TW478024B - Die Bonder or Wire Bonder with a suction device for pulling flat and holding down a curved substrate - Google Patents

Die Bonder or Wire Bonder with a suction device for pulling flat and holding down a curved substrate Download PDF

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Publication number
TW478024B
TW478024B TW089126004A TW89126004A TW478024B TW 478024 B TW478024 B TW 478024B TW 089126004 A TW089126004 A TW 089126004A TW 89126004 A TW89126004 A TW 89126004A TW 478024 B TW478024 B TW 478024B
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Taiwan
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substrate
vacuum
suction device
cavity
vacuum gripper
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TW089126004A
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English (en)
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Stefan Behler
Reto Schubiger
Beat Zumbuehl
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Esec Trading Sa
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

478024 A7 B7 五、發明説明（I ) 發明說明 (請先閲讀背面之注意事項再填办 本發明是關於具有一用來拉平和壓制一彎曲基板的吸 取裝置之晶片接合機和/或導線接合機，其型式是陳述於 申請專利範圍第1項的前言部分。 在藉由所謂晶粒接合機將半導體晶片安裝在基板時， 基板是以預定距離的步調輸送於支撐表面上，以致於半 導體晶片可以安裝在所預見的位置。爲了使基板平躺於 支撐表面上，支撐表面具有一鑽孔，其可連接至一真空 來源，用於基板的吸取與壓制。 某些基板-例如，BGA®S(球狀柵極陣列），其已裝有半 導體晶片，且首先塗覆粘劑，然後裝上第二半導體晶片 ，或者，其饋送至導線接合機的接合站，以做導線連接-可以在特定的環境下，彎曲至不能成功吸取基板的程度 本發明之目的是說明一吸取裝置，其可壓制和支撐表 面齊平之彎曲度頗大的基板。 經濟部智慧財產局員工消費合作社印製 本發明由申請專利範圍第1項的特徵組成。有利的實 施例是來自申請專利範圍依附項。 本發明在於穴係支撐表面中所預見者，而可上升和下 降的真空握爪是由撓性及形狀穩定的材料製成。藉由晶 粒接合機，基板總是一致地前進至分配站，在該處施加 粘劑，然後至接合站，在該處安裝次一半導體晶片。藉 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 478024 A7 B7 五、發明説明（2·) 讀· 先 閲 背 τέ 之 注 意 事 項 再 填 由導線接合機，基板總是一致地前進至接合站，在該處 導線連接於半導體晶片與基板之間。在彎曲基板的向前 饋送期間，真空握爪下降至穴內。當基板已到達它的位 置時，真空握爪由舉升缸舉起一預定的距離且施加真空 。在此位置，真空握爪突起越過支撐表面的位準。當真 空握爪接觸彎曲基板下面時，產生一或多或少密封良好 的穴。基板上表面的壓力（大氣壓力）與下面的穴中之壓力 (真空）之間的壓力差具有的效應是，基板平壓於支撐表面 ，使得撓性真空握爪受壓。當過程-粘劑的施加或半導 體晶片或線路的安裝-完成的時候，釋放真空且使舉升 缸下降。依據本發明的解決方案所具有的利益是，在基 板的前向饋送期間，真空握爪位在支撐表面下方，所以 不能干涉基板的前向饋送。 下文將根據圖式更詳細說明本發明之一實施例，其中 圖式並未依照比例。 第1A、B圖示爲用於接收基板之吸取裝置的剖面與平 視圖。 經濟部智慧財產局員工消費合作社印製 第2圖爲又一吸取裝置。 第ΙΑ、B圖顯示一吸取裝置的剖面與平視圖，其具有 一板1，板具有一水平支撐表面2，用於接受基板3。基 板3由一未顯示的輸送裝置一致地向前饋送於一輸送方 向4，到達一處理站，在該處施加粘劑，或在該處裝上一 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） 478024 經濟部智慧財產局員工消費合作社印製 A7 __B7_五、發明説明（3 ) 半導體晶片，或在該處執行已安裝的半導體晶片與基板3 之間的導線連接。板1具有一鑽孔5與一溝槽6，鑽孔5 可連接至一真空源，其可開啓及關閉，溝槽6通往支撐 表面2。溝槽6位於處理站的位置。板1含有四配置成矩 陣形的穴7,其朝向支撐表面2敞開，每一穴配置一下降 的撓性真空握爪8.1至8.4。真空握爪8.1至8.4較佳爲所 謂風箱型真空握爪，其由於折疊而可在它們的縱向壓縮 。四真空握爪8.1至8.4安裝在一載板9上，其由一氣壓 驅動的舉升缸10上下移動於一上行進限制與一下行進限 制之間。下行進限制與上行進限制是由止動件界定。上 行進限制是由，例如，配置於載板9中的螺絲1 1界定， 螺絲頭於舉起舉升缸10時撞擊於板1。藉由螺絲1 1，可 以精密界定真空握爪8.1至8.4於上行進限制時突起至支 撐表面位準上方的距離D。在上行進限制，真空握爪8.1 至8.4突起至支撐表面2的位準上方一距離D，其典型上 是約2公厘。距離D是依基板3的最大曲率而定。在下 行進限制，真空握爪8.1至8.4完全降至個別的穴7中， 以致於基板3的前向饋送可以無阻礙地發生。 在一方面，由於風箱型真空握爪之吸取開口的漸增之 直徑，作用於基板3的力在真空施加時增加，另一方面 ，風箱型真空握爪之剛性增加，其提供對於基板3之吸 取的機械阻力。來自Schmalz公司的圖9類型的風箱型真 ($先閲讀背面之注意事項再填0一 .裝. I) 訂 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 478024 A7 __— _ B7_ 五、發明説明（七） 空握爪已証明是可靠的。 請· 先 閱 讀 背 之 注 意 事 項 再 填 二真空握爪8.1與8.2,其在輸送方向4觀看時係配置 於相同的位準，藉由第一閥12連接至一未顯示的真空源 。二真空握爪8.3與8.4，其在輸送方向4觀看時也配置 於相同的位準，藉由第二閥13連接至真空源。鑽孔5由 第三閥14連接至真空源。 經濟部智慧財產局員工消費合作社印製 操作時，吸取裝置對應於機器的工作循環而操作如下 :舉升缸10首先位於它的下行進限制：真空握爪8.1至 8.4降入穴7中。閥12、13與14關閉··無真空施加至鑽 孔5或施加至真空握爪8.1至8.4。基板3向前饋送。在 基板3已到達它的預見位置時，將舉升缸1〇帶到它的上 行進限制。此外，三閥1 2、1 3與14開啓，以致於真空施 加至鑽孔5與真空握爪8.1至8.4。當一真空握爪接觸基 板3下方時，產生一或多或少密封良好的穴。然後，基 板3上表面的壓力（大氣壓力）與穴下方的壓力（真空）之間 的壓力差具有的效應是，基板3平壓於支撐表面2,使得 真空握爪壓縮。當基板3平躺於支撐表面2時，形成於 溝槽6與基板3之間的穴也充滿真空。因爲溝槽6,基板 3 —方面被吸至處理位置，另一方面被支撐於環繞溝槽6 之支撐表面2的區域上。當過程-粘劑的施加或半導體 晶片或線路的安裝-完成時，三閥12、13與14關閉，且 舉升缸10下降。工作循環完成，次一工作循環開始。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 478024 A7 _B7___ 五、發明説明（$ ) 操作時，經常發生的是，只有二真空握爪8.1與8.2 或只有真空握爪8.3與8.4由基板3遮蓋。儘管如此’當 閥12、13與14的內部流動阻力足夠大時，充分的真空可 以建立在基板3與被遮蓋的真空握爪之間。然後，未被 遮蓋的真空握爪產生洩漏，但進入的空氣之生產能力保 持足夠低，且不能侵害到真空。 三閥12、13與14較佳爲同時開啓和關閉。然而，也 可以開啓閥14,其略爲延遲而施加真空至鑽孔5。 選擇性地，可以有一第二鑽孔15，其敞開進入溝槽6 ，其另一端配置一未顯示的感測器，用於測量真空。在 三閥12、13與14的每一開口後方，感測器檢查鑽孔15 或溝槽6中的真空是否到達一預定値。如果基板3平躺 於支撐表面2上，則鑽孔15或溝槽6中的真空發展，感 測器響應，且執行過程步驟。如果未達成所欲的真空， 則產生一誤差訊息。 第2圖顯示又一吸取裝置的示意圖，四真空握爪8.1 至8.4與鑽孔5連接到單一閥12。二真空握爪8.1與8.2 ，其於輸送方向4觀看時係配置成相鄰，經由一共同的 流動阻擋件16而連接至閥12。二真空握爪8.3與8.4， 其於輸送方向4觀看時也配置成相鄰，經由一共同的流 動阻擋件1 7而連接至閥1 2。鑽孔5經由第三流動阻擋件 1 8，連接到閥1 2。流動阻擋件1 6至18的工作是在對應 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (Φ先閲讀背面之注意事項再填) •裝· 經濟部智慧財產局員工消費合作社印製 478024 A7 B7 _ 五、發明説明（b ) 的真空握爪或鑽孔5未遮蓋時限制洩漏率，以致於其他 遮蓋的真空握爪仍施加吸力至基板3。此流動阻擋件由一 喉部組成，喉部安裝在真空握爪與閥之間的管線中，其 剖面與長度導致所欲的流動阻力。 具有四真空握爪的吸取裝置之設計保証基板的完美壓 制，而最妥當地使用可用面積且最妥當地配合基板輸送 的方式：即，必須考慮，基板須——地饋送至處理站， 且必須在該處保持平躺於支撐表面上。也可使用不同形 狀的真空握爪，矩形、正方形或橢圓形，以取代圓形風 箱型真空握爪。 元件符號說明： 1… 板 2… 支援表面 3… 基板 4… 輸送方向 5… 鑽孔 經濟部智慧財產局員工消費合作社印製 6… 溝槽 7… 穴 8.1-8.4…真空握爪 9… 載板 10··· 舉升缸 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 478024 A7 B7 五、發明説明（q ) 經濟部智慧財產局員工消費合作社印製 1 1… 螺絲 1 2… 閥 1 3… 閥 14… 閥 15··· 鑽孔 1 6… 流動阻擋件 17··· 流動阻擋件 1 8… 流動阻擋件 9- (請先閲讀背面之注意事項再填· :裝·
Mr 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐）

Claims (1)

  1. 478024
    六、申請專利範圍 第89126004號「具有一用來拉平和壓制一彎曲基板的吸取裝 置之晶片或導線接合機」專利案 （90年11月修正） 六申請專利範圍 1. 一種晶片或導線之接合機，其具有一用來拉平和壓制一 在處理站之彎曲基板的吸取裝置，該吸取裝置包括： -一’板，其具有一用於基板的支撐表面，板含有至少一 穴，穴朝向支撐表面敞開： --由撓性材料製成的真空握爪，其位在至少一穴內； -驅動裝置，用於在基板輸送期間，將真空握爪舉起於 支撐表面的位準上方，以施加吸力至基板，及用於使 真空握爪降入穴內；及 -一感測器，用於測量在處理站的基板下方的真空。 2. 如申請專利範圍第1項之晶片或導線之接合機，其中真 空握爪是風箱型。 3·如申請專利範圍第1或2項之晶片或導線之接合機，其 中支撐表面包括一位在處理站一位置處之溝槽及一用於 對溝槽施加真孔之孔；及其中由輸送基板之方向視之’ 至少一穴位在溝槽的一側及至少另一穴位在溝槽另一 側。
TW089126004A 1999-12-14 2000-12-06 Die Bonder or Wire Bonder with a suction device for pulling flat and holding down a curved substrate TW478024B (en)

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SG90213A1 (en) 2002-07-23
US6435492B1 (en) 2002-08-20
HK1032334A2 (en) 2001-07-06
CH695405A5 (de) 2006-04-28
KR100655981B1 (ko) 2006-12-08
KR20010062185A (ko) 2001-07-07
DE10059883A1 (de) 2001-09-20

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