) | ボールマウント装置 | |
| JP3512598B2 (ja) | チップ部品装着装置 | |
| JP2729845B2 (ja) | 電子部品搭載装置 | |
| JP2824535B2 (ja) | 電子部品搭載方法 | |
| JP2576209Y2 (ja) | 電子部品搭載装置 | |
| JP2740682B2 (ja) | 電子部品搭載装置 | |
| WO2003081975A1 (fr) | Appareil et procede de montage | |
| JPH0515499U (ja) | 電子部品搭載装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |