TW478027B - Power semiconductor device having a protection circuit - Google Patents

Power semiconductor device having a protection circuit Download PDF

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Publication number
TW478027B
TW478027B TW090105993A TW90105993A TW478027B TW 478027 B TW478027 B TW 478027B TW 090105993 A TW090105993 A TW 090105993A TW 90105993 A TW90105993 A TW 90105993A TW 478027 B TW478027 B TW 478027B
Authority
TW
Taiwan
Prior art keywords
gate
power
source
resistor
semiconductor device
Prior art date
Application number
TW090105993A
Other languages
English (en)
Chinese (zh)
Inventor
Tatsuo Yoneda
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of TW478027B publication Critical patent/TW478027B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/668Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/08Modifications for protecting switching circuit against overcurrent or overvoltage
    • H03K17/082Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
    • H03K17/0822Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit in field-effect transistor switches
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/101Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
    • H10D84/141VDMOS having built-in components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/811Combinations of field-effect devices and one or more diodes, capacitors or resistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electronic Switches (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Thin Film Transistor (AREA)
TW090105993A 2000-03-24 2001-03-14 Power semiconductor device having a protection circuit TW478027B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000085422A JP2001274402A (ja) 2000-03-24 2000-03-24 パワー半導体装置

Publications (1)

Publication Number Publication Date
TW478027B true TW478027B (en) 2002-03-01

Family

ID=18601762

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090105993A TW478027B (en) 2000-03-24 2001-03-14 Power semiconductor device having a protection circuit

Country Status (7)

Country Link
US (1) US6507088B2 (enExample)
EP (1) EP1137068B1 (enExample)
JP (1) JP2001274402A (enExample)
KR (1) KR100362218B1 (enExample)
CN (1) CN1162910C (enExample)
DE (1) DE60133851D1 (enExample)
TW (1) TW478027B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4946123B2 (ja) * 2006-03-27 2012-06-06 セイコーエプソン株式会社 半導体装置、電気光学装置および電子機器
US7511357B2 (en) * 2007-04-20 2009-03-31 Force-Mos Technology Corporation Trenched MOSFETs with improved gate-drain (GD) clamp diodes
GB2471223B (en) * 2008-04-16 2013-01-23 Bourns Inc Current limiting surge protection device.
US8068322B2 (en) * 2008-07-31 2011-11-29 Honeywell International Inc. Electronic circuit breaker apparatus and systems
CN101814527A (zh) * 2010-04-22 2010-08-25 复旦大学 一种使用光电子注入进行电导调制的功率器件与方法
CN102158228A (zh) * 2011-04-19 2011-08-17 复旦大学 极低电压毫米波注入锁定二分频器
JP5959162B2 (ja) * 2011-06-09 2016-08-02 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の製造方法
JP2013065759A (ja) * 2011-09-20 2013-04-11 Toshiba Corp 半導体装置
JP6056299B2 (ja) * 2012-09-13 2017-01-11 富士電機株式会社 半導体装置とワイヤオープン不良の検出方法
US8816725B2 (en) * 2012-12-31 2014-08-26 Nxp B.V. High-voltage electrical switch by series connected semiconductor switches
JP2014216573A (ja) 2013-04-26 2014-11-17 株式会社東芝 半導体装置
JP6218462B2 (ja) * 2013-07-04 2017-10-25 三菱電機株式会社 ワイドギャップ半導体装置
US10468485B2 (en) 2017-05-26 2019-11-05 Allegro Microsystems, Llc Metal-oxide semiconductor (MOS) device structure based on a poly-filled trench isolation region
JP7295047B2 (ja) * 2020-01-22 2023-06-20 株式会社東芝 半導体装置
CN112383293B (zh) * 2020-11-30 2024-07-19 上海维安半导体有限公司 一种智能低边功率开关的控制电路及芯片

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DE1764234A1 (de) * 1968-04-27 1971-07-01 Bosch Gmbh Robert Monolithische Halbleiteranordnung mit integrierten Leistungstransistoren,insbesondere als Spannungsregler fuer Fahrzeuglichtmaschinen
US4404477A (en) * 1978-02-22 1983-09-13 Supertex, Inc. Detection circuit and structure therefor
EP0090280A3 (en) * 1982-03-25 1986-03-19 Nissan Motor Co., Ltd. Semiconductor integrated circuit device and method of making the same
JPH0666472B2 (ja) * 1987-06-22 1994-08-24 日産自動車株式会社 過電流保護機能を備えたmosfet
JPH0749805Y2 (ja) * 1988-06-30 1995-11-13 関西日本電気株式会社 半導体装置
IT1226557B (it) * 1988-07-29 1991-01-24 Sgs Thomson Microelectronics Circuito di controllo della tensione di bloccaggio di un carico induttivo pilotato con un dispositivo di potenza in configurazione "high side driver"
US5172290A (en) 1988-08-10 1992-12-15 Siemens Aktiengesellschaft Gate-source protective circuit for a power mosfet
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DE4120394A1 (de) * 1991-06-20 1992-12-24 Bosch Gmbh Robert Monolithisch integrierte schaltungsanordnung
JP2777307B2 (ja) * 1992-04-28 1998-07-16 株式会社東芝 短絡保護回路
JP3161092B2 (ja) * 1992-11-05 2001-04-25 富士電機株式会社 デュアルゲートmosサイリスタ
DE69420327T2 (de) * 1993-06-22 2000-03-30 Koninklijke Philips Electronics N.V., Eindhoven Halbleiter-Leistungsschaltung
JPH07183781A (ja) * 1993-12-22 1995-07-21 Fuji Electric Co Ltd 半導体装置とその駆動装置
JP3193827B2 (ja) * 1994-04-28 2001-07-30 三菱電機株式会社 半導体パワーモジュールおよび電力変換装置
GB9423076D0 (en) 1994-10-12 1995-01-04 Philips Electronics Uk Ltd A protected switch
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JP4156717B2 (ja) * 1998-01-13 2008-09-24 三菱電機株式会社 半導体装置
JP2982785B2 (ja) * 1998-04-03 1999-11-29 富士電機株式会社 デプレッション型mos半導体素子およびmosパワーic

Also Published As

Publication number Publication date
EP1137068A3 (en) 2006-06-28
EP1137068A2 (en) 2001-09-26
CN1315746A (zh) 2001-10-03
US20010023967A1 (en) 2001-09-27
CN1162910C (zh) 2004-08-18
DE60133851D1 (de) 2008-06-19
KR100362218B1 (ko) 2002-11-23
EP1137068B1 (en) 2008-05-07
KR20010093047A (ko) 2001-10-27
JP2001274402A (ja) 2001-10-05
US6507088B2 (en) 2003-01-14

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees