US20020093130A1 - Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate - Google Patents

Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate Download PDF

Info

Publication number
US20020093130A1
US20020093130A1 US09/732,678 US73267800A US2002093130A1 US 20020093130 A1 US20020093130 A1 US 20020093130A1 US 73267800 A US73267800 A US 73267800A US 2002093130 A1 US2002093130 A1 US 2002093130A1
Authority
US
United States
Prior art keywords
substrate
vacuum
supporting surface
suction device
bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US09/732,678
Other versions
US6435492B1 (en
Inventor
Stefan Behler
Reto Schubiger
Beat Zumbuehl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Esec Trading AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Trading AG filed Critical Esec Trading AG
Assigned to ESEC TRADING SA A CORP. OF SWITZERLAND reassignment ESEC TRADING SA A CORP. OF SWITZERLAND ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BEHLER, STEFAN, SCHUBIGER, RETO, ZUMBUEHL, BEAT
Assigned to ESEC TRADING SA reassignment ESEC TRADING SA ASSIGNMENT TO CORRECT ASSIGNEE, PREVIOUSLY RECORDED AT REEL/FRAME 011364/0651 (ASSIGNMENT OF ASSIGNOR'S INTEREST) Assignors: BEHLER, STEFAN, SCHUBIGER, RETO, ZUMBEHL, BEAT
Assigned to ESEC TRADING SA reassignment ESEC TRADING SA CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE ADDRESS, FILED 12-8-00 RECORDED ON REEL 011364, FRAME 0651 ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST. Assignors: BEHLER, STEFAN, SCHUBIGER, RETO, ZUMBEHL, BEAT
Publication of US20020093130A1 publication Critical patent/US20020093130A1/en
Application granted granted Critical
Publication of US6435492B1 publication Critical patent/US6435492B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Definitions

  • the invention concerns a Die Bonder and/or Wire Bonder with a suction device for pulling flat and holding down a curved substrate.
  • the substrate When mounting semiconductor chips on a substrate by means of a so-called Die Bonder, the substrate is transported on a supporting surface in steps of a predetermined distance so that a semiconductor chip can be mounted at the foreseen location.
  • the supporting surface In order that the substrate lies flat on the supporting surface, the supporting surface has a drill hole connectable to a vacuum source for the suction and holding down of the substrate.
  • Some substrates for example BGA®s (Ball Grid Array) which are already equipped with semiconductor chips and which are first to be coated with adhesive and then equipped with a second semiconductor chip or those which are fed to the bonding station of a Wire Bonder for the making of wire connections, can, under certain circumstances, be curved to such an extent that suction of the substrate is unsuccessful.
  • BGA®s All Grid Array
  • the object of the invention is to specify a suction device which can hold down even strongly curved substrates level with the supporting surface.
  • the invention consists in that cavities are foreseen in the supporting surface with raisable and lowerable vacuum grippers made of flexible and in shape stable material.
  • a Die Bonder the substrate is always advanced in steps to the dispensing station where adhesive is applied and then to the bonding station where the next semiconductor chip is mounted.
  • a Wire Bonder the substrate is always advanced in steps to the bonding station where the wires are attached between the semiconductor chip and the substrate.
  • the vacuum grippers are lowered into the cavities.
  • the vacuum grippers are raised by a predetermined distance by means of a lifting cylinder and vacuum is applied. In this position, the vacuum grippers protrude beyond the level of the supporting surface.
  • the solution in accordance with the invention has the advantage that, during forward feed of the substrate, the vacuum grippers are located lowered below the supporting surface and therefore can not interfere with the forward feed of the substrate.
  • FIG. 1A, B a cross-section and a plan view of a suction device for receiving a substrate
  • FIG. 2 a further suction device.
  • FIGS. 1A and 1B show a cross-section and a plan view of a suction device with a plate 1 having a level supporting surface 2 for receiving a substrate 3 .
  • the substrate 3 is fed forwards in steps by a not presented transport arrangement in a transport direction 4 to a processing station where adhesive is applied or where it is equipped with a semiconductor chip or where wire connections are made between a mounted semiconductor chip and the substrate 3 .
  • the plate 1 has a drill hole 5 connectable to a vacuum source which can be switched on and off and a groove 6 let into the supporting surface 2 .
  • the groove 6 is located at the position of the processing station.
  • the plate 1 contains four cavities 7 arranged in a matrix shape which are open towards the supporting surface 2 in each of which a lowered flexible vacuum gripper 8 . 1 to 8 . 4 is arranged.
  • the vacuum grippers 8 . 1 to 8 . 4 are preferably so-called bellow-type vacuum grippers which, thanks to the folds, can be compressed in their longditudinal direction.
  • the four vacuum grippers 8 . 1 to 8 . 4 are mounted on a carrier plate 9 which is moved up and down between an upper travel limit and a lower travel limit by means of a pneumatically driven lifting cylinder 10 .
  • the lower travel limit and the upper travel limit are defined by means of stops.
  • the upper travel limit is defined, for example, by means of screws 11 arranged in the carrier plate 9 the heads of which, on raising the lifting cylinder 10 , strike on the plate 1 .
  • By means of the screws 11 it can be precisely defined by which distance D the vacuum grippers 8 . 1 to 8 . 4 protrude above the level of the supporting surface 2 at the upper travel limit.
  • the vacuum grippers 8 . 1 to 8 . 4 protrude above the level of the supporting surface 2 by a distance D of typically around 2 mm.
  • the distance D is dependent on the maximum curvature of the substrate 3 .
  • the vacuum grippers 8 . 1 to 8 . 4 are located completely lowered within the respective cavity 7 so that the forward feed of the substrate 3 can take place unhindered.
  • the two vacuum grippers 8 . 1 and 8 . 2 which are arranged at the same level when viewed in transport direction 4 are connected to a not presented vacuum source by means of a first valve 12 .
  • the two vacuum grippers 8 . 3 and 8 . 4 which are also arranged at the same level when viewed in transport direction 4 are connected to the vacuum source by means of a second valve 13 .
  • the drill hole 5 is connected to the vacuum source by means of a third valve 14 .
  • the suction device works correspondingly to the working cycle of the machine as follows:
  • the lifting cylinder 10 is first located at its lower travel limit: the vacuum grippers 8 . 1 to 8 . 4 are located lowered into the cavities 7 .
  • the valves 12 , 13 and 14 are closed: No vacuum is applied to the drill hole 5 or to the vacuum grippers 8 . 1 to 8 . 4 .
  • the substrate 3 is fed forward. After the substrate 3 has reached its foreseen position, the lifting cylinder 10 is brought to its upper travel limit. Furthermore, the three valves 12 , 13 and 14 are opened so that vacuum is applied to the drill hole 5 and the vacuum grippers 8 . 1 to 8 . 4 .
  • valves 12 , 13 and 14 are preferably switched on and off simultaneously. However, it is also possible to open valve 14 which applies vacuum to the drill hole 5 with a slight delay.
  • a second drill hole 15 opening into the groove 6 at the other end of which a not presented sensor is arranged for measuring the vacuum.
  • the sensor checks whether or not the vacuum in the drill hole 15 or in the groove 6 reaches a predetermined value. If the substrate 3 lies flat on the supporting surface 2 , the vacuum in the drill hole 15 or in the groove 6 beneath the substrate develops, the sensor responds and the process step is carried out. If the desired vacuum strength is not achieved, then an error message is produced.
  • FIG. 2 shows a schematic drawing of a further suction device with which the four vacuum grippers 8 . 1 to 8 . 4 and the drill hole 5 are connected to one single valve 12 .
  • the two vacuum grippers 8 . 1 and 8 . 2 which are arranged next to each other when viewed in transport direction 4 are connected to the valve 12 via a common flow resistance 16 .
  • the two vacuum grippers 8 . 3 and 8 . 4 which are also arranged next to each other when viewed in transport direction 4 are connected to the valve 12 via a common flow resistance 17 .
  • the drill hole 5 is connected to the valve 12 via a third flow resistance 18 .
  • the task of the flow resistors 16 to 18 is to limit the leakage rate when the corresponding vacuum grippers or the drill hole 5 are not covered so that the other covered vacuum grippers can nevertheless apply suction to the substrate 3 .
  • a flow resistance consists, for example, of a throat installed in the line between the vacuum gripper and the valve, the cross-section and length of which result in the desired flow resistance.
  • the design of the suction device with four vacuum grippers guarantees perfect holding of the substrate with optimum utilization of the available area and optimum adaptation to the manner in which the substrates are transported: It must namely be taken into consideration that the substrates have to be fed one after the other to the processing station and must be held there flat on the supporting surface.
  • vacuum grippers of a different shape eg, of a rectangular, square or eliptical shape, can also be used.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A Die Bonder or Wire Bonder has a suction device for pulling flat and holding down a curved substrate equipped with or to be equipped with a semiconductor chip onto a supporting surface of a plate. The plate contains at least one cavity open towards the supporting surface in which there is a vacuum gripper made out of flexible material, whereby the vacuum gripper is lowerable into the cavity during transport of the substrate and which is raisable above the level of the supporting surface to apply suction to the substrate.

Description

    BACKGROUND OF THE INVENTION
  • The invention concerns a Die Bonder and/or Wire Bonder with a suction device for pulling flat and holding down a curved substrate. [0001]
  • When mounting semiconductor chips on a substrate by means of a so-called Die Bonder, the substrate is transported on a supporting surface in steps of a predetermined distance so that a semiconductor chip can be mounted at the foreseen location. In order that the substrate lies flat on the supporting surface, the supporting surface has a drill hole connectable to a vacuum source for the suction and holding down of the substrate. [0002]
  • Some substrates, for example BGA®s (Ball Grid Array) which are already equipped with semiconductor chips and which are first to be coated with adhesive and then equipped with a second semiconductor chip or those which are fed to the bonding station of a Wire Bonder for the making of wire connections, can, under certain circumstances, be curved to such an extent that suction of the substrate is unsuccessful. [0003]
  • The object of the invention is to specify a suction device which can hold down even strongly curved substrates level with the supporting surface. [0004]
    • BRIEF DESCRIPTION OF THE INVENTION
  • The invention consists in that cavities are foreseen in the supporting surface with raisable and lowerable vacuum grippers made of flexible and in shape stable material. With a Die Bonder, the substrate is always advanced in steps to the dispensing station where adhesive is applied and then to the bonding station where the next semiconductor chip is mounted. With a Wire Bonder, the substrate is always advanced in steps to the bonding station where the wires are attached between the semiconductor chip and the substrate. During the forward feed of the curved substrate the vacuum grippers are lowered into the cavities. As soon as the substrate has reached its position, the vacuum grippers are raised by a predetermined distance by means of a lifting cylinder and vacuum is applied. In this position, the vacuum grippers protrude beyond the level of the supporting surface. As soon as the vacuum gripper touches the underneath of the curved substrate, a more or less well-sealed cavity is created. The pressure difference between the pressure on the upper surface of the substrate (atmospheric pressure) and the pressure in the cavity on the underneath (vacuum) then has the effect that the substrate is pressed flat against the supporting surface whereby the flexible vacuum gripper is compressed. As soon as the process—application of adhesive or mounting of semiconductor chip or wiring—is completed, the vacuum is released and the lifting cylinder is lowered. The solution in accordance with the invention has the advantage that, during forward feed of the substrate, the vacuum grippers are located lowered below the supporting surface and therefore can not interfere with the forward feed of the substrate. [0005]
  • In the following, an embodiment of the invention is described in more detail based on the drawing which is not to scale.[0006]
    • BRIEF DESCRIPTION OF THE DRAWING FIGURES
  • It is shown in: FIG. 1A, B a cross-section and a plan view of a suction device for receiving a substrate, and [0007]
  • FIG. 2 a further suction device.[0008]
    • DETAILED DESCRIPTION OF THE INVENTION
  • FIGS. 1A and 1B show a cross-section and a plan view of a suction device with a [0009] plate 1 having a level supporting surface 2 for receiving a substrate 3. The substrate 3 is fed forwards in steps by a not presented transport arrangement in a transport direction 4 to a processing station where adhesive is applied or where it is equipped with a semiconductor chip or where wire connections are made between a mounted semiconductor chip and the substrate 3. The plate 1 has a drill hole 5 connectable to a vacuum source which can be switched on and off and a groove 6 let into the supporting surface 2. The groove 6 is located at the position of the processing station. The plate 1 contains four cavities 7 arranged in a matrix shape which are open towards the supporting surface 2 in each of which a lowered flexible vacuum gripper 8.1 to 8.4 is arranged. The vacuum grippers 8.1 to 8.4 are preferably so-called bellow-type vacuum grippers which, thanks to the folds, can be compressed in their longditudinal direction. The four vacuum grippers 8.1 to 8.4 are mounted on a carrier plate 9 which is moved up and down between an upper travel limit and a lower travel limit by means of a pneumatically driven lifting cylinder 10. The lower travel limit and the upper travel limit are defined by means of stops. The upper travel limit is defined, for example, by means of screws 11 arranged in the carrier plate 9 the heads of which, on raising the lifting cylinder 10, strike on the plate 1. By means of the screws 11 it can be precisely defined by which distance D the vacuum grippers 8.1 to 8.4 protrude above the level of the supporting surface 2 at the upper travel limit. At the upper travel limit, the vacuum grippers 8.1 to 8.4 protrude above the level of the supporting surface 2 by a distance D of typically around 2 mm. The distance D is dependent on the maximum curvature of the substrate 3. At the lower travel limit, the vacuum grippers 8.1 to 8.4 are located completely lowered within the respective cavity 7 so that the forward feed of the substrate 3 can take place unhindered.
  • On the one hand, with increasing diameter of the suction opening of the bellow-type vacuum gripper, the force acting upon the [0010] substrate 3 increases when vacuum is applied while, on the other hand, the rigidity of the bellow-type vacuum gripper increases which offers mechanical resistance to the suction of the substrate 3. Bellow-type vacuum grippers of type FG 9 from the company Schmalz have proved to be reliable.
  • The two vacuum grippers [0011] 8.1 and 8.2 which are arranged at the same level when viewed in transport direction 4 are connected to a not presented vacuum source by means of a first valve 12. The two vacuum grippers 8.3 and 8.4 which are also arranged at the same level when viewed in transport direction 4 are connected to the vacuum source by means of a second valve 13. The drill hole 5 is connected to the vacuum source by means of a third valve 14.
  • In operation, the suction device works correspondingly to the working cycle of the machine as follows: The lifting [0012] cylinder 10 is first located at its lower travel limit: the vacuum grippers 8.1 to 8.4 are located lowered into the cavities 7. The valves 12, 13 and 14 are closed: No vacuum is applied to the drill hole 5 or to the vacuum grippers 8.1 to 8.4. The substrate 3 is fed forward. After the substrate 3 has reached its foreseen position, the lifting cylinder 10 is brought to its upper travel limit. Furthermore, the three valves 12, 13 and 14 are opened so that vacuum is applied to the drill hole 5 and the vacuum grippers 8.1 to 8.4. As soon as a vacuum gripper touches the underneath of the substrate 3, a more or less well-sealed cavity is created. The pressure difference between the pressure on the upper surface of the substrate 3 (atmospheric pressure) and the pressure in the cavity underneath (vacuum) then has the effect that the substrate 3 is pressed flat against the supporting surface 2 whereby the vacuum gripper is compressed. As soon as the substrate 3 lies flat on the supporting surface 2, the cavity formed between the groove 6 and the substrate 3 is also filled with vacuum. Because of the groove 6, the substrate 3 is on the one hand sucked onto the processing location and, on the other hand, is supported on the area of the supporting surface 2 surrounding the groove 6. As soon as the process—application of adhesive or mounting or wiring the semiconductor chip—is completed, the three valves 12, 13 and 14 are closed and the lifting cylinder 10 is lowered. The working cycle is completed and the next working cycle begins.
  • In operation, it often occurs that only the two vacuum grippers [0013] 8.1 and 8.2 or only the two vacuum grippers 8.3 and 8.4 are covered by the substrate 3. Nevertheless, sufficient vacuum can be built up between the substrate 3 and the covered vacuum grippers to press the substrate 3 flat when the internal flow resistance of the valves 12, 13 and 14 is large enough. The vacuum grippers which are not covered then create a leak, but the throughput of the incoming air remains low enough and cannot decay the vacuum.
  • The three [0014] valves 12, 13 and 14 are preferably switched on and off simultaneously. However, it is also possible to open valve 14 which applies vacuum to the drill hole 5 with a slight delay.
  • Optionally, there can be a [0015] second drill hole 15 opening into the groove 6 at the other end of which a not presented sensor is arranged for measuring the vacuum. After each opening of the three valves 12, 13 and 14, the sensor checks whether or not the vacuum in the drill hole 15 or in the groove 6 reaches a predetermined value. If the substrate 3 lies flat on the supporting surface 2, the vacuum in the drill hole 15 or in the groove 6 beneath the substrate develops, the sensor responds and the process step is carried out. If the desired vacuum strength is not achieved, then an error message is produced.
  • FIG. 2 shows a schematic drawing of a further suction device with which the four vacuum grippers [0016] 8.1 to 8.4 and the drill hole 5 are connected to one single valve 12. The two vacuum grippers 8.1 and 8.2 which are arranged next to each other when viewed in transport direction 4 are connected to the valve 12 via a common flow resistance 16. The two vacuum grippers 8.3 and 8.4 which are also arranged next to each other when viewed in transport direction 4 are connected to the valve 12 via a common flow resistance 17. The drill hole 5 is connected to the valve 12 via a third flow resistance 18. The task of the flow resistors 16 to 18 is to limit the leakage rate when the corresponding vacuum grippers or the drill hole 5 are not covered so that the other covered vacuum grippers can nevertheless apply suction to the substrate 3. Such a flow resistance consists, for example, of a throat installed in the line between the vacuum gripper and the valve, the cross-section and length of which result in the desired flow resistance.
  • The design of the suction device with four vacuum grippers guarantees perfect holding of the substrate with optimum utilization of the available area and optimum adaptation to the manner in which the substrates are transported: It must namely be taken into consideration that the substrates have to be fed one after the other to the processing station and must be held there flat on the supporting surface. Instead of the circular bellow-type vacuum gripper, vacuum grippers of a different shape, eg, of a rectangular, square or eliptical shape, can also be used. [0017]

Claims (3)

1. Die Bonder or Wire Bonder with a suction device to pull flat and hold down a curved substrate at a processing station, the suction device comprising
a plate with a supporting surface for the substrate, the plate containing at least one cavity open towards the supporting surface;
a vacuum gripper made out of flexible material located in the at least one cavity;
means for raising the vacuum gripper above the level of the supporting surface to apply suction to the substrate and for lowering the vacuum gripper into the cavity during transport of the substrate.
2. Die Bonder or Wire Bonder according to claim 1, the vacuum gripper being of the bellow-type.
3. Die Bonder or Wire Bonder according to claim 1 or 2, the suction device further comprising a sensor for measuring the vacuum beneath the substrate at the processing station.
US09/732,678 1999-12-14 2000-12-08 Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate Expired - Fee Related US6435492B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH229099 1999-12-14
CH2290/99 1999-12-14
CH19992290/99 1999-12-14

Publications (2)

Publication Number Publication Date
US20020093130A1 true US20020093130A1 (en) 2002-07-18
US6435492B1 US6435492B1 (en) 2002-08-20

Family

ID=4230324

Family Applications (1)

Application Number Title Priority Date Filing Date
US09/732,678 Expired - Fee Related US6435492B1 (en) 1999-12-14 2000-12-08 Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate

Country Status (7)

Country Link
US (1) US6435492B1 (en)
KR (1) KR100655981B1 (en)
CH (1) CH695405A5 (en)
DE (1) DE10059883A1 (en)
HK (1) HK1032334A2 (en)
SG (1) SG90213A1 (en)
TW (1) TW478024B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040182912A1 (en) * 2003-03-21 2004-09-23 Esec Trading Sa Wire bonder
WO2006006509A2 (en) * 2004-07-08 2006-01-19 Matsushita Electric Industrial Co., Ltd. Substrate processing apparatus and mounter
JP2006024797A (en) * 2004-07-08 2006-01-26 Matsushita Electric Ind Co Ltd Part packaging apparatus
JP2017156525A (en) * 2016-03-01 2017-09-07 ウシオ電機株式会社 Exposure device for printed circuit board
JP2020057018A (en) * 2019-12-25 2020-04-09 株式会社アドテックエンジニアリング Exposure device for printed circuit board

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH695075A5 (en) * 2000-07-03 2005-11-30 Esec Trading Sa Pick-up tool
TW527674B (en) * 2000-12-06 2003-04-11 Esec Trading Sa Die bonder and/or wire bonder with a device for holding down a substrate
US6564979B2 (en) * 2001-07-18 2003-05-20 Micron Technology, Inc. Method and apparatus for dispensing adhesive on microelectronic substrate supports
DE10159921A1 (en) * 2001-12-06 2003-06-18 Imt Robot Ag Object grippers for automation technology
JP4312001B2 (en) * 2003-07-28 2009-08-12 リアライズ・アドバンストテクノロジ株式会社 Substrate support device and substrate removal method
US7044476B2 (en) * 2003-11-25 2006-05-16 N&K Technology, Inc. Compact pinlifter assembly integrated in wafer chuck
DE102011001879A1 (en) * 2011-04-07 2012-10-11 Jenoptik Automatisierungstechnik Gmbh Device for clamping wafer utilized in e.g. micro system technology, has suction port connected with vacuum ejector via distributor, and suction insert provided in suction port and includes resilient hollow body opened at its two sides
CN103904011B (en) * 2012-12-28 2016-12-28 上海微电子装备有限公司 Warpage silicon-chip absorption device and absorption method thereof
US9630269B2 (en) 2013-10-30 2017-04-25 Globalfoundries Inc. Mechanism to attach a die to a substrate

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE794002A (en) * 1972-01-13 1973-05-02 Coburn Optical Ind SUCTION-EFFECT GLASS HOLDER FOR OPHTHALMIC GLASS FINISHING MACHINE
US3934916A (en) * 1974-01-25 1976-01-27 Kliklok Corporation Vacuum pickup cup
FR2527124A1 (en) 1982-05-18 1983-11-25 Gerber Scient Products Inc VACUUM HOLDER
US4566170A (en) 1983-05-10 1986-01-28 Pitney Bowes Inc. Method of producing a light emiting diode array
NL8701603A (en) 1987-07-08 1989-02-01 Philips & Du Pont Optical VACUUM DEVICE FOR SECURING WORKPIECES.
JPH0831515B2 (en) * 1988-06-21 1996-03-27 株式会社ニコン Substrate suction device
JPH02105429A (en) 1988-10-13 1990-04-18 Nec Corp Lead-frame feed apparatus
EP0456426B1 (en) 1990-05-07 2004-09-15 Canon Kabushiki Kaisha Vacuum type wafer holder
US5281794A (en) 1990-05-25 1994-01-25 Kabushiki Kaisha Shinkawa Heater block for use in a bonder utilizing vacuum suction attachment means
DE4024642A1 (en) 1990-08-03 1992-02-06 Ibm SLINGER PLATE FOR SUBSTRATE
DE4129146A1 (en) 1991-09-02 1993-03-04 Siemens Nixdorf Inf Syst BAND-SHAPED AUXILIARY CARRIER AS ASSEMBLY AID FOR THE LINE-BY-LINE ASSEMBLY OF SEMICONDUCTOR CHIPS ON A MATCHING SURFACE OF A CARRIER ELEMENT AND A RELEVANT ASSEMBLY METHOD
USH1373H (en) 1992-04-06 1994-11-01 American Telephone And Telegraph Company Wafer handling apparatus and method
JPH0669254A (en) 1992-08-13 1994-03-11 Hitachi Ltd Lead-frame positioning stopper mechanism and wire bonder using the mechanism
JPH0758191A (en) 1993-08-13 1995-03-03 Toshiba Corp Wafer stage device
JP3225336B2 (en) 1995-07-13 2001-11-05 株式会社新川 Lead frame suction holding device
US5923408A (en) 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
US5937993A (en) 1997-01-14 1999-08-17 Tamarac Scientific Co., Inc. Apparatus and method for automatically handling and holding panels near and at the exact plane of exposure
US6164633A (en) * 1999-05-18 2000-12-26 International Business Machines Corporation Multiple size wafer vacuum chuck

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040182912A1 (en) * 2003-03-21 2004-09-23 Esec Trading Sa Wire bonder
WO2006006509A2 (en) * 2004-07-08 2006-01-19 Matsushita Electric Industrial Co., Ltd. Substrate processing apparatus and mounter
JP2006024797A (en) * 2004-07-08 2006-01-26 Matsushita Electric Ind Co Ltd Part packaging apparatus
WO2006006509A3 (en) * 2004-07-08 2006-12-21 Matsushita Electric Ind Co Ltd Substrate processing apparatus and mounter
US20080301932A1 (en) * 2004-07-08 2008-12-11 Takahiko Murata Substrate Processing Apparatus and Mounter
CN100546453C (en) * 2004-07-08 2009-09-30 松下电器产业株式会社 Substrate board treatment and erector
US7653989B2 (en) 2004-07-08 2010-02-02 Panasonic Corporation Substrate processing apparatus and mounter
JP4555008B2 (en) * 2004-07-08 2010-09-29 パナソニック株式会社 Component mounting equipment
JP2017156525A (en) * 2016-03-01 2017-09-07 ウシオ電機株式会社 Exposure device for printed circuit board
KR20170102431A (en) * 2016-03-01 2017-09-11 우시오덴키 가부시키가이샤 Exposing apparatus for print substrate
KR102126456B1 (en) 2016-03-01 2020-06-24 우시오덴키 가부시키가이샤 Exposing apparatus for print substrate
JP2020057018A (en) * 2019-12-25 2020-04-09 株式会社アドテックエンジニアリング Exposure device for printed circuit board

Also Published As

Publication number Publication date
KR100655981B1 (en) 2006-12-08
US6435492B1 (en) 2002-08-20
DE10059883A1 (en) 2001-09-20
KR20010062185A (en) 2001-07-07
HK1032334A2 (en) 2001-07-06
SG90213A1 (en) 2002-07-23
TW478024B (en) 2002-03-01
CH695405A5 (en) 2006-04-28

Similar Documents

Publication Publication Date Title
US6435492B1 (en) Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate
US20050205204A1 (en) Peeling device and peeling method
JP2009503880A (en) Method for transferring electronic components
JP3339354B2 (en) Single-sided molding method for chips
EP1109205A1 (en) Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate
US6632703B2 (en) Method and apparatus for positioning a semiconductor pellet
KR100325905B1 (en) Die Bonding Device
JP7293533B2 (en) Work transfer hand
JP2001203222A (en) Die bonder and/or wire bonder provided with suction apparatus drawing near and thrusting curved circuit board horizontally
KR20010063412A (en) Apparatus for bonding CSP dies
JP2648118B2 (en) Semiconductor chip pickup mechanism
KR100312743B1 (en) Semiconductor die bonder position recognizing and testing apparatus and method thereof
CN220282797U (en) Bernoulli sucker capable of preventing mutual interference
JPS6139532A (en) Bonding device
JPH0523987A (en) Electronic parts suction collet unit
JPH09289219A (en) Semiconductor chip die bonding apparatus
JP3298475B2 (en) Chip mounting method
JPH06283592A (en) Suction operation confirming equipment for semiconductor chip
JPS5933975B2 (en) Semiconductor mounted equipment
KR200221960Y1 (en) Feeding device of Lead frame for Die bonder
KR100278325B1 (en) Dispensing System with Cover Film Attachment
JPH06196515A (en) Pickup apparatus of semiconductor pellet
KR100749758B1 (en) Lid press equipment for semiconductor production
JP3479107B2 (en) Semiconductor lead frame and transport / supply device therefor
KR20100036856A (en) Multi-typed tape moving hand for semiconductor packaging process

Legal Events

Date Code Title Description
AS Assignment

Owner name: ESEC TRADING SA A CORP. OF SWITZERLAND, SWITZERL

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:BEHLER, STEFAN;SCHUBIGER, RETO;ZUMBUEHL, BEAT;REEL/FRAME:011364/0651

Effective date: 20001114

AS Assignment

Owner name: ESEC TRADING SA, SWITZERLAND

Free format text: ASSIGNMENT TO CORRECT ASSIGNEE, PREVIOUSLY RECORDED AT REEL/FRAME 011364/0651 (ASSIGNMENT OF ASSIGNOR'S INTEREST);ASSIGNORS:BEHLER, STEFAN;SCHUBIGER, RETO;ZUMBEHL, BEAT;REEL/FRAME:011666/0080

Effective date: 20001114

AS Assignment

Owner name: ESEC TRADING SA, SWITZERLAND

Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE ADDRESS, FILED 12-8-00 RECORDED ON REEL 011364, FRAME 0651;ASSIGNORS:BEHLER, STEFAN;SCHUBIGER, RETO;ZUMBEHL, BEAT;REEL/FRAME:011574/0535

Effective date: 20001114

FPAY Fee payment

Year of fee payment: 4

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Expired due to failure to pay maintenance fee

Effective date: 20100820